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AMD XCKU085-2FLVB1760E
- Part No.:
- XCKU085-2FLVB1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU085-2FLVB1760E.pdf
- Description:
- IC FPGA 676 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,034
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Product details
Overview
XCKU085-2FLVB1760E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for PCIe Gen3 x16, DDR4-2400, and 16.3 Gb/s transceivers. It is deployed in 5G radio units, high-speed test equipment, and radar signal processing systems where deterministic latency and multi-gigabit serial I/O are critical.
For engineers reviewing the XCKU085-2FLVB1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility (1.2V/1.35V/1.8V), thermal performance under sustained DSP load, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCKU085-2FLVB1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and ultra-low-latency DSP slices optimized for complex mathematical operations. Its UltraScale+ architecture uses dual-register LUTs and advanced clocking with 24 dedicated clock management tiles.
It supports configuration via quad-SPI, BPI, or JTAG, with fallback capability and secure boot using HMAC-SHA-256 authentication. The device operates across industrial temperature range (–40°C to +100°C) and requires precise power sequencing across VCCINT, VCCAUX, and VCCO rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 64.8 Mb - enables large on-die data buffering and FIFOs without external memory |
| Transceiver Max Rate | 16.3 Gb/s - supports 10G/25G Ethernet, CPRI, and JESD204B/C interfaces |
| PCIe Interface | Gen3 x16 - provides 16 GT/s per lane with integrated root port and endpoint hard IP |
| DDR Support | DDR4-2400 - delivers 19.2 GB/s peak memory bandwidth with integrated controller |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - enables direct interfacing with high-speed ADCs, DACs, and sensors |
| Configuration Security | AES-256 + HMAC-SHA-256 - ensures authenticated, encrypted bitstream loading from external flash |
Pinout & Package
Package: 1760-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V operation |
| GTYP[0:31] | Quad GTY Transceiver Lane | Each pair supports 16.3 Gb/s serial protocol; includes TX/RX termination and CDR |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for differential I/O standards (e.g., LVDS, MIPI) |
| CONFIG_IO | Configuration Input | Active-low pin initiating master SPI or BPI configuration mode at power-up |
| VCCINT | Core Power Supply | Supplies 0.85V ±3% to programmable logic and routing fabric |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Dual-register LUTs and distributed RAM enable higher logic density and lower power per function |
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and guarantees timing closure for high-throughput host interface |
| Integrated Memory Controller | Supports DDR4-2400 with ECC, eliminating need for external memory controller IP |
| Secure Boot with HMAC | Prevents unauthorized firmware execution by validating bitstream authenticity before configuration |
| Thermal Lid Package | Enables reliable operation up to 100°C junction temperature with standard heatsink mounting |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in active antenna systems operating at 3.5 GHz. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency DSP kernels; GTY transceivers interface with RFICs via JESD204C. Use Value: 16.3 Gb/s transceivers and deterministic routing reduce inter-FPGA synchronization jitter to <50 ps RMS. | Use Scenario: Parallel stimulus-response testing of SoCs with >100 MHz digital I/O patterns and real-time pass/fail analysis. IC Role / Device Role / Timing Role: Configurable I/O banks drive and sample DUT signals; block RAM buffers pattern sequences at 1.2 Gbps. Use Value: 1,053K logic cells allow concurrent execution of multiple test algorithms with sub-nanosecond timing resolution. |
| Phased Array Radar Signal Processor | Optical Transport Network (OTN) Line Card |
Use Scenario: Pulse compression, CFAR detection, and synthetic aperture imaging in airborne radar platforms. IC Role / Device Role / Timing Role: DSP slices perform FFTs and matrix operations; PCIe Gen3 x16 streams processed data to host CPU. Use Value: Hardened PCIe and DDR4-2400 enable sustained 12 GB/s data ingestion from ADC arrays without bottlenecks. | Use Scenario: 100G/400G OTU4/OTUCn framing, FEC decoding, and client-mapping in metro DWDM systems. IC Role / Device Role / Timing Role: GTY transceivers terminate OTN optical lanes; logic fabric implements G.709 mapping logic. Use Value: 64.8 Mb block RAM stores full OTU4 frame buffers, enabling zero-packet-loss switching during protection switchover. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Fewer logic cells (752K), reduced transceiver count (20 vs. 32 GTY), smaller package (1156-pin) | Suitable for cost-sensitive 25G Ethernet edge switches but lacks bandwidth for full 5G RU baseband | Select when system I/O count and DSP throughput requirements are ~30% lower than XCKU085-2FLVB1760E |
| XCKU115-2FLVD1924E | Higher logic density (1,375K), 40 GTY transceivers, larger 1924-pin FCBGA package | Required for 400G ZR coherent optics with dual 200G client interfaces and full forward error correction | Choose when PCIe Gen3 x16 and DDR4-2400 must coexist with ≥32 GTY lanes in same device |
Compared with XCKU060-2FFVA1156I and XCKU115-2FLVD1924E, the XCKU085-2FLVB1760E delivers balanced transceiver count, logic capacity, and memory bandwidth-making it optimal for 5G infrastructure and radar systems requiring both high serial I/O and substantial on-chip processing without over-provisioning.
