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AMD XCKU060-3FFVA1517E

Part No.:
XCKU060-3FFVA1517E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXCKU060-3FFVA1517E.pdf
Description:
IC FPGA 624 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,001

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Product details

Overview

XCKU060-3FFVA1517E from AMD is a Kintex UltraScale FPGA featuring 590,400 logic cells, 2,850 DSP slices, and 32.1 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU060-3FFVA1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (856), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FFVA1517 package, and configuration interface compatibility (e.g., SPIx4, BPI).

Technical Context

The XCKU060-3FFVA1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, 10/25G Ethernet MACs, and integrated memory controllers for DDR4/LPDDR4. It uses 20nm bulk CMOS process technology and supports partial reconfiguration.

Configuration is performed via master SPI, slave parallel, or JTAG, with bitstream encryption and HMAC authentication enabled. The device includes dedicated clock management tiles (CMT) with PLLs and MMCMs supporting jitter attenuation and phase alignment across multiple clock domains.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells590,400 - determines maximum combinational and sequential logic capacity for custom RTL implementation
DSP Slices2,850 - enables high-throughput fixed/floating-point arithmetic for radar, AI inference, or video encoding
Block RAM32.1 Mb - provides on-chip memory for buffering, FIFOs, or lookup tables without external memory latency
I/O Count856 - supports wide parallel buses, high-pin-count interfaces, or multi-protocol I/O banking
Transceiver Max Rate16.3 Gb/s - enables 10G/25G Ethernet, CPRI, or JESD204B interface implementation
Speed Grade-3 - guarantees timing closure at highest operating frequency under industrial temperature conditions
PackageFFVA1517 - 1517-ball flip-chip FCBGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity

Pinout & Package

The XCKU060-3FFVA1517E is housed in a 1517-ball flip-chip FCBGA (Fine-Pitch Ball Grid Array) package with 0.8 mm ball pitch, designed for high-density PCB layouts and efficient thermal transfer via thermal balls and exposed die paddle.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply railSupplies 0.85 V ±3% to FPGA logic fabric; requires low-noise, high-current regulation
VCCAUXAuxiliary supply railProvides 1.8 V to configuration, clocking, and transceiver reference circuitry
MGTAVCCTransceiver analog supplyDelivers 0.95 V to high-speed serial transceiver analog circuitry; sensitive to ripple
CONFIG_M[2:0]Configuration mode selectDetermines boot source (SPI, BPI, JTAG) and data width during power-up initialization
INIT_BConfiguration status indicatorActive-low open-drain signal indicating bitstream loading progress and CRC pass/fail
PROGRAM_BConfiguration reset controlActive-low input that clears configuration memory and initiates reconfiguration sequence

Key Features

FeatureDesign Value
PCIe Gen3 x16 Hard IPReduces integration effort and resource usage for host interface design; supports endpoint and root complex modes
DDR4 Memory ControllerEnables direct connection to DDR4-2400 modules with ECC support, eliminating need for external memory controller IC
UltraScale+ SelectIO TechnologySupports 1.8 V, 1.5 V, 1.35 V, and 1.2 V I/O standards with programmable slew rate and drive strength per bank
Partial ReconfigurationAllows dynamic update of logic regions without disrupting system operation-critical for adaptive computing and runtime protocol switching
Bitstream Encryption & AuthenticationProtects intellectual property using AES-256 encryption and HMAC-SHA-256 authentication during configuration

Applications

5G Wireless Baseband ProcessingRadar Signal Processing

Use Scenario: Real-time beamforming, channel estimation, and massive MIMO precoding in active antenna systems.

IC Role / Device Role / Timing Role: Primary compute accelerator handling L1/L2 PHY layer processing with deterministic latency.

Use Value: 2,850 DSP slices and 16.3 Gb/s transceivers enable concurrent processing of 64+ antenna streams at sub-100 µs latency.

Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne platforms.

IC Role / Device Role / Timing Role: High-throughput digital backend performing FFT, filtering, and matrix operations on ADC sample streams.

Use Value: 32.1 Mb block RAM buffers full chirp sequences while 590,400 logic cells implement pipelined FFT engines at 1 GHz clock domain.

High-Performance Computing AccelerationIndustrial Vision Inspection

Use Scenario: Offloading compute-intensive kernels (e.g., convolution, reduction) from CPU/GPU in edge inference servers.

IC Role / Device Role / Timing Role: Co-processor interfacing via PCIe Gen3 x16, executing custom neural network layers with low-latency memory access.

Use Value: Hardened PCIe root port ensures <1.5 µs host-to-device transaction latency; DDR4-2400 controller sustains >38 GB/s memory bandwidth.

Use Scenario: Real-time defect classification on high-resolution (20+ MP) camera feeds in semiconductor wafer inspection tools.

IC Role / Device Role / Timing Role: Image preprocessing pipeline (demosaic, noise reduction, feature extraction) before ML inference stage.

