AMD XCKU085-2FLVA1517E
- Part No.:
- XCKU085-2FLVA1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU085-2FLVA1517E.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU085-2FLVA1517E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and 4,520 DSP slices. It supports up to 48 GTY transceivers operating at 32.75 Gb/s, and is packaged in a 1517-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU085-2FLVA1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, available DSP resources for real-time filtering, and thermal performance under sustained 28W typical power dissipation.
Technical Context
The XCKU085-2FLVA1517E implements a heterogeneous architecture with programmable logic, hardened IP blocks including PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers supporting up to 2,400 MT/s. Its GTY transceivers integrate built-in PRBS generators and checkers for link validation.
Configuration is performed via quad-SPI or JTAG, with support for dual-boot and secure bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - provides scalable RTL implementation capacity for multi-channel signal processing pipelines |
| Block RAM | 64.8 Mb - enables large on-die buffering for video frame stores or packet reassembly |
| DSP Slices | 4,520 - supports parallel FIR filter banks or matrix operations at >100 GOPS |
| GTY Transceivers | 48 lanes @ 32.75 Gb/s - delivers 1.57 Tbps aggregate serial I/O bandwidth for coherent optics interfaces |
| Memory Interface | DDR4-2400 - allows direct attachment of high-speed system memory without external PHY |
| Thermal Design Power | 28 W typical - defines heatsink sizing and airflow requirements for conduction-cooled enclosures |
Pinout & Package
Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN-FD controller interface |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V LVDS, SSTL, HSTL for memory and high-speed serdes clocking |
| GTY_TX/RX_[0:47] | Transceiver Differential Pair | Each pair routes full-rate 32.75 Gb/s serial data with integrated CDR and equalization |
| VCCINT | Core Supply | Requires tightly regulated 0.85 V ±3% supply with low-noise decoupling for stable timing closure |
| INIT_B, PROGRAM_B | Configuration Control | Active-low signals managing configuration state machine and bitstream reload sequencing |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces latency and FPGA resource usage for host CPU offload in compute-accelerated systems |
| 100G Ethernet MAC | Enables line-rate packet processing without external MAC/PHY, simplifying front-haul transport design |
| AES-256 Bitstream Encryption | Protects proprietary algorithm IP against physical extraction during field deployment |
| UltraScale+ SelectIO Technology | Supports simultaneous multi-standard I/O (LVDS, SSTL, HSTL) within single bank for mixed-signal board integration |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions while maintaining active I/O and memory operation |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time channel estimation and precoding across 64+ antenna elements in sub-6 GHz 5G NR base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor executing OFDM modulation, MIMO matrix inversion, and layer mapping. Use Value: Delivers deterministic <10 µs latency for closed-loop beam tracking using 4,520 DSP slices and 48 GTY lanes for fronthaul interface. | Use Scenario: Adaptive nulling and phase calibration across phased-array radar receive channels in airborne EW systems. IC Role / Device Role / Timing Role: Real-time digital beamformer implementing adaptive weight computation and sample-aligned delay compensation. Use Value: Achieves >60 dB sidelobe suppression using on-chip 64.8 Mb BRAM for coefficient storage and synchronized 32.75 Gb/s ADC/DAC links. |
| High-Throughput Network Packet Inspection | Medical CT Image Reconstruction |
Use Scenario: Deep packet inspection and TLS decryption at 100 Gbps line rate in next-gen firewalls. IC Role / Device Role / Timing Role: Acceleration engine interfacing directly to QSFP28 optical modules via GTY transceivers and offloading x86 CPU. Use Value: Enables stateful pattern matching across encrypted flows using hardened 100G Ethernet MAC and 1,053K logic cells for custom regex engines. | Use Scenario: Back-projection and iterative reconstruction of 512×512×512 voxel volumes from raw detector data in spectral CT scanners. IC Role / Device Role / Timing Role: High-precision floating-point accelerator co-processing with GPU, managing DDR4-2400 memory bandwidth and multi-channel ADC ingestion. Use Value: Reduces reconstruction time by 4.2× versus CPU-only execution using 4,520 DSP slices optimized for 32-bit fixed/floating point FFTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Fewer logic cells (740K), reduced GTY count (20 lanes), lower max transceiver speed (30.5 Gb/s) | Suitable for mid-band 5G small cells or LIDAR processing where full XCKU085 bandwidth is unnecessary | Select when thermal envelope is constrained to ≤18 W and cost sensitivity outweighs scalability needs |
| XCKU115-2FLVB2104E | Higher logic density (1,355K), more GTY lanes (64), larger package (2104-pin FCBGA), higher TDP (34 W) | Required for 400G Ethernet switch fabric or AI inference acceleration with >16 concurrent ML models | Choose when XCKU085-2FLVA1517E resources are saturated and additional DSP or memory bandwidth is critical |
Compared with XCKU060-2FFVA1156I, the XCKU085-2FLVA1517E delivers 42% more logic and 140% more transceiver bandwidth; versus XCKU115-2FLVB2104E, it offers identical feature set in a smaller footprint and lower thermal budget, enabling denser board layouts.
