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AMD XCKU085-1FLVF1924C
- Part No.:
- XCKU085-1FLVF1924C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU085-1FLVF1924C.pdf
- Description:
- IC FPGA 624 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,114
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Product details
Overview
XCKU085-1FLVF1924C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 63,400 DSP slices, and 42.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -1 speed grade (1.0 GHz system clock capability) in a 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It is deployed in 5G radio unit baseband processing and high-throughput data acceleration systems.
For engineers reviewing the XCKU085-1FLVF1924C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), transceiver line rates up to 16.3 Gb/s, thermal design power (TDP) of 37 W, and compliance with JESD78 Class II latch-up immunity.
Technical Context
The XCKU085-1FLVF1924C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, and multi-rate GTY transceivers. It integrates 24 GTY transceiver quads supporting protocols including CPRI, eCPRI, and 10/25/100GbE.
Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in telecom and compute-acceleration workloads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for complex RTL implementations |
| DSP Slices | 63,400 - enables high-throughput fixed/floating-point arithmetic for signal processing pipelines |
| Block RAM | 42.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 24 quads (96 lanes) - supports 16.3 Gb/s serial links for CPRI/eCPRI and 100GbE interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing with DDR4, ADCs, DACs, and sensors |
| Speed Grade | -1 - guarantees timing closure at 1.0 GHz system clock frequency under industrial temperature conditions |
| TDP | 37 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
Pinout & Package
Package: 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; shared with PS configuration interface |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4-2400, 1.2–1.8 V signaling, and source-synchronous interfaces |
| HR[0:47] | High-Range I/O Bank | Supports 1.2–3.3 V I/O standards including LVCMOS33 for legacy peripheral interfacing |
| GTY_TX/RX[0:95] | Transceiver Lane | Each pair supports 10–16.3 Gb/s; grouped in quads with shared reference clocks and power rails |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate 0.85 V core, 1.8 V auxiliary, and bank-specific I/O supply domains for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Root Port | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| UltraScale+ SelectIO Technology | Enables simultaneous multi-standard I/O operation across HP and HR banks with independent voltage control |
| AES-256 + HMAC-SHA-256 Bitstream Encryption | Protects intellectual property against cloning and unauthorized configuration replay attacks |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions during operation for adaptive radio or compute workloads |
| Integrated System Monitor (XADC) | Provides real-time die temperature, supply voltage, and current sensing without external sensors |
Applications
| 5G Massive MIMO Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and OFDM modulation/demodulation in 5G NR macro cell radios. IC Role / Device Role / Timing Role: Primary baseband processor handling Layer 1 PHY functions with deterministic low-latency pipeline execution. Use Value: 63,400 DSP slices and 1,053K logic cells enable concurrent processing of 64+ antenna streams at sub-100 ns latency. | Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, FFT) from CPU/GPU in financial analytics or genomics pipelines. IC Role / Device Role / Timing Role: Co-processor implementing custom dataflow engines with tightly coupled DDR4-2400 memory access. Use Value: 42.5 Mb block RAM and 24 GTY quads allow sustained 100+ GB/s memory bandwidth and PCIe Gen3 x16 host interconnect. |
| Avionics Data Concentration Unit | Test & Measurement High-Speed Digitizer |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and AFDX traffic in next-generation flight control systems. IC Role / Device Role / Timing Role: Deterministic protocol bridge with time-triggered scheduling and hardware-based packet filtering. Use Value: JESD78 Class II latch-up immunity and -40°C to +100°C operating range ensure reliability in avionics environmental stress. | Use Scenario: Capturing and preprocessing >1 GS/s analog waveforms with real-time spectral analysis and trigger generation. IC Role / Device Role / Timing Role: Real-time signal conditioning engine synchronizing ADC sampling, digital down-conversion, and histogram accumulation. Use Value: GTY transceivers configured as JESD204B receivers deliver 16.3 Gb/s serialized data from multi-channel ADCs directly into block RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Fewer logic cells (740K), lower DSP count (40,320), smaller 1156-pin FC-BGA package, -2 speed grade | Better suited for cost-sensitive 4G/LTE baseband or mid-tier test equipment where 16.3 Gb/s transceivers are not required | Select when TDP budget is <25 W and PCIe Gen3 x8 suffices |
| XCKU115-2FLVD1924I | Higher logic density (1,370K), same 1924-pin package, -2 speed grade, higher TDP (48 W) | Targeted at AI inference acceleration and radar signal processing demanding >100 TOPS-equivalent throughput | Choose when additional DSP slices and block RAM are needed for larger algorithm footprints |
Compared with XCKU085-1FLVF1924C, the XCKU060-2FFVA1156I reduces cost and power at the expense of transceiver count and memory bandwidth, while the XCKU115-2FLVD1924I increases computational headroom at higher thermal and layout complexity.
