AMD XCKU060-1FFVA1156I
- Part No.:
- XCKU060-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU060-1FFVA1156I.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU060-1FFVA1156I from AMD is a Kintex UltraScale FPGA with 749K logic cells, 28.8 Mb of block RAM, 2,640 DSP slices, and 48 transceivers supporting up to 12.5 Gb/s. It features a 1156-pin FCBGA package with 520 user I/Os and operates at -1 speed grade (1.0 V core, industrial temperature range -40°C to +100°C). It is deployed in high-throughput packet processing systems requiring deterministic latency and multi-gigabit serial connectivity.
For engineers reviewing the XCKU060-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, available DSP resources for signal conditioning, I/O voltage compatibility (1.2V/1.35V/1.8V), thermal envelope under sustained 28W typical power, and configuration interface options (SPIx4, BPI, SelectMAP).
Technical Context
The XCKU060-1FFVA1156I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25G Ethernet MAC, DDR4 PHY), and scalable memory interfaces. Its UltraScale+ architecture uses 20nm bulk CMOS process and supports partial reconfiguration for dynamic function swapping.
Configuration is performed via master SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports dual-boot fallback and secure boot with eFUSE-based key storage for root-of-trust enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 749,000 – determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 28.8 Mb – supports large on-die buffering for video frame stores or packet queues |
| DSP Slices | 2,640 – enables parallel FIR filtering, FFT computation, or matrix multiplication at >100 GOPS |
| Transceivers | 48 × 12.5 Gb/s – provides 600 Gb/s aggregate serial bandwidth for 10G/25G interconnects |
| User I/Os | 520 – supports wide parallel buses (e.g., DDR4 x72) and mixed-voltage interface banks |
| Speed Grade | -1 – guarantees timing closure at 1.0 V core supply and industrial temperature range |
| Package | 1156-pin FCBGA (35×35 mm, 0.8 mm pitch) – requires controlled-impedance PCB stackup and thermal vias |
Pinout & Package
1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVA) package with 35×35 mm body, 0.8 mm ball pitch, and standard I/O bank arrangement. Thermal pad on underside requires solder paste stencil design per AMD UG570.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank 0 | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8V/3.3V I/O standards |
| HP[0:7][0:31] | High-performance I/O bank | Supports DDR4, QDR, and differential signaling (LVDS, TMDS) up to 1.6 Gb/s |
| GTH[0:47][TX/RX] | Multi-gigabit transceiver pair | Each pair handles full-duplex 12.5 Gb/s serial links with built-in clock data recovery |
| VRP/VRN | Reference voltage pins | Provide termination reference for differential I/O standards in adjacent HP banks |
| VCCINT | Core power supply | 1.0 V ±3% regulated supply required; decoupling must meet AMD UG570 layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol requirements |
| DDR4 Memory Controller | Supports up to 256-bit wide DDR4-2400 interfaces with ECC and write leveling calibration |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of programmed logic functionality |
| Partial Reconfiguration | Enables runtime swapping of functional modules without resetting system-level operation |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× more DSP throughput versus previous Kintex-7 generation |
Applications
| 5G Radio Unit (RU) | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time baseband processing for massive MIMO antenna arrays with sub-100 µs latency constraints. IC Role / Device Role / Timing Role: FPGA fabric executes OFDM modulation/demodulation, channel estimation, and precoding; transceivers interface directly to RFICs. Use Value: 48 × 12.5 Gb/s transceivers enable direct JESD204B/C connectivity to 64-channel RF converters without bridging. | Use Scenario: Automated test systems requiring synchronized acquisition and analysis across 32+ analog channels at 1 GS/s. IC Role / Device Role / Timing Role: Configurable logic implements real-time pattern matching, histogramming, and trigger arbitration; DDR4 controller buffers raw sample streams. Use Value: 28.8 Mb block RAM allows 128M-sample deep capture at full 1 GS/s rate before host transfer. |
| Avionics Data Concentrator | AI Edge Inference Accelerator |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B gateway consolidating sensor data across multiple aircraft subsystems. IC Role / Device Role / Timing Role: Hardened Ethernet MACs handle deterministic AFDX traffic; logic implements time-triggered scheduling and health monitoring. Use Value: PCIe Gen3 x8 interface enables low-latency streaming of consolidated data to flight control computers. | Use Scenario: Low-latency inference engine for vision-based autonomous navigation using INT8 convolutional networks. IC Role / Device Role / Timing Role: DSP slices execute quantized multiply-accumulate operations; BRAM implements weight caching and activation buffering. Use Value: 2,640 DSP slices deliver >2 TOPS INT8 performance while maintaining <500 µs end-to-end inference latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156I | 504K logic cells, 19.2 Mb BRAM, 2,016 DSP slices, 32 transceivers | Lower serial bandwidth and compute density; suitable for cost-sensitive 10G edge nodes | Select when transceiver count and DSP resource demand are ≤70% of XCKU060-1FFVA1156I requirements |
| XCKU115-2FFVA1517I | 1.09M logic cells, 42.2 Mb BRAM, 3,520 DSP slices, 64 transceivers, -2 speed grade | Higher performance envelope and thermal dissipation; requires enhanced cooling and larger PCB area | Select when system demands >1.05 TOPS INT8 or >768 Gb/s aggregate serial bandwidth |
Compared with XCKU040-1FFVA1156I and XCKU115-2FFVA1517I, the XCKU060-1FFVA1156I delivers balanced scalability-offering 48 transceivers and 2,640 DSP slices without exceeding 28W typical power or requiring 1517-ball packaging, making it optimal for space-constrained 25G/100G line cards and embedded AI accelerators.
