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AMD XCKU085-1FLVB1760I
- Part No.:
- XCKU085-1FLVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU085-1FLVB1760I.pdf
- Description:
- IC FPGA 676 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,726
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Product details
Overview
XCKU085-1FLVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and 3,360 DSP slices; supports up to 28.8 Gb/s GTY transceivers and operates at -1 speed grade for industrial temperature range (-40°C to +100°C); used in high-bandwidth data processing systems such as 100G/400G optical transport and radar signal processing.
For engineers reviewing the XCKU085-1FLVB1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal performance under sustained DSP load, and configuration interface compatibility with JTAG and SelectMAP.
Technical Context
The XCKU085-1FLVB1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers. It supports dual-boot configuration via Quad-SPI and fallback recovery.
Configuration occurs through Master SPI, Slave SelectMAP, or JTAG; I/O banks are partitioned into HR (1.8V/1.5V/1.35V/1.25V) and HP (1.8V/1.5V/1.35V) types with independent VCCO and VREF per bank. The device uses 2.5V VCCAUX and 1.8V VCCINT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 64.8 Mb - enables large on-chip buffering for packet processing or video frame storage |
| DSP Slices | 3,360 - supports parallel multiply-accumulate operations for real-time filtering or beamforming |
| GTY Transceivers | 32 channels @ 28.8 Gb/s - delivers full-duplex 400G Ethernet over 8 lanes or 100G over 2 lanes |
| I/O Standards | HR/HP banks supporting LVDS, SSTL, HSTL, MIPI, and sub-1.0V interfaces - enables direct connection to DDR4, CMOS image sensors, and SerDes PHYs |
| Speed Grade | -1 - guarantees timing closure at industrial temperature with 10% derating margin for clock routing |
| Operating Temp | -40°C to +100°C - qualified for deployment in sealed industrial enclosures without forced airflow |
Pinout & Package
This device is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; shared with PS peripherals in Zynq UltraScale+ MPSoC mode |
| MRCC/NRCC | Multi-Gigabit Transceiver Clock Input | Accepts differential reference clocks for GTY transceivers; supports 10 MHz–750 MHz range with jitter tolerance ≤1.5 ps RMS |
| VRP/VRN | Reference Voltage Inputs | Provide termination reference for differential I/O standards (e.g., LVDS, TMDS); must be decoupled with 100 nF near each pair |
| PROGRAM_B | Configuration Initiation | Active-Low asynchronous reset that clears configuration memory and restarts boot sequence on falling edge |
| INIT_B | Configuration Status | Open-drain output indicating configuration progress; pulled high externally, goes low during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables time-multiplexed routing and hierarchical clocking for predictable timing convergence in multi-clock domain designs |
| Hardened PCIe Gen3 x16 Block | Reduces RTL integration effort and eliminates need for external switch logic in host-facing acceleration cards |
| DDR4 Memory Controller | Supports 2400 MT/s with ECC and address/command bus deskew - eliminates external memory PHY in base station baseband units |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without system reset - critical for adaptive radio or protocol-agnostic test equipment |
| System Monitor (XADC) | Provides real-time die temperature and supply voltage telemetry with ±5°C accuracy - enables closed-loop thermal throttling in fanless deployments |
Applications
| 5G Massive MIMO Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming coefficient calculation and precoding across 64 antenna elements using massive parallelism. IC Role / Device Role / Timing Role: Primary compute engine executing custom FFT, matrix inversion, and channel estimation kernels with deterministic latency. Use Value: Delivers >90% utilization of 3,360 DSP slices at 300 MHz, enabling sub-100 µs latency for closed-loop feedback. | Use Scenario: Protocol-aware pattern generation and error detection for PCIe Gen4/USB3.2 compliance testing. IC Role / Device Role / Timing Role: Programmable protocol analyzer and stimulus generator synchronized to 16 GHz sampling clocks. Use Value: Leverages 28.8 Gb/s GTY transceivers in PRBS31 loopback mode with <0.1 dB insertion loss variation across 32 lanes. |
| Avionics Data Concentrator | Medical Imaging Pipeline Accelerator |
Use Scenario: Aggregation and time-stamping of ARINC 429, AFDX, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: Deterministic I/O hub with hardware timestamping and fault-tolerant redundancy management. Use Value: Achieves <50 ns timestamp resolution using dedicated clock routing and internal delay-locked loops. | Use Scenario: Real-time reconstruction of CT/MRI raw data using iterative algorithms before GPU transfer. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive back-projection and denoising kernels from host CPU. Use Value: Reduces reconstruction latency by 6.8× versus software-only execution using 64.8 Mb on-chip RAM as scratchpad buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU085-2FLVB1760E | Higher speed grade (-2) with 15% faster static timing closure; same logic count and transceiver count but requires tighter power delivery and thermal design | Targeted at commercial temperature range (0°C to +85°C) only; not qualified for industrial ambient | Select when design requires maximum clock frequency margin and operates in climate-controlled environments |
| XCKU115-1FLVD1924I | 2.2M logic cells, 84.5 Mb BRAM, 5,520 DSP slices; larger FCBGA-1924 package with additional I/O banks and GTY lanes | Suitable for next-generation 800G optical line cards and AI inference accelerators requiring higher resource density | Choose when XCKU085-1FLVB1760I resources are insufficient and board layout allows larger footprint |
Compared with XCKU085-2FLVB1760E, the XCKU085-1FLVB1760I offers verified industrial temperature operation at lower power and relaxed PCB stack-up requirements; versus XCKU115-1FLVD1924I, it provides identical architecture with reduced cost, area, and thermal envelope for mid-tier bandwidth applications.
