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AMD XCKU085-1FLVB1760C
- Part No.:
- XCKU085-1FLVB1760C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU085-1FLVB1760C.pdf
- Description:
- IC FPGA 676 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,971
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Product details
Overview
XCKU085-1FLVB1760C from AMD is a Kintex UltraScale FPGA featuring 1,053K logic cells, 4,032 DSP slices, and 64.2 Mb of block RAM. It integrates PCIe Gen3 x16, 24x 16.3 Gb/s transceivers, and hardened DDR4 memory controllers for high-bandwidth data processing in reconfigurable acceleration platforms.
For engineers reviewing the XCKU085-1FLVB1760C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope (1760-pin flip-chip BGA), and configuration interface compatibility with SPIx4 or BPI.
Technical Context
The XCKU085-1FLVB1760C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, DDR4 PHY, 10/25G Ethernet MAC), and clock management tiles supporting multi-phase PLLs and MMCMs. It supports partial reconfiguration and AXI4-Stream interconnects for dynamic system adaptation.
Configuration occurs via Master SPI or BPI mode using external flash; bitstream security includes AES-256 encryption and HMAC authentication. Power delivery requires separate VCCINT (0.85V), VCCAUX (1.8V), and VCCO (1.2–1.8V) rails per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 4,032 - enables parallel multiply-accumulate operations at up to 1.3 GHz for signal processing |
| Block RAM | 64.2 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| Transceivers | 24 × 16.3 Gb/s - supports protocols including PCIe Gen3, 10G/25G Ethernet, and CPRI |
| I/O Pins | 652 user-configurable - supports LVDS, SSTL, HSTL, and MIPI with per-bank voltage control |
| Memory Interface | DDR4-2400 controller - drives up to 4 banks of DDR4 with 64-bit width and ECC support |
| PCIe Interface | Gen3 x16 root port or endpoint - enables direct host CPU coherency via CXL-compatible AXI4 interconnect |
Pinout & Package
Package: 1760-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85V ±3% rail powering logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V rail for configuration logic, clock management, and transceiver analog circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8V supply for Bank 0 I/Os; sets signaling standard compatibility |
| M0–M2 | Mode pins | Define configuration mode (SPI/BPI/JTAG) at power-on reset; pulled internally |
| INIT_B | Configuration status | Open-drain output indicating bitstream load success/failure; active-low |
| CLK_IN | Primary clock input | Dedicated differential input for system clock feeding MMCM/PLL clock networks |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for runtime protocol adaptation |
| Hardened PCIe Gen3 x16 | Reduces RTL overhead and timing closure effort versus soft IP; supports SR-IOV virtualization |
| AXI4-Stream Interconnect | Provides standardized, flow-controlled data movement between IP blocks without custom handshaking |
| AES-256 Bitstream Encryption | Protects intellectual property against physical bitstream extraction during configuration or operation |
| Multi-Rail I/O Banking | Allows concurrent use of different I/O standards (e.g., LVDS + SSTL) on adjacent banks without level-shifting |
Applications
| 5G Wireless Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Configurable baseband processor handling layer-1 PHY functions with deterministic latency under 5 µs. Use Value: 24× 16.3 Gb/s transceivers interface directly with RFICs; DSP slices execute beamforming algorithms at 2.4 TOPS/W. | Use Scenario: Offloading matrix multiplication and sparse tensor operations from CPU/GPU in AI training clusters. IC Role / Device Role / Timing Role: Reconfigurable accelerator tightly coupled to host via PCIe Gen3 x16 and coherent AXI4 interconnect. Use Value: 64.2 Mb block RAM reduces off-chip memory access; hardened DDR4 controller sustains 38.4 GB/s memory bandwidth. |
| Avionics Data Concentrator Unit | Test & Measurement High-Speed Digitizer |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and AFDX traffic in flight control systems with DO-254 compliance. IC Role / Device Role / Timing Role: Deterministic I/O hub with time-triggered scheduling and dual-lockstep monitoring logic. Use Value: Multi-rail I/O banking isolates mixed-voltage protocols; configuration security meets ED-80/DO-326A requirements. | Use Scenario: Capturing and preprocessing >1 GS/s analog waveforms in automated test equipment with real-time FFT. IC Role / Device Role / Timing Role: High-speed acquisition engine synchronizing ADCs, buffering samples, and executing spectral analysis. Use Value: 16.3 Gb/s transceivers link to JESD204B ADCs; DSP slices perform 4,096-point FFT in <100 ns latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Higher logic density (1,375K cells), 32× 16.3 Gb/s transceivers, larger 1924-pin FCBGA package | Required for designs needing >1.2M LUTs or >28 transceivers; higher thermal and PCB routing complexity | Select when XCKU085-1FLVB1760C resource utilization exceeds 90% across multiple critical partitions |
| XCKU060-1FFVA1156C | Fewer logic cells (747K), 16× 16.3 Gb/s transceivers, smaller 1156-pin FCBGA, lower power envelope | Suitable for cost-sensitive edge inference or mid-tier radar processing where transceiver count < 20 | Choose XCKU085-1FLVB1760C over XCKU060-1FFVA1156C when PCIe Gen3 x16 host interface and ≥24 transceivers are mandatory |
Compared with XCKU115-2FLVD1924E, the XCKU085-1FLVB1760C delivers optimal balance of transceiver count, logic capacity, and thermal footprint for 5G and HPC edge deployments; versus XCKU060-1FFVA1156C, it adds 40% more DSP slices and full x16 PCIe Gen3 support without increasing board area beyond 1760-pin constraints.