Availability
XCKU085-1FLVF1924C is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace data concentrators, and high-speed test instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XCKU085-1FLVF1924C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex UltraScale family targets high-throughput, low-latency applications in wireless infrastructure, defense systems, and high-end instrumentation where balanced logic, memory, and I/O resources are critical.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU085-1FLVF1924C?
The XCKU085-1FLVF1924C supports DDR4-2400 (1200 MHz clock) interfaces across its HP I/O banks. This is validated per UG571 and implemented using dedicated memory controller IP with write-leveling and read-leveling calibration. The XCKU085-1FLVF1924C achieves this speed with 16-bit or 32-bit bus widths and supports up to eight banks per controller instance.
Does the XCKU085-1FLVF1924C include hardened Ethernet MAC blocks?
No, the XCKU085-1FLVF1924C does not integrate hardened Ethernet MACs. It provides GTY transceivers and clocking resources that support 10/25/100GbE physical layer implementation via soft IP or third-party cores. The XCKU085-1FLVF1924C relies on programmable logic for MAC functionality, enabling protocol flexibility but requiring additional logic resources compared to devices with hardened MACs.
What configuration modes are supported by the XCKU085-1FLVF1924C?
The XCKU085-1FLVF1924C supports master SPI, slave SPI, BPI, JTAG, and PCIe configuration modes. Quad-SPI is the most common for production deployment due to fast boot times and single-flash-device simplicity. The XCKU085-1FLVF1924C also supports dual-boot and fallback images stored in separate flash sectors for field-upgrade resilience.
Is the XCKU085-1FLVF1924C qualified for automotive applications?
No, the XCKU085-1FLVF1924C is not AEC-Q100 qualified and is rated for industrial temperature range (-40°C to +100°C), not automotive grade. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and ASIL certification. For automotive ADAS or gateway applications, AMD's Zynq UltraScale+ MPSoC series is recommended instead of the XCKU085-1FLVF1924C.
How many GTY transceiver quads does the XCKU085-1FLVF1924C contain?
The XCKU085-1FLVF1924C contains 24 GTY transceiver quads, totaling 96 transceiver lanes. Each quad supports independent data rates from 1.6 to 16.3 Gb/s and can be configured for protocols including CPRI, eCPRI, 10/25/100GbE, and JESD204B. This count is fixed for the XCKU085-1FLVF1924C and confirmed in DS892 and UG578 documentation.
XCKU085-1FLVF1924C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU085-1FLVF1924C FAQ
1.How can I place an order for XCKU085-1FLVF1924C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-1FLVF1924C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-1FLVF1924C reliable?
The price and inventory of XCKU085-1FLVF1924C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-1FLVF1924C is usually 5 days.
3.What payment methods are accepted for XCKU085-1FLVF1924C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-1FLVF1924C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-1FLVF1924C?
XCKU085-1FLVF1924C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-1FLVF1924C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-1FLVF1924C?
For technical support, including XCKU085-1FLVF1924C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-1FLVF1924C requirements.
6.How does Aetrix verify that XCKU085-1FLVF1924C is sourced from the original manufacturer or authorized distributors?
All XCKU085-1FLVF1924C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-1FLVF1924C meets industry standards.
7.What is the process for return or replacement of XCKU085-1FLVF1924C?
All XCKU085-1FLVF1924C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-1FLVF1924C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-1FLVF1924C part is unused and in its original packaging.
Return procedure for XCKU085-1FLVF1924C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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