AMD XCKU085-1FLVF1924I

Overview

XCKU085-1FLVF1924I from AMD is a high-performance Kintex UltraScale FPGA with 871,200 logic cells, 4,032 DSP slices, and 54.8 Mb of block RAM. It features 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging, operates at -1 speed grade, and supports transceivers up to 32.75 Gb/s for high-speed serial interface applications in 5G infrastructure and radar signal processing.

For engineers reviewing the XCKU085-1FLVF1924I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V/1.35 V/1.8 V), thermal performance in air-cooled systems, and configuration interface compatibility (e.g., PCIe Gen3 x8, JTAG, SelectMAP).

Technical Context

The XCKU085-1FLVF1924I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DDR4 controller), and multi-rate transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device targets deterministic latency-critical applications requiring sub-100 ns timing closure on critical paths.

Key Specifications

Pinout & Package

Package: 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 42.5 mm × 42.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU085-1FLVF1924I, the XCKU060-2FFVA1156I offers cost reduction at the expense of transceiver bandwidth and logic scale, while the VU13P-2FHGB2104E trades hardened IP integration for raw logic density-making XCKU085-1FLVF1924I optimal for balanced high-speed serial + memory + processing workloads.

Availability

XCKU085-1FLVF1924I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and medical imaging equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU085-1FLVF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and AI acceleration.

The Kintex UltraScale family delivers optimized balance of logic, memory, and I/O for high-throughput, low-latency applications including wireless infrastructure, test equipment, and real-time imaging.

FAQ

What is the maximum supported DDR4 data rate for XCKU085-1FLVF1924I?

XCKU085-1FLVF1924I supports DDR4 memory interfaces up to 2400 MT/s across eight 72-bit channels. This capability is enabled by its hardened DDR4 memory controller with built-in write-leveling and read-deskew circuitry. The controller also provides ECC and address/command parity checking. XCKU085-1FLVF1924I achieves this performance within its HP I/O banks, which are electrically optimized for high-speed memory signaling.

Does XCKU085-1FLVF1924I include hardened PCIe Gen3 support?

Yes, XCKU085-1FLVF1924I integrates a hardened PCIe Gen3 x8 endpoint block that supports SR-IOV virtualization and Advanced Error Reporting (AER). This eliminates the need for resource-intensive soft PCIe implementations. XCKU085-1FLVF1924I's PCIe block operates at full line rate without external retiming and is validated for compliance with PCI-SIG specifications up to root complex and endpoint configurations.

What transceiver protocols does XCKU085-1FLVF1924I natively support?

XCKU085-1FLVF1924I supports native physical layer protocols including 10/25/100G Ethernet (CAUI-4, CEI-25G-LR), CPRI, eCPRI, and Interlaken v2.0. Its GTH transceivers operate from 1.6 to 32.75 Gb/s with programmable equalization and pre-emphasis. XCKU085-1FLVF1924I does not require external gearbox ICs for 100G applications due to its multi-rate capability.

How is bitstream security implemented in XCKU085-1FLVF1924I?

XCKU085-1FLVF1924I implements bitstream security using AES-256 encryption and HMAC authentication, both executed in dedicated on-die hardware engines. Decryption occurs before configuration loading, preventing exposure of plaintext bitstream. XCKU085-1FLVF1924I supports key storage in battery-backed RAM or eFUSE, with tamper detection triggering automatic key erasure.

What thermal management requirements apply to XCKU085-1FLVF1924I in continuous operation?

XCKU085-1FLVF1924I requires a maximum case temperature of 100°C under full utilization, with recommended airflow ≥300 LFM and thermal interface material meeting ASTM D5470 specifications. Its FC-FBGA package includes an integrated thermal lid. XCKU085-1FLVF1924I's power delivery network is designed for 12-phase VRM support, and junction-to-case thermal resistance is specified at 0.22°C/W.