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AMD XCKU060-1FFVA1517C

Part No.:
XCKU060-1FFVA1517C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXCKU060-1FFVA1517C.pdf
Description:
IC FPGA 624 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,889

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Product details

Overview

XCKU060-1FFVA1517C from AMD is a Kintex UltraScale FPGA with 644,995 logic cells, 38.4 Mb of block RAM, 2,520 DSP slices, and 960 GTY transceivers supporting up to 32.75 Gb/s. It is housed in a 1517-pin FCBGA package with 0.8 mm pitch and operates at -40°C to +100°C junction temperature.

For engineers reviewing the XCKU060-1FFVA1517C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support (1.2 V/1.35 V/1.8 V), thermal design power (24.5 W typical), and configuration interface compatibility (e.g., x4 PCIe Gen3, Quad-SPI).

Technical Context

The XCKU060-1FFVA1517C implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25G Ethernet MAC, DDR4 controller), and high-speed serial transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells644,995 - determines maximum combinational and sequential logic capacity for custom RTL implementation
Block RAM38.4 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM
DSP Slices2,520 - enables parallel fixed/floating-point arithmetic for signal processing pipelines
GTY Transceivers960 - supports 16 lanes at 32.75 Gb/s each for high-bandwidth serial interconnects
I/O StandardsSSTL-15/18, HSTL-I/II, LVCMOS, LVDS, TMDS - ensures interoperability with DDR4, MIPI, HDMI, and legacy memory interfaces
Thermal Design Power24.5 W typical - defines heatsink and airflow requirements for sustained operation at full utilization

Pinout & Package

Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0V ±3% input powering FPGA fabric and CLBs; requires low-noise regulation
VCCAUXAuxiliary supply1.8V ±3% for configuration logic, transceiver analog bias, and select I/O banks
VCCO_0I/O bank supplyConfigurable 1.2/1.35/1.8V output driver voltage per bank; sets signaling standard compliance
MGTAVCCTransceiver analog supply1.0V ±3% dedicated rail for GTY PLLs and serializers/deserializers
CONFIG_IOConfiguration interfaceMulti-function pins supporting Master SPI, JTAG, or BPI for bitstream loading and debug

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x8 EndpointReduces RTL integration effort and timing closure risk for host-facing acceleration cards
DDR4 Memory Controller (up to 2400 MT/s)Enables direct connection to high-bandwidth system memory without external PHY or controller IC
Partial Reconfiguration SupportAllows dynamic logic module swapping during runtime for multi-mode or adaptive systems
AES-256 Bitstream EncryptionProtects intellectual property against physical extraction or cloning of programmed configuration
AXI4-Stream Interface IntegrationProvides standardized, ready-to-use streaming data paths between IP blocks and external interfaces

Applications

5G Wireless Baseband ProcessingHigh-Performance Computing Acceleration

Use Scenario: Real-time channel coding, beamforming, and MIMO processing in massive MIMO radio units.

IC Role / Device Role / Timing Role: Programmable baseband processor implementing LDPC/Polar decoders and FFT engines with deterministic latency.

Use Value: 2,520 DSP slices and 960 GTY transceivers enable concurrent processing of 64+ antenna streams at sub-100 µs latency.

Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, genomics alignment) from CPU to FPGA-accelerated servers.

IC Role / Device Role / Timing Role: PCIe-attached accelerator executing custom HDL kernels with direct DDR4 memory access and AXI4-Stream DMA.

Use Value: 38.4 Mb block RAM and hardened PCIe Gen3 x8 reduce off-chip memory round-trips and host interface bottlenecks.

Medical Imaging ReconstructionTest & Measurement Equipment

Use Scenario: Real-time back-projection and iterative reconstruction in PET/CT scanners requiring ultra-low latency data flow.

IC Role / Device Role / Timing Role: High-throughput data coprocessor synchronizing ADC acquisition, GPU transfer, and image reconstruction pipelines.

Use Value: 644,995 logic cells support parallelized reconstruction algorithms while GTY transceivers handle >20 Gb/s raw sensor data ingestion.

Use Scenario: Modular signal generation, analysis, and protocol validation in automated test systems with multi-standard support.

IC Role / Device Role / Timing Role: Reconfigurable platform hosting multiple instrument IP cores (e.g., arbitrary waveform generator, spectrum analyzer, USB3.0 analyzer).

