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AMD XCKU060-2FFVA1517E
- Part No.:
- XCKU060-2FFVA1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU060-2FFVA1517E.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,757
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Product details
Overview
XCKU060-2FFVA1517E from AMD is a Kintex UltraScale FPGA with 591,360 logic cells, 28.4 Mb of block RAM, and 2,464 DSP slices, configured in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package for high-bandwidth data processing in 5G baseband and radar signal chain applications.
For engineers reviewing the XCKU060-2FFVA1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), transceiver line rates up to 16.3 Gbps, and -2 speed grade timing performance under industrial temperature range (-40°C to +100°C).
Technical Context
The XCKU060-2FFVA1517E implements a heterogeneous architecture with programmable logic fabric, hardened 10/25/50/100G Ethernet MACs, PCI Express Gen3 x16 endpoints, and integrated DDR4 memory controllers supporting up to 2,400 MT/s. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Its transceiver banks use multi-gigabit GTY transceivers with built-in PRBS generators/checkers and adaptive equalization, enabling compliance with CPRI, JESD204B/C, and OTU4 standards without external retimers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 591,360 - total configurable LUTs+FFs for complex digital signal processing pipelines |
| Block RAM | 28.4 Mb - supports large FIR filter coefficient storage and frame buffering |
| DSP Slices | 2,464 - enables parallel floating-point and fixed-point arithmetic for beamforming and FFT acceleration |
| Transceiver Max Rate | 16.3 Gbps - meets JESD204C lane requirements for high-resolution ADC/DAC interfacing |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows direct connection to image sensors, memory, and high-speed serial peripherals |
| Speed Grade | -2 - guarantees timing closure at 1.0 ns clock period for critical control paths |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor base station environments |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank | Configurable as SDIO, SPI, UART, or GPIO; supports 1.8 V I/O voltage for PMIC communication |
| HP[0:7][0:71] | High-Performance I/O Bank | Supports 1.2–1.8 V signaling; used for DDR4 address/control and JESD204B/C data lanes |
| GTYP/GTYN | GTY Transceiver Differential Pair | Each pair delivers 16.3 Gbps raw bandwidth; requires AC-coupling and 100 Ω differential termination |
| VCCINT | Core Power Supply | Requires regulated 0.85 V ±3% supply; decoupling with ≥12× 100 nF ceramic capacitors per bank |
| VCCAUX | Auxiliary Power Supply | Supplies configuration logic and transceiver analog circuitry at 1.8 V ±3% |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces host interface latency to <1.2 μs and eliminates need for external switch logic in data acquisition systems |
| Integrated DDR4 Memory Controller | Supports dual-channel 72-bit DDR4-2400 with ECC; enables >34 GB/s memory bandwidth for streaming radar point clouds |
| Partial Reconfiguration Support | Allows dynamic swapping of beamformer IP blocks without system reset, reducing downtime in phased-array radar updates |
| AXI4-Stream Interconnect | Provides zero-latency, flow-controlled data movement between IP cores, essential for real-time video analytics pipelines |
| UltraScale+ SelectIO Technology | Enables simultaneous operation across 1.2 V, 1.35 V, and 1.8 V I/O standards on adjacent pins for mixed-voltage board design |
Applications
| 5G Massive MIMO Baseband | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time precoding and channel estimation in 64T64R active antenna systems. IC Role / Device Role / Timing Role: FPGA fabric executes LTE/NR Layer 1 PHY algorithms; GTY transceivers handle CPRI/eCPRI fronthaul links. Use Value: 591K logic cells enable concurrent execution of multiple numerology-based OFDM symbol processors with deterministic sub-μs latency. | Use Scenario: Pulse-Doppler processing and synthetic aperture generation in airborne SAR platforms. IC Role / Device Role / Timing Role: XCKU060-2FFVA1517E serves as the real-time signal processor, interfacing directly with 12-bit 2.5 GSPS ADCs via JESD204C. Use Value: 2,464 DSP slices deliver 128 GFLOPS peak throughput for matched filtering and STAP, meeting SWaP-C constraints. |
| High-Resolution Medical Imaging | Test & Measurement Instrumentation |
Use Scenario: Ultrasound beamforming with 256-channel receive paths and real-time harmonic imaging. IC Role / Device Role / Timing Role: Configurable logic implements delay-and-sum beamformer; HP I/O drives LVDS echo digitizer interfaces. Use Value: Block RAM capacity stores 16k-sample channel calibration tables per beam, enabling sub-microsecond recalibration cycles. | Use Scenario: Modular oscilloscope front-end with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: XCKU060-2FFVA1517E manages high-speed ADC capture, on-the-fly spectral analysis, and PCIe Gen3 data streaming to host PC. Use Value: Hardened PCIe endpoint ensures sustained 7.8 GB/s transfer rate, eliminating DMA bottlenecks during long waveform captures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Fewer logic cells (375K), reduced block RAM (19.2 Mb), same -2 speed grade and FFVA package footprint | Suitable for mid-tier 5G small cells and compact radar modules where full XCKU060 resources are unused | Select when BOM cost sensitivity outweighs future scalability needs and design fits within 65% resource utilization |
| XCKU115-2FLVD1924E | Higher logic count (1,024K), larger 1924-pin FLVD package, 20% higher power consumption at full load | Required for full 256-antenna massive MIMO or multi-band radar fusion where XCKU060 reaches resource limits | Choose when algorithm complexity exceeds XCKU060-2FFVA1517E capacity, especially with concurrent AI inference and signal processing |
Compared with XCKU040-2FFVA1156E, the XCKU060-2FFVA1517E delivers 57% more logic and 48% more block RAM in the same board area; versus XCKU115-2FLVD1924E, it offers lower static power and smaller PCB footprint while maintaining compatibility with industrial thermal management solutions.
