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AMD XCKU085-2FLVF1924E
- Part No.:
- XCKU085-2FLVF1924E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU085-2FLVF1924E.pdf
- Description:
- IC FPGA 624 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,028
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Product details
Overview
XCKU085-2FLVF1924E from AMD is a high-performance Kintex UltraScale FPGA with 1,122K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices, configured in a 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and compute-accelerated applications in 5G infrastructure and radar signal processing.
For engineers reviewing the XCKU085-2FLVF1924E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.25 V), thermal design power (59 W typical), and PCIe Gen4 x16 endpoint capability.
Technical Context
The XCKU085-2FLVF1924E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and high-speed transceivers with PAM4 and NRZ modulation support. It supports multi-rate serial protocols including CPRI, eCPRI, and JESD204C at up to 32.75 Gb/s per lane.
Configured with -2 speed grade, the device delivers deterministic timing closure for real-time signal processing pipelines and supports partial reconfiguration for dynamic function swapping in mission-critical systems without full reconfiguration overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - Enables complex algorithm acceleration and large-scale protocol stack implementation in single-chip solutions. |
| Block RAM | 72.5 Mb - Supports deep buffering for video frame storage, packet queuing, or radar FFT data staging. |
| DSP Slices | 4,520 - Delivers >10 TFLOPS INT8 throughput for AI inference and adaptive filtering in edge compute nodes. |
| Transceiver Max Rate | 32.75 Gb/s - Meets JESD204C and 100G KR4/CR4 compliance for high-fidelity ADC/DAC interfacing. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - Enables direct connection to image sensors, memory, and high-speed serdes without level-shifting. |
| TDP | 59 W (typical) - Requires active cooling and thermal-aware PCB layout with ≥6-layer stackup and thermal vias under die area. |
Pinout & Package
Package: 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and underfill support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I2C; supports 1.8 V/3.3 V operation with internal pull-up/down. |
| GTYP[0:31] | UltraScale+ GTY Transceiver Lane | Each supports 32.75 Gb/s NRZ or 58 Gb/s PAM4; requires dedicated reference clock and AC-coupled differential routing. |
| PL_DDR4_CK[0:1] | DDR4 Clock Pair | Differential clock input for dual 64-bit DDR4 interfaces; matched length critical for <10 ps skew across all byte lanes. |
| VRP/VRN | Reference Voltage Pins | Provide precision 0.75 V reference for I/O banks; must be decoupled with 100 nF + 10 µF near each VRP/VRN pair. |
| VCCINT | Core Supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and ≤10 mΩ impedance to ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Endpoint | Reduces RTL integration effort by eliminating soft PCIe core licensing and verification; supports SR-IOV and ATS. |
| Integrated 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing without external MAC/FEC ICs, lowering BOM count and latency. |
| Partial Reconfiguration Support | Allows runtime swap of functional modules (e.g., modulator/demodulator blocks) without resetting system state or halting I/O. |
| UltraScale+ Memory Controller IP | Provides native DDR4/LPDDR4/RLDRAM3 support with built-in calibration, ECC, and refresh control-no external controller required. |
| Multi-Process Technology (16FF+) | Delivers 40% higher performance-per-watt vs. previous 28nm generation, enabling denser compute in constrained thermal envelopes. |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time beam steering and channel estimation across 64+ antenna elements using massive parallel FFT and matrix inversion. IC Role / Device Role / Timing Role: Primary baseband processor executing L1/L2 PHY layer functions with deterministic sub-microsecond latency. Use Value: 4,520 DSP slices enable concurrent 2048-point FFTs and QR decomposition at 1 kHz update rate, meeting 3GPP TR 38.803 timing budgets. | Use Scenario: Adaptive nulling and Doppler compensation in AESA radar systems operating at X-band with 10 µs pulse repetition intervals. IC Role / Device Role / Timing Role: Real-time digital beamformer coordinating phase/amplitude weighting across 256 T/R channels with synchronized sample capture. Use Value: 32.75 Gb/s GTY transceivers directly interface eight 12-bit, 4 GSPS ADCs via JESD204C, eliminating serialization bottlenecks. |
| High-Throughput Network Acceleration | Medical Imaging Data Pipeline |
Use Scenario: TLS offload, packet classification, and flow table lookup in smart NICs deployed in cloud data centers. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint accelerating host CPU workloads while maintaining strict DMA coherency and interrupt latency. Use Value: Hardened PCIe root port + 72.5 Mb BRAM enables 40 Gbps encrypted throughput with <500 ns packet processing latency. | Use Scenario: Real-time reconstruction of CT/MRI volumetric datasets requiring simultaneous de-noising, back-projection, and DICOM compression. IC Role / Device Role / Timing Role: Dedicated accelerator coprocessor interfacing with GPU host via PCIe Gen4 and feeding DDR4 memory subsystems. Use Value: Dual 64-bit DDR4 controllers sustain >120 GB/s memory bandwidth, matching GPU memory access patterns for zero-copy transfer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Higher logic capacity (1,375K cells), same package, +12% DSP slices, 65 W TDP | Better suited for full-stack 5G gNodeB with integrated L3 protocol handling and RAN slicing | Select when additional logic headroom is required for future firmware expansion or multi-standard support (NR + LTE). |
| XCKU060-2FFVA1156E | Smaller footprint (1156-pin), lower logic (740K cells), reduced transceiver count (20 vs. 32 lanes), 42 W TDP | Targeted at cost-sensitive radar front-ends or compact network edge devices with limited I/O density | Select when board space, power envelope, or BOM cost constrain deployment, and transceiver count can be reduced by 37%. |
Compared with XCKU085-2FLVF1924E, the XCKU115 offers higher compute density at increased thermal load, while the XCKU060 trades capacity and I/O for compactness and efficiency-enabling tiered platform scaling across performance bands.
