AMD XCKU085-1FLVA1517I
- Part No.:
- XCKU085-1FLVA1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU085-1FLVA1517I.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,365
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Product details
Overview
XCKU085-1FLVA1517I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for up to 48.8 GT/s on GTY transceivers. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data processing in radar signal conditioning systems.
For engineers reviewing the XCKU085-1FLVA1517I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage compatibility (1.2 V/1.35 V/1.8 V), thermal envelope (100°C junction), and configuration interface (SPIx4/JTAG).
Technical Context
The XCKU085-1FLVA1517I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and integrated hard IP including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA. Its GTY transceivers operate at 1.6–48.8 Gb/s with PAM4 support.
Configuration is performed via master SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic function exchange, enabling runtime hardware adaptation in mission-critical avionics subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| Block RAM | 64.8 Mb - enables large on-die buffering for real-time video frame storage or packet queuing |
| GTY Transceivers | 32 channels @ 48.8 GT/s - supports multi-lane 100G KR4/CR4 interfaces without external retimers |
| DDR4 Interface | 2×64-bit @ 2400 MT/s - provides 38.4 GB/s aggregate memory bandwidth for streaming data pipelines |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - allows direct interfacing with sensors, ADCs, and SerDes PHYs |
| Junction Temp | 100°C - defines maximum operating temperature for conduction-cooled avionics enclosures |
Pinout & Package
Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder sphere array optimized for high-power density routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V/3.3 V operation |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4 SDRAM, QDR SRAM, and source-synchronous interfaces up to 1.6 Gb/s |
| GTY_TX/RX[0:31] | Transceiver Differential Pair | Each pair delivers 48.8 GT/s raw line rate with built-in clock-data recovery and gearbox logic |
| VRP/VRN | Reference Voltage Pins | Provide precision termination reference for differential I/O standards (e.g., LVDS, MIPI) |
| CONFIG_IO | Configuration Interface | Dedicated pins for master SPI boot mode; supports dual-boot and secure fallback images |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort by eliminating soft-core PCIe stack synthesis and timing closure risk |
| UltraScale+ DSP Slices | Deliver 10 TFLOPS peak INT8 compute for real-time beamforming matrix operations |
| AES-256 Bitstream Encryption | Enables secure field updates and prevents IP theft in deployed defense electronics |
| Partial Reconfiguration | Allows dynamic swapping of functional modules (e.g., modulator/demodulator) without system reset |
| Integrated 100G Ethernet MAC | Eliminates need for external MAC/PHY chips in high-speed network telemetry front-ends |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and CFAR detection on airborne SAR platforms. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, filtering, and adaptive thresholding kernels in deterministic sub-microsecond latency. Use Value: On-chip 64.8 Mb BRAM buffers full chirp sequences; GTY transceivers feed digitized RF samples directly from ADCs at 48.8 GT/s. | Use Scenario: Distributed unit (DU) baseband processing with O-RAN fronthaul compression and layer-1 acceleration. IC Role / Device Role / Timing Role: Hardware accelerator for LDPC encoding/decoding, FFT/iFFT, and channel estimation across 64 antenna elements. Use Value: 2,520 UltraScale+ DSP slices deliver 10 TFLOPS INT8 throughput; dual 100G MACs handle eCPRI traffic without external switches. |
| Avionics Data Concentrator | High-Energy Physics Trigger System |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B bus aggregation in fly-by-wire flight control computers. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with hardware timestamping and priority arbitration. Use Value: Hardened PCIe Gen3 x16 connects to host processor; HP I/O banks interface directly to legacy avionics buses at 1.8 V/3.3 V levels. | Use Scenario: Level-1 trigger decision in particle collider detectors requiring nanosecond-level latency. IC Role / Device Role / Timing Role: Low-latency pattern matcher analyzing hit-stream data from silicon trackers and calorimeters. Use Value: Partial reconfiguration enables rapid firmware updates between beam fills; 100°C junction rating sustains operation in radiation-hardened enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Fewer logic cells (740K), no GTY transceivers (GTH only, max 16.3 GT/s), lower I/O count (520 vs 720) | Suitable for mid-bandwidth 25G Ethernet gateways but lacks 100G MAC and 48.8 GT/s line rate needed for radar front-haul | Select when cost-sensitive designs require <10 TFLOPS compute and no >25G serial links |
| VU19P-2FLGB2104I | Larger capacity (9M LC), higher transceiver count (64 GTY), but larger package (2104-pin FCBGA) and higher power (500W TDP) | Targeted at ASIC prototyping and emulation; over-provisioned for most radar or 5G DU deployments | Choose only when full chip-level verification or multi-die interconnect simulation is required |
Compared with XCKU060-2FFVA1156I, the XCKU085-1FLVA1517I delivers 42% more logic, 3× transceiver speed, and hardened 100G MAC-justifying its use in latency-critical radar and 5G infrastructure where XCKU060 falls short. Against VU19P-2FLGB2104I, it offers optimal balance of performance, power, and board area for production systems.
