AMD XCKU060-2FFVA1517I

Overview

XCKU060-2FFVA1517I from AMD is a Kintex UltraScale FPGA featuring 590,400 logic cells, 2,400 DSP slices, and 32.1 Mb of block RAM. It supports up to 48 GTY transceivers operating at 32.75 Gb/s, and is packaged in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch. It targets high-bandwidth data processing in 5G wireless infrastructure baseband units.

For engineers reviewing the XCKU060-2FFVA1517I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell count, I/O voltage support (1.2 V/1.35 V/1.8 V), thermal performance under sustained 28 W TDP, and configuration interface compatibility (SPIx4, BPI, SelectMAP).

Technical Context

The XCKU060-2FFVA1517I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 controller), and high-speed serial transceivers. Its UltraScale architecture uses 20 nm HKMG process technology and supports partial reconfiguration for dynamic function swapping.

It delivers deterministic timing closure via clock routing networks with low-skew global and regional buffers, and supports multi-voltage I/O banks enabling mixed-signal interfacing with ADCs, DACs, and SERDES PHYs across 1.2 V to 1.8 V domains.

Key Specifications

Pinout & Package

Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU040-2FFVA1156I and XCKU115-2FLVD1924I, the XCKU060-2FFVA1517I delivers optimal balance of transceiver count, logic resources, and thermal envelope for 100G-class 5G and radar systems-avoiding under-design or over-engineering trade-offs.

Availability

XCKU060-2FFVA1517I is available at Aetrix Electronics and suitable for 5G wireless infrastructure, high-speed test instrumentation, and defense radar systems requiring stable component supply across extended production lifecycles.

Supply support for XCKU060-2FFVA1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.

The Kintex UltraScale family targets high-throughput, low-latency signal processing in communications infrastructure and real-time embedded systems where bandwidth, determinism, and reconfigurability are critical.

FAQ

What is the maximum supported data rate per GTY transceiver in the XCKU060-2FFVA1517I?

The XCKU060-2FFVA1517I supports up to 32.75 Gb/s per GTY transceiver lane, validated per UG578 v1.13. This rate enables native 100G Ethernet (4×25G), CPRI Option 10, and JESD204C 8-lane configurations. The transceivers include built-in PRBS generators, eye monitors, and adaptive equalization for reliable high-speed links.

Does the XCKU060-2FFVA1517I support DDR4 memory interfaces?

Yes, the XCKU060-2FFVA1517I integrates a hardened DDR4 memory controller supporting dual-channel 2400 MT/s operation with on-die termination and ECC. It directly drives up to 16 DDR4 chips across two 72-bit interfaces (64-bit data + 8-bit ECC), eliminating external memory controller ICs and reducing PCB layer count in baseband designs.

What configuration modes does the XCKU060-2FFVA1517I support?

The XCKU060-2FFVA1517I supports SPIx4, BPI, and SelectMAP configuration modes. SPIx4 is most common for compact flash-based boot; BPI suits parallel NOR flash; SelectMAP enables host processor-driven configuration. All modes support fallback and multi-bitstream selection via mode pins and internal registers.

Is partial reconfiguration supported on the XCKU060-2FFVA1517I?

Yes, the XCKU060-2FFVA1517I fully supports partial reconfiguration using Vivado Design Suite v2022.2+. This capability allows dynamic swapping of logic regions-such as DPD coefficient sets or radar waveform engines-without resetting the entire device or halting I/O operations, essential for adaptive 5G and cognitive radar applications.

What is the thermal design power (TDP) of the XCKU060-2FFVA1517I under typical 5G baseband workload?

The XCKU060-2FFVA1517I has a specified TDP of 28 W under worst-case 5G massive MIMO processing conditions (full GTY utilization, 400 MHz fabric clock, all DSP slices active). Thermal solution design must maintain junction temperature ≤100°C using forced-air cooling and 2-layer thermal vias under the thermal lid per UG578 guidelines.