Availability
XCKU085-1FLVB1760I is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data concentrators, and medical imaging pipeline acceleration requiring stable component supply across extended product lifecycles.
Supply support for XCKU085-1FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Kintex UltraScale family targets high-throughput, low-latency applications where programmable logic density, transceiver bandwidth, and hardened IP integration are critical - especially in communications infrastructure and real-time signal processing.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU085-1FLVB1760I?
The XCKU085-1FLVB1760I supports GTY transceivers operating at up to 28.8 Gb/s per lane. This rate is validated across all 32 GTY channels under industrial temperature conditions and with proper reference clock jitter (<1.5 ps RMS). The XCKU085-1FLVB1760I achieves this performance using adaptive equalization and continuous-time linear equalization (CTLE) circuitry integrated into each transceiver.
Does the XCKU085-1FLVB1760I support partial reconfiguration?
Yes, the XCKU085-1FLVB1760I fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules without resetting the entire device or interrupting active I/O operations. The XCKU085-1FLVB1760I implements dedicated configuration access ports (CAPs) and frame-based bitstream addressing to ensure safe, atomic reconfiguration of designated regions.
What I/O standards are supported by the HR and HP banks on the XCKU085-1FLVB1760I?
The XCKU085-1FLVB1760I HR banks support 1.8V/1.5V/1.35V/1.25V I/O standards including SSTL, HSTL, and MIPI D-PHY; HP banks support 1.8V/1.5V/1.35V standards such as LVCMOS, LVDS, and RSDS. Each bank has independent VCCO and VREF controls, allowing mixed-voltage operation across the same device. The XCKU085-1FLVB1760I does not support 3.3V I/O in any bank.
Is the XCKU085-1FLVB1760I compatible with the Xilinx Vivado toolchain?
Yes, the XCKU085-1FLVB1760I is fully supported in AMD Vivado Design Suite versions 2022.1 and later. Synthesis, implementation, and bitstream generation workflows are validated for this part, including timing analysis for -1 speed grade and industrial temperature constraints. The XCKU085-1FLVB1760I requires the Kintex UltraScale device definition files included in the Vivado installation.
What thermal management provisions are recommended for the XCKU085-1FLVB1760I in continuous operation?
For continuous operation at full resource utilization, AMD recommends a 4-layer PCB with internal copper planes, thermal vias under the package, and a heatsink rated for ≥15 W dissipation. The XCKU085-1FLVB1760I thermal lid supports mechanical attachment; junction-to-case resistance is 0.35°C/W. The XCKU085-1FLVB1760I integrates a System Monitor (XADC) for real-time die temperature monitoring to enable dynamic thermal throttling.
XCKU085-1FLVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU085-1FLVB1760I FAQ
1.How can I place an order for XCKU085-1FLVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-1FLVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-1FLVB1760I reliable?
The price and inventory of XCKU085-1FLVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-1FLVB1760I is usually 5 days.
3.What payment methods are accepted for XCKU085-1FLVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-1FLVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-1FLVB1760I?
XCKU085-1FLVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-1FLVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-1FLVB1760I?
For technical support, including XCKU085-1FLVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-1FLVB1760I requirements.
6.How does Aetrix verify that XCKU085-1FLVB1760I is sourced from the original manufacturer or authorized distributors?
All XCKU085-1FLVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-1FLVB1760I meets industry standards.
7.What is the process for return or replacement of XCKU085-1FLVB1760I?
All XCKU085-1FLVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-1FLVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-1FLVB1760I part is unused and in its original packaging.
Return procedure for XCKU085-1FLVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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