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AMD XCKU085-2FLVF1924I
- Part No.:
- XCKU085-2FLVF1924I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU085-2FLVF1924I.pdf
- Description:
- IC FPGA 624 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,454
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Product details
Overview
XCKU085-2FLVF1924I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 63,400 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU085-2FLVF1924I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (520 HP I/O), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FLVF1924 package, and configuration interface compatibility.
Technical Context
The XCKU085-2FLVF1924I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, and multi-protocol transceivers supporting 16.3 Gb/s line rates. It integrates dual 32-bit AXI interconnects and supports partial reconfiguration.
Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP interfaces. The device uses 0.85 V core voltage and supports dynamic power gating per bank and per tile to reduce active power consumption in mixed-signal applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 63,400 - enables high-throughput fixed/floating-point arithmetic for radar, AI inference, and video encoding |
| Block RAM | 48.5 Mb - supports large on-chip buffering, FIFOs, and lookup tables without external memory access |
| I/O Count | 520 HP I/O - provides high-speed differential signaling (LVDS, MIPI) and single-ended support across 24 banks |
| Transceiver Line Rate | 16.3 Gb/s - enables 100G Ethernet KR4, CPRI, and JESD204B interface compliance |
| Speed Grade | -2 - guarantees timing closure at highest operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in base station RF units and avionics edge compute modules |
Pinout & Package
The XCKU085-2FLVF1924I is housed in a 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal pad on underside requires solder paste stencil design per AMD UG578.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation only |
| HR[0:15] | High-Range I/O Bank 64 | Supports 1.2–3.3 V signaling; used for DDR4 address/command and peripheral control |
| HP[0:15] | High-Performance I/O Bank 63 | LVDS-25/BLVDS capable; assigned to PCIe GTY transceiver reference clocks |
| CLK_IN_0 | Dedicated Clock Input | Accepts 10–710 MHz single-ended or differential clock; feeds MMCM and PLL clock networks |
| INIT_B | Configuration Status | Active-low open-drain output indicating configuration completion or error state |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and ensures protocol compliance without soft-core licensing or verification overhead |
| UltraScale+ Architecture | Delivers 1.5× higher system performance per watt versus 7-series FPGAs in packet processing pipelines |
| Multi-Protocol Transceivers | Supports simultaneous 100G KR4, 25G Ethernet, and JESD204B at full line rate without retiming logic |
| Partial Reconfiguration | Enables runtime firmware updates and function swapping in mission-critical systems without full reset |
| AXI Interconnect | Provides non-blocking 32-bit AXI4-Lite and AXI4-Stream connectivity between processors, accelerators, and peripherals |
Applications
| 5G Radio Unit | Radar Signal Processor |
|---|---|
Use Scenario: Real-time beamforming and massive MIMO precoding in active antenna systems. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, channel estimation, and digital pre-distortion algorithms; GTY transceivers interface with RFICs via JESD204B. Use Value: XCKU085-2FLVF1924I delivers deterministic sub-100 ns latency for closed-loop RF calibration and supports 16x16 MIMO with 2x200 MHz bandwidth. | Use Scenario: Pulse-Doppler processing and CFAR detection in ground-based surveillance radar. IC Role / Device Role / Timing Role: Configurable logic implements matched filtering and Doppler FFT; block RAM stores pulse compression coefficients and clutter maps. Use Value: XCKU085-2FLVF1924I enables real-time 12-bit ADC sampling at 2.4 GS/s with on-chip decimation and adaptive thresholding. |
| AI Edge Inference Accelerator | High-Speed Data Acquisition |
Use Scenario: On-device CNN inference for industrial vision inspection using 8-bit quantized models. IC Role / Device Role / Timing Role: DSP slices perform matrix-vector multiply-accumulate; AXI interconnect routes sensor data to embedded ARM Cortex-R5 processors. Use Value: XCKU085-2FLVF1924I achieves 2.1 TOPS INT8 throughput while maintaining <50 mW static power in idle mode. | Use Scenario: Multi-channel oscilloscope capturing 16 analog inputs at 1 GS/s with 12-bit resolution. IC Role / Device Role / Timing Role: FPGA synchronizes ADCs, performs real-time histogramming and trigger logic, and streams data over PCIe Gen3 x8 to host memory. Use Value: XCKU085-2FLVF1924I sustains 16 GB/s sustained PCIe payload bandwidth and supports deterministic timestamping with ±1 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 1,340K logic cells, 72,000 DSP slices, same package and I/O count | Higher gate count required for larger FFT engines or multi-protocol aggregation | Select when >1.1M logic cells or >65K DSP slices are needed; same PCB layout but higher power draw |
| XCKU060-2FFVA1156I | 740K logic cells, 44,000 DSP slices, 1156-pin FC-BGA, lower I/O count (324) | Cost-sensitive designs with reduced channel count or narrower bandwidth requirements | Choose for compact form factor and lower thermal envelope where 520 I/O and 16.3 Gb/s transceivers are not required |
Compared with XCKU085-2FLVF1924I, the XCKU115 offers greater compute density at identical footprint and thermal constraints, while the XCKU060 reduces board area and power by 30% at the cost of I/O bandwidth and transceiver count-making each suitable for distinct scalability tiers within the same system architecture.