Availability
XCKU085-1FLVB1760C is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XCKU085-1FLVB1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies with leadership in FPGA, GPU, and CPU design.
The Kintex UltraScale family targets high-throughput, low-latency applications in wired/wireless communications, test equipment, and aerospace systems where performance-per-watt and I/O flexibility are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU085-1FLVB1760C?
The XCKU085-1FLVB1760C integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to four 16-bit memory banks. This controller includes on-die termination, write leveling, and ECC support, and is validated for JEDEC-compliant DDR4-2400 UDIMMs and RDIMMs. The XCKU085-1FLVB1760C achieves sustained 38.4 GB/s aggregate bandwidth when fully populated with 64-bit wide DDR4 interfaces.
Does XCKU085-1FLVB1760C support partial reconfiguration?
Yes, the XCKU085-1FLVB1760C fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules while the rest of the design remains operational-enabling runtime protocol switching in 5G baseband or adaptive filtering in radar systems. The XCKU085-1FLVB1760C implements dedicated configuration ports and frame-based update mechanisms compliant with IEEE 1687.
What configuration modes are supported by XCKU085-1FLVB1760C?
The XCKU085-1FLVB1760C supports Master SPI (x1/x2/x4), Slave SelectMAP (BPI), JTAG, and eFUSE-based configuration. Mode selection is controlled by M0–M2 pins at power-on reset. Configuration bitstreams can be encrypted using AES-256 and authenticated via HMAC-SHA-256, ensuring secure boot integrity for the XCKU085-1FLVB1760C in regulated environments.
What is the operating temperature range for XCKU085-1FLVB1760C?
The XCKU085-1FLVB1760C is rated for commercial temperature operation (0°C to +85°C case temperature) per its -1 speed grade and C suffix. Thermal management must maintain junction temperature below 100°C under full static and dynamic loading. The XCKU085-1FLVB1760C's 1760-pin FCBGA package includes an integrated thermal lid to enhance heat dissipation in conduction-cooled systems.
How many PCIe Gen3 lanes does XCKU085-1FLVB1760C support?
The XCKU085-1FLVB1760C integrates a single hardened PCIe Gen3 block configurable as either a x16 root complex or endpoint. It supports all Gen3 features including ASPM L0s/L1, ECRC, and SR-IOV, and can be partitioned into smaller widths (x1/x2/x4/x8) via Vivado IP integrator. This PCIe Gen3 capability is fixed hardware-not synthesizable-and is fully accessible in the XCKU085-1FLVB1760C without consuming logic resources.
XCKU085-1FLVB1760C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU085-1FLVB1760C FAQ
1.How can I place an order for XCKU085-1FLVB1760C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-1FLVB1760C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-1FLVB1760C reliable?
The price and inventory of XCKU085-1FLVB1760C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-1FLVB1760C is usually 5 days.
3.What payment methods are accepted for XCKU085-1FLVB1760C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-1FLVB1760C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-1FLVB1760C?
XCKU085-1FLVB1760C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-1FLVB1760C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-1FLVB1760C?
For technical support, including XCKU085-1FLVB1760C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-1FLVB1760C requirements.
6.How does Aetrix verify that XCKU085-1FLVB1760C is sourced from the original manufacturer or authorized distributors?
All XCKU085-1FLVB1760C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-1FLVB1760C meets industry standards.
7.What is the process for return or replacement of XCKU085-1FLVB1760C?
All XCKU085-1FLVB1760C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-1FLVB1760C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-1FLVB1760C part is unused and in its original packaging.
Return procedure for XCKU085-1FLVB1760C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU085-1FLVB1760C Tags
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