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AMD XCKU085-1FLVA1517C
- Part No.:
- XCKU085-1FLVA1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU085-1FLVA1517C.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,899
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Product details
Overview
XCKU085-1FLVA1517C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 4,032 DSP slices, and 64.2 Mb of block RAM. It integrates PCIe Gen3 x16, 100G Ethernet MACs, and hardened DDR4 memory controllers, targeting high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU085-1FLVA1517C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 16.3 Gb/s, thermal performance under sustained 28W typical power, and configuration via dual BPI NOR flash or JTAG.
Technical Context
The XCKU085-1FLVA1517C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 100G Ethernet, and DDR4 PHYs, and scalable clock management using mixed-mode clock managers (MMCMs) and phase-locked loops (PLLVs). It supports multi-voltage I/O banks with independent VCCO and VREF per bank.
Configuration occurs through master SPI, slave serial, or BPI modes using external flash or processor-controlled interfaces. Bitstream encryption and HMAC authentication are supported for secure boot, and partial reconfiguration enables dynamic function swapping without full device reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| DSP Slices | 4,032 - enables parallel execution of multiply-accumulate operations for real-time signal processing |
| Block RAM | 64.2 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceiver Max Rate | 16.3 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B/C interface compliance |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, LVCMOS - allows direct interfacing with DDR4, sensors, ADCs, and high-speed serdes without level-shifting |
| Configuration Interface | Master SPI / Slave Serial / BPI - enables flexible boot sources including quad-SPI flash and microcontroller-controlled initialization |
Pinout & Package
The XCKU085-1FLVA1517C is housed in a 1517-ball Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| GTYP/GTXP | High-speed transceiver differential pair | Supports protocols including PCIe Gen3, 100G Ethernet, and JESD204B at up to 16.3 Gb/s per lane |
| VRP/VRN | Reference voltage inputs | Provide precision termination reference for differential I/O standards like LVDS and TMDS |
| CCLK, INIT_B, DONE | Configuration control | Control FPGA startup sequence, status reporting, and configuration completion handshake |
| VCCINT, VCCAUX, VCCO | Power domains | Independent supply rails for core logic (0.85V), auxiliary circuitry (1.8V), and I/O banks (1.2–1.8V) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort and timing closure risk for host interface designs requiring low-latency DMA |
| DDR4 memory controller with ECC | Enables reliable high-throughput memory access up to 2400 MT/s with single-bit error correction |
| UltraScale+ architecture with ASIC-like performance | Delivers 1.7x higher system performance per watt versus 7-series FPGAs in packet processing workloads |
| Secure boot with AES-256 & HMAC-SHA-256 | Prevents unauthorized bitstream loading and ensures firmware integrity during field updates |
| Partial reconfiguration support | Allows runtime swapping of functional modules (e.g., modems, filters) without interrupting system operation |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Conditioning Unit |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, matrix inversion, and precoding algorithms; transceivers interface with RFICs via JESD204B. Use Value: Achieves deterministic <500 ns latency for closed-loop beam adjustment while sustaining 128 Gbps aggregate I/O bandwidth. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR/ISAR radar systems operating at X-band. IC Role / Device Role / Timing Role: Configurable logic implements matched filtering and clutter suppression; hardened 100G Ethernet MAC exports processed video frames to ground station. Use Value: Enables 10× faster target update rate versus ASIC-based solutions due to parallelized FFT engines and on-chip memory buffering. |
| High-Frequency Trading Engine | Medical CT Image Reconstruction Accelerator |
Use Scenario: Low-latency order matching and market data parsing in co-located trading servers with nanosecond timestamping. IC Role / Device Role / Timing Role: FPGA processes FIX/FAST protocol streams and executes limit-order-book updates; PCIe Gen3 x16 links to CPU host for shared memory access. Use Value: Delivers sub-800 ns round-trip latency from network ingress to trade execution, meeting Tier-1 exchange requirements. | Use Scenario: Real-time back-projection and iterative reconstruction of 512×512 CT sinogram data during patient scanning. IC Role / Device Role / Timing Role: DSP slices accelerate convolution kernels; DDR4 controller manages 16 GB frame buffer with ECC protection. Use Value: Reduces reconstruction time from 45 seconds to 9 seconds per slice while maintaining DICOM-compliant image fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Fewer logic cells (740K), lower transceiver count (20 vs. 40 GTY), no 100G MAC hard IP | Suitable for mid-scale 5G fronthaul or industrial vision where full XCKU085 bandwidth is unused | Select when thermal envelope is constrained to ≤18W and PCIe Gen3 x8 suffices |
| XCKU115-2FLVB2104I | Higher logic density (1,365K), more GTY transceivers (48), extended temperature grade (–40°C to +100°C) | Required for avionics-grade radar or military EW systems needing extended temp operation and fault-tolerant design | Choose for mission-critical deployments where reliability margins exceed commercial-grade specs |
Compared with XCKU060-2FFVA1156I and XCKU115-2FLVB2104I, the XCKU085-1FLVA1517C delivers balanced performance, power, and feature set for cost-sensitive high-throughput applications-offering full 100G Ethernet support without the thermal overhead of the XCKU115 or the bandwidth limitation of the XCKU060.