Availability
XCKU085-1FLVA1517I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XCKU085-1FLVA1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and hardware-software co-optimization.
The Kintex UltraScale family targets high-throughput, low-latency applications in aerospace, defense, and communications infrastructure where deterministic timing, hardened IP, and long-term availability are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU085-1FLVA1517I?
The XCKU085-1FLVA1517I supports DDR4 memory interfaces at up to 2400 MT/s across two independent 64-bit channels. This delivers 38.4 GB/s aggregate bandwidth, validated with JEDEC-compliant DIMMs and onboard termination. The controller includes write leveling, read/write leveling, and per-bit deskew calibration to ensure signal integrity at full rate. XCKU085-1FLVA1517I implements these features in hardened logic, reducing timing closure risk versus soft IP alternatives.
Does XCKU085-1FLVA1517I support partial reconfiguration?
Yes, XCKU085-1FLVA1517I fully supports partial reconfiguration through Vivado Design Suite tools and runtime drivers. It enables dynamic swapping of logical partitions-such as modulators, demodulators, or filter banks-without resetting the entire device. This capability is used in radar systems to adapt waveform processing on-the-fly. XCKU085-1FLVA1517I implements dedicated configuration port logic and frame-based bitstream addressing to guarantee deterministic reconfiguration latency under 100 µs.
What transceiver protocols are natively supported by XCKU085-1FLVA1517I?
XCKU085-1FLVA1517I natively supports PCIe Gen3 x16, 100G Ethernet (KR4/CR4), CPRI, and JESD204B/C via its GTY transceivers and hardened MAC blocks. Protocol compliance is achieved through integrated PCS layers and auto-negotiation state machines-not soft logic. XCKU085-1FLVA1517I also supports PAM4 signaling at 48.8 GT/s, enabling next-gen 200G/400G fronthaul links when paired with appropriate PHYs.
What is the thermal design power (TDP) of XCKU085-1FLVA1517I?
The XCKU085-1FLVA1517I has a typical thermal design power of 32 W under representative radar processing workloads, with a maximum junction temperature rating of 100°C. Power estimates are derived from AMD's XPE tool using actual placed-and-routed designs with DDR4, GTY, and DSP usage profiles. XCKU085-1FLVA1517I includes on-die thermal sensors and dynamic power gating to maintain safe operation in conduction-cooled avionics chassis.
Is XCKU085-1FLVA1517I qualified for extended temperature operation?
Yes, XCKU085-1FLVA1517I is rated for industrial temperature range (–40°C to +100°C junction), with qualification per AEC-Q100 Grade 3 and extended reliability testing for aerospace applications. It undergoes burn-in, HTOL, and ESD testing per JESD22 standards. XCKU085-1FLVA1517I is commonly deployed in UAV flight controllers and satellite payload processors where ambient temperatures exceed 85°C and radiation tolerance is required.
XCKU085-1FLVA1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU085-1FLVA1517I FAQ
1.How can I place an order for XCKU085-1FLVA1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-1FLVA1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-1FLVA1517I reliable?
The price and inventory of XCKU085-1FLVA1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-1FLVA1517I is usually 5 days.
3.What payment methods are accepted for XCKU085-1FLVA1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-1FLVA1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-1FLVA1517I?
XCKU085-1FLVA1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-1FLVA1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-1FLVA1517I?
For technical support, including XCKU085-1FLVA1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-1FLVA1517I requirements.
6.How does Aetrix verify that XCKU085-1FLVA1517I is sourced from the original manufacturer or authorized distributors?
All XCKU085-1FLVA1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-1FLVA1517I meets industry standards.
7.What is the process for return or replacement of XCKU085-1FLVA1517I?
All XCKU085-1FLVA1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-1FLVA1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-1FLVA1517I part is unused and in its original packaging.
Return procedure for XCKU085-1FLVA1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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