Use Value: Partial reconfiguration allows field-upgradable instrument functionality without hardware replacement or downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU040-1FFVA1156CFewer logic cells (375,000), reduced GTY count (640), smaller 1156-pin FCBGA packageLimited to mid-bandwidth 5G fronthaul or single-FPGA HPC nodesSelect when target application fits within lower resource ceiling and requires lower TDP
XCKU115-2FLVD1924EHigher speed grade (-2), larger 1924-pin FCBGA, 1,112,000 logic cells, 1,200 GTY transceiversSuitable for dual-ASIC-class workloads, 400G Ethernet line cards, or radar beamformer clustersChoose for higher throughput, stricter timing margins, or future-proofing beyond current XCKU060-1FFVA1517C capacity

Compared with XCKU040-1FFVA1156C and XCKU115-2FLVD1924E, the XCKU060-1FFVA1517C delivers balanced logic density, transceiver bandwidth, and thermal envelope for mainstream high-end acceleration-avoiding overdesign cost while enabling scalable deployment across 5G, HPC, and imaging platforms.

Availability

XCKU060-1FFVA1517C is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-performance computing acceleration requiring stable component supply and long-term industrial availability.

Supply support for XCKU060-1FFVA1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.

The Kintex UltraScale family targets high-throughput, low-latency applications where programmable logic must coexist with hardened IP and high-speed serial connectivity-optimized for infrastructure acceleration and real-time signal processing.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU060-1FFVA1517C?

The XCKU060-1FFVA1517C supports GTY transceivers rated up to 32.75 Gb/s per lane. This rating is guaranteed under the -1 speed grade and specified operating conditions including junction temperature ≤100°C and proper power delivery. The XCKU060-1FFVA1517C achieves this rate using PAM4 encoding in specific configurations, and actual achievable line rates depend on PCB layout, reference clock stability, and equalization settings.

Does the XCKU060-1FFVA1517C support DDR4 memory interfaces natively?

Yes, the XCKU060-1FFVA1517C integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to 32-bit wide interfaces. It includes built-in calibration logic and supports ECC, address/command bus termination, and write leveling. The XCKU060-1FFVA1517C requires external DDR4 components and compliant layout but does not need an additional memory controller IC.

What configuration modes are supported by the XCKU060-1FFVA1517C?

The XCKU060-1FFVA1517C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is commonly used for fast, single-image boot from quad-SPI flash; JTAG enables boundary-scan testing and debug programming. The XCKU060-1FFVA1517C also supports fallback configuration and multi-boot via dedicated mode pins and internal registers.

Is bitstream encryption available on the XCKU060-1FFVA1517C?

Yes, the XCKU060-1FFVA1517C provides AES-256 bitstream encryption with HMAC authentication for secure configuration. Keys are stored in on-chip eFUSE or external flash with encrypted key storage. This feature protects the XCKU060-1FFVA1517C design IP from unauthorized readback or cloning, and is enabled during bitstream generation using Vivado tools.

What is the thermal design power (TDP) of the XCKU060-1FFVA1517C under typical operating conditions?

The XCKU060-1FFVA1517C has a typical thermal design power of 24.5 W when operating at full utilization with default voltage and frequency settings. This value assumes ambient temperature of 40°C, board-level thermal resistance of 10°C/W, and active cooling. Actual power consumption of the XCKU060-1FFVA1517C varies with design utilization, I/O activity, and transceiver usage, and may reach up to 32.1 W under worst-case corner conditions.

XCKU060-1FFVA1517C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale™
Package/Case:
1517-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
41460
Number of Logic Elements/Cells:
725550
Total RAM Bits:
38912000
Number of I/O:
624
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XCKU060-1FFVA1517C FAQ

1.How can I place an order for XCKU060-1FFVA1517C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU060-1FFVA1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU060-1FFVA1517C reliable?

The price and inventory of XCKU060-1FFVA1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-1FFVA1517C is usually 5 days.

3.What payment methods are accepted for XCKU060-1FFVA1517C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-1FFVA1517C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU060-1FFVA1517C?

XCKU060-1FFVA1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU060-1FFVA1517C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU060-1FFVA1517C?

For technical support, including XCKU060-1FFVA1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-1FFVA1517C requirements.

6.How does Aetrix verify that XCKU060-1FFVA1517C is sourced from the original manufacturer or authorized distributors?

All XCKU060-1FFVA1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-1FFVA1517C meets industry standards.

7.What is the process for return or replacement of XCKU060-1FFVA1517C?

All XCKU060-1FFVA1517C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-1FFVA1517C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU060-1FFVA1517C part is unused and in its original packaging.

Return procedure for XCKU060-1FFVA1517C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU060-1FFVA1517C Tags

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