Availability
XCKU060-2FFVA1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU060-2FFVA1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex UltraScale family targets high-throughput, low-latency signal processing applications where performance-per-watt and integration density are critical, such as wireless infrastructure and real-time imaging.
FAQ
What is the maximum supported DDR4 memory speed for the XCKU060-2FFVA1517E?
The XCKU060-2FFVA1517E integrates a hardened DDR4 memory controller supporting data rates up to 2,400 MT/s across dual-channel 72-bit interfaces with ECC. This capability is verified in UG576 v1.14 and enables sustained memory bandwidth exceeding 34 GB/s for streaming workloads in radar and 5G baseband applications using the XCKU060-2FFVA1517E.
Does the XCKU060-2FFVA1517E support JESD204C protocol natively?
Yes, the XCKU060-2FFVA1517E GTY transceivers support JESD204C at lane rates up to 16.3 Gbps with built-in 64b/66b encoding, SYNC~ handshaking, and subclass 1 deterministic latency. This native support is documented in UG578 v1.12 and allows direct interfacing with next-generation RF-sampling ADCs/DACs without protocol translation logic in the XCKU060-2FFVA1517E design.
What is the industrial temperature rating for the XCKU060-2FFVA1517E?
The XCKU060-2FFVA1517E is rated for operation from -40°C to +100°C ambient temperature, qualified per AMD's industrial-grade specifications. This rating applies to the full device functionality including transceivers, memory controllers, and logic fabric, making the XCKU060-2FFVA1517E suitable for outdoor 5G base stations and avionics environments without derating.
Can the XCKU060-2FFVA1517E perform partial reconfiguration in-system?
Yes, the XCKU060-2FFVA1517E supports dynamic partial reconfiguration (PR) through its ICAP and PCIe interfaces, allowing bitstream segments to be loaded into designated logic regions without resetting the entire device. This capability is validated in UG909 v2023.2 and enables field-upgradable radar beamformer configurations in the XCKU060-2FFVA1517E without service interruption.
What I/O standards are supported by the HP I/O banks of the XCKU060-2FFVA1517E?
The HP I/O banks of the XCKU060-2FFVA1517E support LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards with programmable output drive strength and input termination. These capabilities are specified in DS892 v2.12 and allow the XCKU060-2FFVA1517E to interface directly with DDR4 memory, high-speed ADCs, and image sensors without level-shifting components.
XCKU060-2FFVA1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 41460
- Number of Logic Elements/Cells:
- 725550
- Total RAM Bits:
- 38912000
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU060-2FFVA1517E FAQ
1.How can I place an order for XCKU060-2FFVA1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU060-2FFVA1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU060-2FFVA1517E reliable?
The price and inventory of XCKU060-2FFVA1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-2FFVA1517E is usually 5 days.
3.What payment methods are accepted for XCKU060-2FFVA1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-2FFVA1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU060-2FFVA1517E?
XCKU060-2FFVA1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU060-2FFVA1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU060-2FFVA1517E?
For technical support, including XCKU060-2FFVA1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-2FFVA1517E requirements.
6.How does Aetrix verify that XCKU060-2FFVA1517E is sourced from the original manufacturer or authorized distributors?
All XCKU060-2FFVA1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-2FFVA1517E meets industry standards.
7.What is the process for return or replacement of XCKU060-2FFVA1517E?
All XCKU060-2FFVA1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-2FFVA1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU060-2FFVA1517E part is unused and in its original packaging.
Return procedure for XCKU060-2FFVA1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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