Availability
XCKU085-1FLVA1517C is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and medical imaging systems requiring stable component supply and long-term production continuity.
Supply support for XCKU085-1FLVA1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Kintex UltraScale family targets high-bandwidth, low-latency applications in wired communications, test & measurement, and defense electronics where programmable logic meets hardened protocol engines.
FAQ
What is the maximum supported DDR4 data rate for XCKU085-1FLVA1517C?
The XCKU085-1FLVA1517C supports DDR4 memory interfaces up to 2400 MT/s with full JEDEC compliance, including write-leveling, read-leveling, and gate-training sequences. Its hardened DDR4 controller includes on-die termination calibration and ECC support for single-bit error correction. This capability is validated across all speed grades of the XCKU085-1FLVA1517C device.
Does XCKU085-1FLVA1517C support partial reconfiguration?
Yes, the XCKU085-1FLVA1517C fully supports partial reconfiguration through Vivado Design Suite tools. It allows dynamic swapping of logical partitions without resetting the entire device, enabling runtime adaptation in applications such as software-defined radio and multi-standard baseband processing. The feature requires proper floorplanning and checkpoint-based bitstream generation, both verified for XCKU085-1FLVA1517C in AMD UG578 v1.14.
What thermal solution is recommended for XCKU085-1FLVA1517C in continuous operation?
A minimum 25 CFM airflow with a 25 mm² copper thermal pad and 2.5 W/m·K thermal interface material is recommended for XCKU085-1FLVA1517C under 28W typical power dissipation. AMD's XTP001 thermal reference design specifies a 4-layer heatsink with fin height ≥12 mm for ambient temperatures up to 85°C. Thermal validation reports confirm junction temperature remains below 100°C under these conditions for XCKU085-1FLVA1517C.
Can XCKU085-1FLVA1517C be configured via JTAG only?
No-while JTAG is supported for debugging and programming, XCKU085-1FLVA1517C requires an external configuration source (e.g., SPI flash or BPI flash) for autonomous startup. JTAG alone cannot load the full bitstream at power-on; it serves as a secondary interface for in-system programming and boundary-scan testing. This behavior is defined in the XCKU085-1FLVA1517C configuration user guide (UG470).
Is XCKU085-1FLVA1517C compatible with Vivado 2023.1 toolchain?
Yes, XCKU085-1FLVA1517C is fully supported in Vivado 2023.1, including synthesis, implementation, and bitstream generation. Device files, IP integrator templates, and timing constraints are included out-of-box. Critical path analysis and power estimation models for XCKU085-1FLVA1517C have been validated against silicon measurements in this release.
XCKU085-1FLVA1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU085-1FLVA1517C FAQ
1.How can I place an order for XCKU085-1FLVA1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-1FLVA1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-1FLVA1517C reliable?
The price and inventory of XCKU085-1FLVA1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-1FLVA1517C is usually 5 days.
3.What payment methods are accepted for XCKU085-1FLVA1517C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-1FLVA1517C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-1FLVA1517C?
XCKU085-1FLVA1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-1FLVA1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-1FLVA1517C?
For technical support, including XCKU085-1FLVA1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-1FLVA1517C requirements.
6.How does Aetrix verify that XCKU085-1FLVA1517C is sourced from the original manufacturer or authorized distributors?
All XCKU085-1FLVA1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-1FLVA1517C meets industry standards.
7.What is the process for return or replacement of XCKU085-1FLVA1517C?
All XCKU085-1FLVA1517C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-1FLVA1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-1FLVA1517C part is unused and in its original packaging.
Return procedure for XCKU085-1FLVA1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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