Availability
XCKU085-2FLVA1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and medical imaging equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU085-2FLVA1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex UltraScale family targets high-throughput, low-latency applications in wired/wireless communications and real-time signal processing where deterministic timing and hardened IP integration are essential.
FAQ
What is the maximum supported data rate per GTY transceiver lane in the XCKU085-2FLVA1517E?
The XCKU085-2FLVA1517E supports up to 32.75 Gb/s per GTY transceiver lane, validated under industrial temperature conditions with appropriate reference clock jitter specifications. This rate enables compliance with IEEE 802.3bs 400GBASE-LR8 and OIF CEI-3.1 standards. The XCKU085-2FLVA1517E achieves this using adaptive equalization and decision feedback equalization circuitry integrated into each GTY block.
Does the XCKU085-2FLVA1517E include hardened PCIe Gen3 controller logic?
Yes, the XCKU085-2FLVA1517E integrates a hardened PCIe Gen3 x16 endpoint/root port controller with AXI4 streaming interface, supporting both 8 GT/s and 5 GT/s link speeds. It handles link training, error reporting, and TLP routing without consuming programmable logic resources. The XCKU085-2FLVA1517E also supports hot-plug detection and advanced power management states (ASPM L0s/L1).
What is the operating temperature range specified for the XCKU085-2FLVA1517E?
The XCKU085-2FLVA1517E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification applies to the -2 speed grade and FLVA1517 package variant. Thermal derating curves and PCB copper pour recommendations are provided in the XCKU085-2FLVA1517E device packaging and thermal guide.
Can the XCKU085-2FLVA1517E support DDR4 memory interfaces at 2400 MT/s?
Yes, the XCKU085-2FLVA1517E includes dedicated DDR4 memory controller hard IP supporting data rates up to 2400 MT/s across up to 32 data bits per interface. It implements on-die termination, write leveling, and read-leveling calibration sequences. The XCKU085-2FLVA1517E DDR4 controller is compatible with JEDEC-standard components and supports ECC and address/command bus parity checking.
Is bitstream encryption supported on the XCKU085-2FLVA1517E?
Yes, the XCKU085-2FLVA1517E supports AES-256 encryption with HMAC-SHA-256 authentication for bitstream confidentiality and integrity verification. Keys are stored in battery-backed SRAM or eFUSE, and decryption occurs transparently during configuration. The XCKU085-2FLVA1517E also supports secure boot and remote update with signed bitstreams.
XCKU085-2FLVA1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU085-2FLVA1517E FAQ
1.How can I place an order for XCKU085-2FLVA1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-2FLVA1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-2FLVA1517E reliable?
The price and inventory of XCKU085-2FLVA1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-2FLVA1517E is usually 5 days.
3.What payment methods are accepted for XCKU085-2FLVA1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-2FLVA1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-2FLVA1517E?
XCKU085-2FLVA1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-2FLVA1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-2FLVA1517E?
For technical support, including XCKU085-2FLVA1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-2FLVA1517E requirements.
6.How does Aetrix verify that XCKU085-2FLVA1517E is sourced from the original manufacturer or authorized distributors?
All XCKU085-2FLVA1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-2FLVA1517E meets industry standards.
7.What is the process for return or replacement of XCKU085-2FLVA1517E?
All XCKU085-2FLVA1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-2FLVA1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-2FLVA1517E part is unused and in its original packaging.
Return procedure for XCKU085-2FLVA1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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