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AMD XCKU085-2FLVB1760I
- Part No.:
- XCKU085-2FLVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU085-2FLVB1760I.pdf
- Description:
- IC FPGA 676 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,573
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Product details
Overview
XCKU085-2FLVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for up to 48.8 GT/s transceiver line rates. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data processing in 5G infrastructure and radar systems.
For engineers reviewing the XCKU085-2FLVB1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver performance, I/O voltage flexibility (1.2 V to 1.8 V), thermal design power (29.5 W typical), and -2 speed grade timing closure capability.
Technical Context
The XCKU085-2FLVB1760I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and integrated hard IP including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA. Its transceivers support PAM4 and NRZ modulation schemes across multiple protocols.
It features 840 user-configurable I/O pins compliant with LVDS, SSTL, HSTL, and MIPI standards, and supports configuration via Quad-SPI, BPI, or JTAG. The device operates across industrial temperature range (-40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| Block RAM | 64.8 Mb - enables large on-die buffering and FIFO depth without external memory |
| Transceiver Line Rate | 48.8 GT/s - supports 100G KR4/CR4 and 400G KR8/CR8 Ethernet lane aggregation |
| I/O Count | 840 - provides high interconnect density for multi-protocol interface consolidation |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade |
| TDP | 29.5 W (typical) - defines thermal management requirements for PCB layout and heatsink sizing |
| Operating Temp | -40°C to +100°C (junction) - qualifies for industrial and outdoor base station deployment |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FCBGA) with 1760 balls, 25 mm × 25 mm body size, 0.8 mm pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V ±3% to FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, SelectIO, and transceiver reference circuits |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to high-speed serial transceiver analog circuitry |
| CLK_IN_0 | Dedicated clock input | Accepts single-ended or differential reference clocks for MMCM/PLL clock synthesis |
| PROGRAM_B | Configuration control | Active-low signal initiating full reconfiguration from external flash or host processor |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces integration effort and latency versus soft IP; supports root complex and endpoint modes |
| Dual 100G Ethernet MAC | Enables line-rate packet processing for OTN and CPRI fronthaul without external NICs |
| DDR4 Memory Controller | Supports up to 2400 MT/s with ECC and AXI4 interface for coherent system memory access |
| UltraScale+ DSP Slices | 2,520 slices with 27×18-bit multipliers and 48-bit accumulators for real-time signal processing |
| Multi-Voltage I/O Banks | Independent bank-level voltage selection (1.2 V–1.8 V) allows mixed-interface board designs |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in 64T64R active antenna systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, matrix inversion, and precoding algorithms with deterministic latency. Use Value: Delivers >1.2 TMAC/s throughput using DSP slices and BRAM-based coefficient storage. | Use Scenario: Pulse-Doppler processing and CFAR detection in ground-based surveillance radar. IC Role / Device Role / Timing Role: High-throughput digital receiver front-end synchronizing ADC samples and performing STAP filtering. Use Value: Enables 12-bit ADC sampling at 2.4 GSPS with on-chip decimation and Doppler FFT acceleration. |
| High-Frequency Trading Engine | Optical Transport Network Switching |
Use Scenario: Sub-microsecond order matching and risk checking in co-located exchange gateways. IC Role / Device Role / Timing Role: Deterministic low-latency packet classifier and decision accelerator interfacing to 10G/25G Ethernet PHYs. Use Value: Achieves <85 ns end-to-end latency from packet ingress to decision output using hard MAC and cut-through forwarding. | Use Scenario: OTU4 frame mapping, FEC decoding, and wavelength switching control in metro DWDM nodes. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling G.709 framing and Reed-Solomon (255,239) decoding. Use Value: Integrates dual 100G MACs and 100G FEC engines to eliminate discrete SerDes and forward error correction ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | Higher logic capacity (1,375K cells), larger package (1924-ball FCBGA), 32.5 W TDP | Better suited for multi-100G packet processing with deeper pipeline stages | Select when >1.1M logic cells or additional transceivers beyond 32 lanes are required |
| XCKU060-2FFVA1156I | Fewer logic cells (747K), smaller 1156-ball FCBGA, lower TDP (22.4 W) | Targeted at cost-sensitive 25G/40G edge compute where full XCKU085 resources are unused | Choose for reduced BOM cost and simpler thermal design when bandwidth and logic density allow downscaling |
Compared with XCKU085-2FLVB1760I, the XCKU115 offers headroom for future feature expansion but increases PCB area and cooling complexity, while the XCKU060 reduces cost and power at the expense of transceiver count and memory bandwidth-making XCKU085 the balanced choice for 100G+ infrastructure with constrained board space.
