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AMD XCKU060-3FFVA1156E

Part No.:
XCKU060-3FFVA1156E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXCKU060-3FFVA1156E.pdf
Description:
IC FPGA 520 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,811

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Product details

Overview

XCKU060-3FFVA1156E from AMD (formerly Xilinx) is a high-performance Kintex UltraScale FPGA featuring 749,000 logic cells, 38,400 DSP slices, and 42.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 16.3 Gb/s transceivers. Used in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU060-3FFVA1156E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support, thermal envelope, and configuration interface compatibility with Vivado design tools.

Technical Context

The XCKU060-3FFVA1156E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe, memory controllers, and multi-gigabit transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration and AXI4 interconnect protocols.

Configuration occurs via Master SPI or BPI mode using dedicated CONFIG pins; startup sequence includes bitstream authentication and CRC verification. Power delivery requires separate VCCINT, VCCAUX, VCCO, and VRP/VRN supply domains per I/O bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells749,000 - total configurable LUTs + flip-flops for logic implementation
DSP Slices38,400 - fixed-point multiply-accumulate units supporting 27×18-bit operations
Block RAM42.5 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO
Transceiver Speed16.3 Gb/s - maximum line rate per GTY transceiver channel, supporting PAM4 in some configurations
PCIe InterfaceGen3 x16 - hard IP block with integrated PHY and DMA controller, no soft-core overhead
DDR SupportDDR4-2400 - native memory controller supporting 16-bit/32-bit interfaces with ECC capability
I/O StandardsLVDS, SSTL, HSTL, TMDS - 24 I/O banks with independent VCCO per bank (1.2–1.8 V)

Pinout & Package

Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationSelect boot source (SPI/BPI/JTAG) and configuration mode during power-up
CCLKConfiguration ClockInput clock for master SPI configuration; frequency ≤ 100 MHz
DONEConfiguration StatusOpen-drain output indicating successful bitstream loading and initialization
INIT_BConfiguration InitializationActive-low open-drain signal asserting reset during configuration failure or reconfiguration
PROGRAM_BConfiguration ResetActive-low input to initiate full reconfiguration and clear internal state
VRP/VRNReference VoltageDifferential reference pair for I/O banks supporting SSTL/HSTL standards

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x16 BlockReduces integration effort and latency vs. soft IP; supports SR-IOV and ATS
UltraScale+ SelectIO TechnologyEnables mixed-voltage I/O operation across 24 banks with per-bank VCCO control
Integrated Memory ControllerSupports DDR4-2400 with on-die termination and write-leveling calibration
GTY Transceivers16.3 Gb/s serial links with built-in PRBS generation/checking and eye scan
Partial Reconfiguration SupportAllows dynamic module swapping without system reset; verified in Vivado 2022.2+ toolflow

Applications

5G Wireless Baseband ProcessingHigh-Performance Computing Acceleration

Use Scenario: Real-time FFT, channel estimation, and LDPC decoding in massive MIMO radio units.

IC Role / Device Role / Timing Role: Primary compute engine implementing layered protocol stack functions with deterministic latency.

Use Value: GTY transceivers interface directly to RFICs at 12.2 Gb/s; DSP slices execute 1024-point FFT in <1 µs.

Use Scenario: Offloading matrix multiplication and sparse tensor operations from CPU/GPU hosts.

IC Role / Device Role / Timing Role: Co-processor with AXI4-Stream interfaces to host memory and PCIe Gen3 x16 upstream link.

Use Value: 38,400 DSP slices deliver >10 TFLOPS INT8 throughput; DDR4-2400 provides 19.2 GB/s memory bandwidth.

Medical Imaging ReconstructionTest & Measurement Equipment

Use Scenario: Real-time back-projection and iterative reconstruction in PET/CT scanners.

IC Role / Device Role / Timing Role: High-throughput data path manager between ADC front-end, GPU co-processor, and storage subsystem.

Use Value: 42.5 Mb block RAM buffers multi-gigabyte sinogram datasets; PCIe Gen3 x16 enables 16 GT/s host transfer.

Use Scenario: Protocol-aware packet generation, analysis, and error injection in 100G Ethernet test platforms.

IC Role / Device Role / Timing Role: Deterministic timing core synchronizing multi-lane SerDes, memory, and trigger logic.