Availability
XCKU085-2FLVB1760E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, defense radar systems, and high-speed test instrumentation requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU085-2FLVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, AI acceleration, and high-performance processors and FPGAs for data center, embedded, and aerospace applications.
The Kintex UltraScale family targets high-throughput, low-latency applications such as wireless baseband, test & measurement, and imaging-designed to deliver optimal performance-per-watt in thermally constrained environments.
FAQ
What is the maximum supported data rate for transceivers on the XCKU085-2FLVB1760E?
The XCKU085-2FLVB1760E supports GTY transceivers rated up to 16.3 Gb/s per lane. This enables compliance with JESD204B/C, 10G/25G Ethernet, and CPRI protocols. Actual achievable line rates depend on PCB channel loss, reference clock stability, and equalization settings configured in Vivado.
Does the XCKU085-2FLVB1760E support PCIe Gen4?
No, the XCKU085-2FLVB1760E integrates hardened PCIe Gen3 x16 blocks only. It does not support Gen4 signaling or associated electrical specifications. For Gen4 compatibility, AMD recommends the Versal ACAP family or Kria KV260 derivatives-not the Kintex UltraScale series.
What configuration modes are supported by the XCKU085-2FLVB1760E?
The XCKU085-2FLVB1760E supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI is commonly used for fast parallel bitstream loading from flash. Configuration security features-including AES-256 decryption and HMAC-SHA-256 authentication-are enabled only in secure boot mode.
Is the XCKU085-2FLVB1760E qualified for automotive applications?
No, the XCKU085-2FLVB1760E is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It is intended for telecom, defense, and industrial applications-not automotive safety-critical systems. AMD offers separate automotive-grade devices in the Zynq UltraScale+ MPSoC family.
What is the purpose of the VRP and VRN pins on the XCKU085-2FLVB1760E?
The VRP and VRN pins provide precision internal reference voltages for differential I/O standards such as LVDS, MIPI D-PHY, and RSDS. They must be connected to stable 1.2V or 1.35V supplies depending on I/O bank voltage. Incorrect VRP/VRN biasing causes timing violations and signal integrity degradation in high-speed interfaces.
XCKU085-2FLVB1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU085-2FLVB1760E FAQ
1.How can I place an order for XCKU085-2FLVB1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-2FLVB1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-2FLVB1760E reliable?
The price and inventory of XCKU085-2FLVB1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-2FLVB1760E is usually 5 days.
3.What payment methods are accepted for XCKU085-2FLVB1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-2FLVB1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-2FLVB1760E?
XCKU085-2FLVB1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-2FLVB1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-2FLVB1760E?
For technical support, including XCKU085-2FLVB1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-2FLVB1760E requirements.
6.How does Aetrix verify that XCKU085-2FLVB1760E is sourced from the original manufacturer or authorized distributors?
All XCKU085-2FLVB1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-2FLVB1760E meets industry standards.
7.What is the process for return or replacement of XCKU085-2FLVB1760E?
All XCKU085-2FLVB1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-2FLVB1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-2FLVB1760E part is unused and in its original packaging.
Return procedure for XCKU085-2FLVB1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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