AMD XCKU060-1FFVA1517C
- Part No.:
- XCKU060-1FFVA1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU060-1FFVA1517C.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU060-1FFVA1517C from AMD is a Kintex UltraScale FPGA with 644,995 logic cells, 38.4 Mb of block RAM, 2,520 DSP slices, and 960 GTY transceivers supporting up to 32.75 Gb/s. It is housed in a 1517-pin FCBGA package with 0.8 mm pitch and operates at -40°C to +100°C junction temperature.
For engineers reviewing the XCKU060-1FFVA1517C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support (1.2 V/1.35 V/1.8 V), thermal design power (24.5 W typical), and configuration interface compatibility (e.g., x4 PCIe Gen3, Quad-SPI).
Technical Context
The XCKU060-1FFVA1517C implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25G Ethernet MAC, DDR4 controller), and high-speed serial transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 644,995 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 38.4 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 2,520 - enables parallel fixed/floating-point arithmetic for signal processing pipelines |
| GTY Transceivers | 960 - supports 16 lanes at 32.75 Gb/s each for high-bandwidth serial interconnects |
| I/O Standards | SSTL-15/18, HSTL-I/II, LVCMOS, LVDS, TMDS - ensures interoperability with DDR4, MIPI, HDMI, and legacy memory interfaces |
| Thermal Design Power | 24.5 W typical - defines heatsink and airflow requirements for sustained operation at full utilization |
Pinout & Package
Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% input powering FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8V ±3% for configuration logic, transceiver analog bias, and select I/O banks |
| VCCO_0 | I/O bank supply | Configurable 1.2/1.35/1.8V output driver voltage per bank; sets signaling standard compliance |
| MGTAVCC | Transceiver analog supply | 1.0V ±3% dedicated rail for GTY PLLs and serializers/deserializers |
| CONFIG_IO | Configuration interface | Multi-function pins supporting Master SPI, JTAG, or BPI for bitstream loading and debug |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and timing closure risk for host-facing acceleration cards |
| DDR4 Memory Controller (up to 2400 MT/s) | Enables direct connection to high-bandwidth system memory without external PHY or controller IC |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime for multi-mode or adaptive systems |
| AES-256 Bitstream Encryption | Protects intellectual property against physical extraction or cloning of programmed configuration |
| AXI4-Stream Interface Integration | Provides standardized, ready-to-use streaming data paths between IP blocks and external interfaces |
Applications
| 5G Wireless Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time channel coding, beamforming, and MIMO processing in massive MIMO radio units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing LDPC/Polar decoders and FFT engines with deterministic latency. Use Value: 2,520 DSP slices and 960 GTY transceivers enable concurrent processing of 64+ antenna streams at sub-100 µs latency. | Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, genomics alignment) from CPU to FPGA-accelerated servers. IC Role / Device Role / Timing Role: PCIe-attached accelerator executing custom HDL kernels with direct DDR4 memory access and AXI4-Stream DMA. Use Value: 38.4 Mb block RAM and hardened PCIe Gen3 x8 reduce off-chip memory round-trips and host interface bottlenecks. |
| Medical Imaging Reconstruction | Test & Measurement Equipment |
Use Scenario: Real-time back-projection and iterative reconstruction in PET/CT scanners requiring ultra-low latency data flow. IC Role / Device Role / Timing Role: High-throughput data coprocessor synchronizing ADC acquisition, GPU transfer, and image reconstruction pipelines. Use Value: 644,995 logic cells support parallelized reconstruction algorithms while GTY transceivers handle >20 Gb/s raw sensor data ingestion. | Use Scenario: Modular signal generation, analysis, and protocol validation in automated test systems with multi-standard support. IC Role / Device Role / Timing Role: Reconfigurable platform hosting multiple instrument IP cores (e.g., arbitrary waveform generator, spectrum analyzer, USB3.0 analyzer). Use Value: Partial reconfiguration allows field-upgradable instrument functionality without hardware replacement or downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156C | Fewer logic cells (375,000), reduced GTY count (640), smaller 1156-pin FCBGA package | Limited to mid-bandwidth 5G fronthaul or single-FPGA HPC nodes | Select when target application fits within lower resource ceiling and requires lower TDP |
| XCKU115-2FLVD1924E | Higher speed grade (-2), larger 1924-pin FCBGA, 1,112,000 logic cells, 1,200 GTY transceivers | Suitable for dual-ASIC-class workloads, 400G Ethernet line cards, or radar beamformer clusters | Choose for higher throughput, stricter timing margins, or future-proofing beyond current XCKU060-1FFVA1517C capacity |
Compared with XCKU040-1FFVA1156C and XCKU115-2FLVD1924E, the XCKU060-1FFVA1517C delivers balanced logic density, transceiver bandwidth, and thermal envelope for mainstream high-end acceleration-avoiding overdesign cost while enabling scalable deployment across 5G, HPC, and imaging platforms.