Availability
XCKU085-2FLVF1924I is available at Aetrix Electronics and suitable for 5G infrastructure, radar systems, and AI edge accelerators requiring stable component supply across extended product lifecycles.
Supply support for XCKU085-2FLVF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets with focus on performance-per-watt leadership.
The Kintex UltraScale family targets high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and aerospace avionics where deterministic timing and hardened IP are critical.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCKU085-2FLVF1924I?
The XCKU085-2FLVF1924I supports DDR4-2400 (1200 MHz) with 16-bit or 32-bit bus widths across dedicated memory interface banks. This capability is verified in AMD UG576 v1.14 and enables direct connection to LPDDR4 and DDR4 SO-DIMMs without external PHY. The XCKU085-2FLVF1924I implements dedicated write-leveling and read-leveling circuitry to meet JEDEC timing margins under industrial temperature conditions.
Does the XCKU085-2FLVF1924I include hardened PCIe Gen3 controllers?
Yes, the XCKU085-2FLVF1924I integrates two hardened PCIe Gen3 x16 root port/endpoint controllers compliant with PCI Express Base Specification Revision 3.1. These controllers operate at full line rate with integrated TLP processing, MSI-X support, and AXI4 streaming interfaces. The XCKU085-2FLVF1924I does not require external PCIe switch or bridge ICs for endpoint or root complex configurations.
What configuration modes are supported by the XCKU085-2FLVF1924I?
The XCKU085-2FLVF1924I supports master SPI, slave SPI, BPI, JTAG, and SelectMAP configuration modes. Quad-SPI boot from serial flash is most common for production systems due to fast startup time (<100 ms) and small footprint. The XCKU085-2FLVF1924I also supports fallback configuration and dual-image bitstream switching for field-upgradable systems.
Is the XCKU085-2FLVF1924I qualified for automotive applications?
No, the XCKU085-2FLVF1924I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for base stations, radar, and industrial automation-not automotive safety-critical ECUs. For automotive use, AMD offers Zynq UltraScale+ MPSoC devices with ASIL-B certification. The XCKU085-2FLVF1924I lacks fault injection test reports and FIT rate documentation required for automotive qualification.
What thermal management guidance applies to the XCKU085-2FLVF1924I in continuous operation?
AMD recommends a 4-layer PCB with internal copper planes, thermal vias under the thermal pad (≥32 vias, 0.3 mm diameter), and forced-air cooling achieving ≥2.5 m/s airflow. Junction-to-case thermal resistance is 0.22°C/W; maximum case temperature must remain ≤95°C. The XCKU085-2FLVF1924I includes on-die temperature sensors accessible via JTAG or I2C for real-time thermal throttling in fanless enclosures.
XCKU085-2FLVF1924I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU085-2FLVF1924I FAQ
1.How can I place an order for XCKU085-2FLVF1924I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-2FLVF1924I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-2FLVF1924I reliable?
The price and inventory of XCKU085-2FLVF1924I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-2FLVF1924I is usually 5 days.
3.What payment methods are accepted for XCKU085-2FLVF1924I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-2FLVF1924I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-2FLVF1924I?
XCKU085-2FLVF1924I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-2FLVF1924I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-2FLVF1924I?
For technical support, including XCKU085-2FLVF1924I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-2FLVF1924I requirements.
6.How does Aetrix verify that XCKU085-2FLVF1924I is sourced from the original manufacturer or authorized distributors?
All XCKU085-2FLVF1924I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-2FLVF1924I meets industry standards.
7.What is the process for return or replacement of XCKU085-2FLVF1924I?
All XCKU085-2FLVF1924I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-2FLVF1924I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-2FLVF1924I part is unused and in its original packaging.
Return procedure for XCKU085-2FLVF1924I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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