Use Value: GTY transceivers support IEEE 802.3bj CAUI-4; 16.3 Gb/s rate matches 100G KR4 electrical interface.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU085-2FLVA1517IHigher logic density (1.1M LC), faster speed grade (-2), larger package (1517-pin FCBGA)Required for designs needing >749K LC or tighter timing closure at 300+ MHzSelect when additional DSP slices or transceiver count justifies cost and board space increase
XCKU115-2FLVD1924E1.38M logic cells, 60 GTY transceivers, -2 speed grade, 1924-pin FLVD packageSuitable for multi-protocol aggregation (PCIe + 100G Ethernet + CPRI) in single deviceChoose when system-level I/O count and transceiver lane count exceed XCKU060-3FFVA1156E capacity

Compared with XCKU060-3FFVA1156E, the XCKU085-2FLVA1517I offers higher performance headroom but increases PCB layer count and thermal management complexity; the XCKU115-2FLVD1924E delivers greater protocol concurrency at the cost of significantly higher power and footprint.

Availability

XCKU060-3FFVA1156E is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-speed test equipment requiring stable component supply and long-term program support.

Supply support for XCKU060-3FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex UltraScale family targets high-throughput, low-latency applications where performance-per-watt and I/O flexibility are critical, such as wireless infrastructure and real-time analytics.

FAQ

What is the maximum supported DDR4 data rate for XCKU060-3FFVA1156E?

The XCKU060-3FFVA1156E supports DDR4 memory interfaces up to 2400 Mbps (1200 MHz clock). This rate is validated with specific Micron and Samsung DDR4 components using the integrated memory controller and requires board-level impedance control and write-leveling calibration. The XCKU060-3FFVA1156E memory controller does not support DDR5 or LPDDR4.

Does XCKU060-3FFVA1156E support partial reconfiguration?

Yes, XCKU060-3FFVA1156E supports partial reconfiguration through Vivado Design Suite 2021.2 and later. This capability allows dynamic replacement of logical modules without resetting the entire device. The XCKU060-3FFVA1156E requires dedicated configuration port access and adheres to frame-based update boundaries defined in UG570.

What configuration modes are supported by XCKU060-3FFVA1156E?

XCKU060-3FFVA1156E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XCKU060-3FFVA1156E does not support Quad-SPI or OSPI configuration natively; those require external controller bridging.

What is the operating temperature range for XCKU060-3FFVA1156E?

The XCKU060-3FFVA1156E is rated for commercial temperature range (0 °C to +85 °C ambient) as indicated by the "E" suffix. It is not qualified for industrial (–40 °C to +100 °C) or extended temperature operation. Thermal design must maintain junction temperature below 100 °C under worst-case power conditions.

How many GTY transceivers does XCKU060-3FFVA1156E include?

XCKU060-3FFVA1156E includes 32 GTY transceiver quads, totaling 128 transceiver lanes. Each GTY channel operates up to 16.3 Gb/s and supports protocols including PCIe Gen3, 10/25/100G Ethernet, and CPRI. The XCKU060-3FFVA1156E transceiver placement is fixed per package pinout and cannot be remapped.

XCKU060-3FFVA1156E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale™
Package/Case:
1156-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
41460
Number of Logic Elements/Cells:
725550
Total RAM Bits:
38912000
Number of I/O:
520
Number of Gates:
-
Voltage - Supply:
0.970V ~ 1.030V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XCKU060-3FFVA1156E FAQ

1.How can I place an order for XCKU060-3FFVA1156E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU060-3FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU060-3FFVA1156E reliable?

The price and inventory of XCKU060-3FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-3FFVA1156E is usually 5 days.

3.What payment methods are accepted for XCKU060-3FFVA1156E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-3FFVA1156E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU060-3FFVA1156E?

XCKU060-3FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU060-3FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU060-3FFVA1156E?

For technical support, including XCKU060-3FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-3FFVA1156E requirements.

6.How does Aetrix verify that XCKU060-3FFVA1156E is sourced from the original manufacturer or authorized distributors?

All XCKU060-3FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-3FFVA1156E meets industry standards.

7.What is the process for return or replacement of XCKU060-3FFVA1156E?

All XCKU060-3FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-3FFVA1156E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU060-3FFVA1156E part is unused and in its original packaging.

Return procedure for XCKU060-3FFVA1156E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU060-3FFVA1156E Tags

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