Availability
XCKU060-1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data gateways, and high-speed test instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XCKU060-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale family targets high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and aerospace systems where performance-per-watt and deterministic timing are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU060-1FFVA1156I?
The XCKU060-1FFVA1156I supports DDR4-2400 (1200 MHz) with a 256-bit interface width. This capability is implemented via dedicated hard IP controllers that include write leveling, read leveling, and gate training to ensure signal integrity across all 256 bits. The XCKU060-1FFVA1156I's DDR4 PHY complies with JEDEC DDR4 SDRAM specifications and supports ECC for mission-critical applications.
Does XCKU060-1FFVA1156I support partial reconfiguration?
Yes, the XCKU060-1FFVA1156I fully supports partial reconfiguration through Vivado Design Suite tools. This feature allows dynamic swapping of logic modules-such as different filter banks or protocol engines-without resetting the entire device or disrupting active I/O or memory interfaces. The XCKU060-1FFVA1156I's configuration logic includes dedicated ICAP and PCAP interfaces to enable secure, low-latency bitstream loading during operation.
What transceiver protocols are natively supported by XCKU060-1FFVA1156I?
The XCKU060-1FFVA1156I transceivers natively support PCIe Gen3, 10GBASE-R, 25GBASE-R, CPRI, and JESD204B/C protocols via hardened physical coding sublayer (PCS) and physical medium attachment (PMA) blocks. These protocols are implemented without consuming programmable logic resources. The XCKU060-1FFVA1156I does not include native support for SATA or USB 3.x.
What is the industrial temperature range for XCKU060-1FFVA1156I?
The XCKU060-1FFVA1156I is rated for operation from -40°C to +100°C ambient temperature, meeting industrial-grade thermal specifications. This rating applies to the -1 speed grade variant and is validated under continuous operation at 1.0 V core supply and specified I/O voltage levels. The XCKU060-1FFVA1156I's thermal design requires adherence to AMD UG570 guidelines for PCB copper pour, thermal vias, and heatsink mounting pressure.
Can XCKU060-1FFVA1156I be configured via JTAG only?
No-while JTAG is supported for debugging and initial programming, the XCKU060-1FFVA1156I requires a primary configuration mode (e.g., master SPI, BPI, or SelectMAP) for reliable power-on initialization. JTAG alone cannot load the full bitstream into configuration memory; it serves as a secondary interface for boundary scan, debug, or partial reconfiguration updates. The XCKU060-1FFVA1156I's configuration sequence is defined in AMD UG470 and mandates proper power sequencing of VCCINT, VCCAUX, and VCCO rails.
XCKU060-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 41460
- Number of Logic Elements/Cells:
- 725550
- Total RAM Bits:
- 38912000
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU060-1FFVA1156I FAQ
1.How can I place an order for XCKU060-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU060-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU060-1FFVA1156I reliable?
The price and inventory of XCKU060-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU060-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU060-1FFVA1156I?
XCKU060-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU060-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU060-1FFVA1156I?
For technical support, including XCKU060-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU060-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU060-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU060-1FFVA1156I?
All XCKU060-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU060-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU060-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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