Use Value: SelectIO banks configured for MIPI CSI-2 D-PHY v1.2 support 2.5 Gbps per lane; 856 I/Os route parallel sensor outputs and control signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU040-2FFVA1156IFewer logic cells (375,000), reduced DSP slices (1,920), smaller FFVA1156 package (1156-ball)Limited to mid-bandwidth 5G fronthaul or single-sensor vision systemsSelect when cost, power, or board space constraints outweigh peak throughput needs
XCKU115-2FLVD1924IHigher logic density (1,085,000 cells), more DSP slices (5,520), larger FLVD1924 package (1924-ball)Suitable for full-stack 5G gNodeB or multi-radar fusion systems requiring >2× compute headroomChoose when scaling beyond XCKU060-3FFVA1517E capacity or needing additional transceivers

Compared with XCKU040-2FFVA1156I and XCKU115-2FLVD1924I, the XCKU060-3FFVA1517E delivers balanced compute density, I/O count, and transceiver bandwidth for mainstream high-end acceleration-avoiding overdesign while meeting demanding real-time latency and throughput targets.

Availability

XCKU060-3FFVA1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and industrial vision inspection requiring stable component supply across extended product lifecycles.

Supply support for XCKU060-3FFVA1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale family targets high-throughput, low-latency applications where performance-per-watt and integration of hardened IP (PCIe, memory controllers, transceivers) are critical design requirements.

FAQ

What is the maximum supported DDR4 data rate for the XCKU060-3FFVA1517E?

The XCKU060-3FFVA1517E supports DDR4 memory interfaces up to 2400 MT/s with built-in memory controller hard IP. This capability enables direct connection to standard DDR4 UDIMMs or RDIMMs without external PHY, reducing system complexity and latency. The controller includes calibration logic, error correction, and configurable burst lengths. XCKU060-3FFVA1517E achieves this performance within its specified industrial temperature range and -3 speed grade timing budget.

Does the XCKU060-3FFVA1517E support partial reconfiguration?

Yes, the XCKU060-3FFVA1517E supports partial reconfiguration through its UltraScale architecture and Vivado design tools. This allows dynamic swapping of logic modules during operation without resetting the entire device. Use cases include protocol adaptation, firmware updates, or workload-specific accelerator loading. XCKU060-3FFVA1517E requires specific floorplanning and checkpoint-based bitstream generation to ensure timing and connectivity integrity across reconfigurable partitions.

What configuration modes are supported by the XCKU060-3FFVA1517E?

The XCKU060-3FFVA1517E supports master SPI, slave parallel, and JTAG configuration modes. Mode selection is controlled by CONFIG_M[2:0] pins at power-up. Master SPI is commonly used for compact flash storage; slave parallel enables fast loading from parallel NOR/NAND; JTAG supports debugging and programming during development. XCKU060-3FFVA1517E also supports dual-boot and fallback mechanisms for field-upgradable systems.

What is the transceiver line rate capability of the XCKU060-3FFVA1517E?

The XCKU060-3FFVA1517E transceivers support a maximum line rate of 16.3 Gb/s per lane, compliant with protocols including PCIe Gen3, 10G/25G Ethernet, and JESD204B. This performance is guaranteed under industrial temperature conditions and -3 speed grade. XCKU060-3FFVA1517E includes built-in PRBS generators/checkers, eye diagram monitors, and adaptive equalization to maintain signal integrity across backplanes and cables.

Is bitstream encryption available on the XCKU060-3FFVA1517E?

Yes, the XCKU060-3FFVA1517E supports AES-256 bitstream encryption and HMAC-SHA-256 authentication to protect FPGA configuration data. Keys are stored in on-chip battery-backed RAM or eFUSE, and decryption occurs in hardware during configuration. This prevents reverse engineering and unauthorized cloning. XCKU060-3FFVA1517E requires proper key provisioning flow and secure programming setup to activate these features.

XCKU060-3FFVA1517E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale™
Package/Case:
1517-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
41460
Number of Logic Elements/Cells:
725550
Total RAM Bits:
38912000
Number of I/O:
624
Number of Gates:
-
Voltage - Supply:
0.970V ~ 1.030V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XCKU060-3FFVA1517E FAQ

1.How can I place an order for XCKU060-3FFVA1517E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU060-3FFVA1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU060-3FFVA1517E reliable?

The price and inventory of XCKU060-3FFVA1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU060-3FFVA1517E is usually 5 days.

3.What payment methods are accepted for XCKU060-3FFVA1517E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU060-3FFVA1517E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU060-3FFVA1517E?

XCKU060-3FFVA1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU060-3FFVA1517E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU060-3FFVA1517E?

For technical support, including XCKU060-3FFVA1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU060-3FFVA1517E requirements.

6.How does Aetrix verify that XCKU060-3FFVA1517E is sourced from the original manufacturer or authorized distributors?

All XCKU060-3FFVA1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU060-3FFVA1517E meets industry standards.

7.What is the process for return or replacement of XCKU060-3FFVA1517E?

All XCKU060-3FFVA1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU060-3FFVA1517E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU060-3FFVA1517E part is unused and in its original packaging.

Return procedure for XCKU060-3FFVA1517E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU060-3FFVA1517E Tags

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