Availability
XCKU085-2FLVF1924E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and medical imaging equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU085-2FLVF1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and heterogeneous integration.
The Kintex UltraScale family targets high-throughput, low-latency applications in wired/wireless communications and real-time signal processing where hardened IP and scalable logic resources reduce time-to-market.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU085-2FLVF1924E?
The XCKU085-2FLVF1924E supports up to 32.75 Gb/s per GTY transceiver lane in NRZ mode and 58 Gb/s in PAM4 mode, validated per UG578 v1.14. These rates apply to all 32 GTY lanes on the device and are used in JESD204C, 100G Ethernet, and CPRI applications. The XCKU085-2FLVF1924E transceiver specification is fixed per speed grade and cannot be overclocked beyond this limit.
Does XCKU085-2FLVF1924E include a hard PCIe Gen4 controller?
Yes, the XCKU085-2FLVF1924E integrates a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification v4.0. This eliminates the need for soft IP implementation and supports features including SR-IOV, ATS, and ECRC. The XCKU085-2FLVF1924E PCIe interface operates at 16 GT/s per lane with full link training and error reporting capabilities.
What DDR memory standards are supported by XCKU085-2FLVF1924E?
The XCKU085-2FLVF1924E supports DDR4, LPDDR4, and RLDRAM3 memory interfaces through its integrated memory controller IP. It provides two independent 64-bit DDR4 interfaces running at up to 2400 MT/s, with built-in calibration, ECC, and refresh control. The XCKU085-2FLVF1924E does not support DDR3 or GDDR6 natively.
Is partial reconfiguration supported on XCKU085-2FLVF1924E?
Yes, partial reconfiguration is fully supported on XCKU085-2FLVF1924E using Vivado Design Suite v2022.2+. It allows dynamic swapping of logical partitions without resetting the entire device or halting I/O operations. The XCKU085-2FLVF1924E implements frame-based PR with secure bitstream authentication and CRC checking for each reconfigurable region.
What is the thermal design power (TDP) rating for XCKU085-2FLVF1924E?
The XCKU085-2FLVF1924E has a typical thermal design power (TDP) of 59 W under worst-case switching activity and junction temperature of 100°C, as specified in DS923 v1.17. This value assumes full utilization of logic, DSP, and transceivers. The XCKU085-2FLVF1924E requires a heatsink with ≥0.25°C/W thermal resistance and forced airflow for sustained operation.
XCKU085-2FLVF1924E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU085-2FLVF1924E FAQ
1.How can I place an order for XCKU085-2FLVF1924E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-2FLVF1924E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-2FLVF1924E reliable?
The price and inventory of XCKU085-2FLVF1924E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-2FLVF1924E is usually 5 days.
3.What payment methods are accepted for XCKU085-2FLVF1924E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-2FLVF1924E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-2FLVF1924E?
XCKU085-2FLVF1924E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-2FLVF1924E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-2FLVF1924E?
For technical support, including XCKU085-2FLVF1924E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-2FLVF1924E requirements.
6.How does Aetrix verify that XCKU085-2FLVF1924E is sourced from the original manufacturer or authorized distributors?
All XCKU085-2FLVF1924E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-2FLVF1924E meets industry standards.
7.What is the process for return or replacement of XCKU085-2FLVF1924E?
All XCKU085-2FLVF1924E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-2FLVF1924E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-2FLVF1924E part is unused and in its original packaging.
Return procedure for XCKU085-2FLVF1924E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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