Availability
XCKU085-2FLVB1760I is available at Aetrix Electronics and suitable for 5G wireless infrastructure, aerospace radar systems, and high-frequency trading platforms requiring stable component supply and long-term production support.
Supply support for XCKU085-2FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale family delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and defense systems.
FAQ
What is the maximum supported DDR4 data rate for XCKU085-2FLVB1760I?
The XCKU085-2FLVB1760I supports DDR4 memory interfaces up to 2400 MT/s with built-in controller hard IP. This includes support for x4/x8/x16 configurations, on-die termination, and ECC. The controller implements AXI4 interface and complies with JEDEC DDR4 SDRAM standard JESD209-4. Performance is validated under industrial temperature conditions with appropriate PCB stack-up and termination.
Does XCKU085-2FLVB1760I include hardened PCIe Gen4 endpoints?
No, the XCKU085-2FLVB1760I includes hardened PCIe Gen3 x16 root complex and endpoint blocks only. It does not support PCIe Gen4 signaling or protocol features. Gen4 capability requires Virtex UltraScale+ or Versal ACAP devices. The Gen3 hard IP achieves sub-100 ns transaction latency and supports SR-IOV virtualization extensions.
What configuration modes are supported by XCKU085-2FLVB1760I?
XCKU085-2FLVB1760I supports master SPI, slave SPI, master BPI, slave parallel, and JTAG configuration modes. Quad-SPI mode enables fast boot from serial flash with addressable 4-byte addressing. Configuration bitstream authentication and decryption are supported via AES-256 and HMAC-SHA-256 keys stored in eFUSE.
Is XCKU085-2FLVB1760I qualified for automotive applications?
No, XCKU085-2FLVB1760I is specified for industrial temperature range (–40°C to +100°C junction) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and extended temperature validation required for automotive ECUs. For automotive use, AMD recommends the XA series derivatives with formal qualification documentation.
How many transceiver quads does XCKU085-2FLVB1760I contain?
XCKU085-2FLVB1760I contains 32 transceiver quads, each supporting four independent high-speed serial lanes. This yields up to 128 transceiver channels, configurable as 32x 10G, 16x 25G, or 8x 50G/100G interfaces. All quads support common-mode voltage adjustment, continuous-time linear equalization (CTLE), and decision feedback equalization (DFE).
XCKU085-2FLVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU085-2FLVB1760I FAQ
1.How can I place an order for XCKU085-2FLVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-2FLVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-2FLVB1760I reliable?
The price and inventory of XCKU085-2FLVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-2FLVB1760I is usually 5 days.
3.What payment methods are accepted for XCKU085-2FLVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-2FLVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-2FLVB1760I?
XCKU085-2FLVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-2FLVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-2FLVB1760I?
For technical support, including XCKU085-2FLVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-2FLVB1760I requirements.
6.How does Aetrix verify that XCKU085-2FLVB1760I is sourced from the original manufacturer or authorized distributors?
All XCKU085-2FLVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-2FLVB1760I meets industry standards.
7.What is the process for return or replacement of XCKU085-2FLVB1760I?
All XCKU085-2FLVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-2FLVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-2FLVB1760I part is unused and in its original packaging.
Return procedure for XCKU085-2FLVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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