Availability
XCKU060-1FFVA1517C is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-performance computing acceleration requiring stable component supply and long-term industrial availability.
Supply support for XCKU060-1FFVA1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The Kintex UltraScale family targets high-throughput, low-latency applications where programmable logic must coexist with hardened IP and high-speed serial connectivity-optimized for infrastructure acceleration and real-time signal processing.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU060-1FFVA1517C?
The XCKU060-1FFVA1517C supports GTY transceivers rated up to 32.75 Gb/s per lane. This rating is guaranteed under the -1 speed grade and specified operating conditions including junction temperature ≤100°C and proper power delivery. The XCKU060-1FFVA1517C achieves this rate using PAM4 encoding in specific configurations, and actual achievable line rates depend on PCB layout, reference clock stability, and equalization settings.
Does the XCKU060-1FFVA1517C support DDR4 memory interfaces natively?
Yes, the XCKU060-1FFVA1517C integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to 32-bit wide interfaces. It includes built-in calibration logic and supports ECC, address/command bus termination, and write leveling. The XCKU060-1FFVA1517C requires external DDR4 components and compliant layout but does not need an additional memory controller IC.
What configuration modes are supported by the XCKU060-1FFVA1517C?
The XCKU060-1FFVA1517C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is commonly used for fast, single-image boot from quad-SPI flash; JTAG enables boundary-scan testing and debug programming. The XCKU060-1FFVA1517C also supports fallback configuration and multi-boot via dedicated mode pins and internal registers.
Is bitstream encryption available on the XCKU060-1FFVA1517C?
Yes, the XCKU060-1FFVA1517C provides AES-256 bitstream encryption with HMAC authentication for secure configuration. Keys are stored in on-chip eFUSE or external flash with encrypted key storage. This feature protects the XCKU060-1FFVA1517C design IP from unauthorized readback or cloning, and is enabled during bitstream generation using Vivado tools.
What is the thermal design power (TDP) of the XCKU060-1FFVA1517C under typical operating conditions?
The XCKU060-1FFVA1517C has a typical thermal design power of 24.5 W when operating at full utilization with default voltage and frequency settings. This value assumes ambient temperature of 40°C, board-level thermal resistance of 10°C/W, and active cooling. Actual power consumption of the XCKU060-1FFVA1517C varies with design utilization, I/O activity, and transceiver usage, and may reach up to 32.1 W under worst-case corner conditions.
XCKU060-1FFVA1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 41460
- Number of Logic Elements/Cells:
- 725550
- Total RAM Bits:
- 38912000
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU060-1FFVA1517C FAQ
1.How can I place an order for XCKU060-1FFVA1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU060-1FFVA1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU060-1FFVA1517C reliable?
The price and inventory of XCKU060-1FFVA1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-1FFVA1517C is usually 5 days.
3.What payment methods are accepted for XCKU060-1FFVA1517C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-1FFVA1517C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU060-1FFVA1517C?
XCKU060-1FFVA1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU060-1FFVA1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU060-1FFVA1517C?
For technical support, including XCKU060-1FFVA1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-1FFVA1517C requirements.
6.How does Aetrix verify that XCKU060-1FFVA1517C is sourced from the original manufacturer or authorized distributors?
All XCKU060-1FFVA1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-1FFVA1517C meets industry standards.
7.What is the process for return or replacement of XCKU060-1FFVA1517C?
All XCKU060-1FFVA1517C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-1FFVA1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU060-1FFVA1517C part is unused and in its original packaging.
Return procedure for XCKU060-1FFVA1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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