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AMD XCKU085-3FLVA1517E
- Part No.:
- XCKU085-3FLVA1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU085-3FLVA1517E.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,271
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Product details
Overview
XCKU085-3FLVA1517E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for up to 32.75 GT/s via 32 GTH transceivers. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.
For engineers reviewing the XCKU085-3FLVA1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage flexibility (1.2 V to 1.8 V), thermal design power (29.5 W typical), and FLVA1517 package compatibility with high-speed PCB routing constraints.
Technical Context
The XCKU085-3FLVA1517E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and integrated hard IP including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA. Its transceivers support PAM4 and NRZ modulation with built-in PRBS generators and error detectors.
It delivers deterministic low-latency routing via dedicated clock networks and supports partial reconfiguration for dynamic function swapping in mission-critical avionics and test equipment applications without full device reboot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum concurrent parallel logic functions and RTL complexity capacity |
| Block RAM | 64.8 Mb - enables large on-die buffering for video frame stores or packet buffering in networking |
| GTH Transceivers | 32 × 32.75 GT/s - supports multi-lane 100G Ethernet, CPRI, and JESD204B interfaces |
| DDR4 Interface | Up to 2,400 MT/s across 4 banks - provides high-throughput memory access for real-time data streaming |
| Thermal Design Power | 29.5 W typical - defines heatsink sizing and airflow requirements for conduction-cooled enclosures |
| I/O Standards | Supports 1.2 V to 1.8 V - allows direct interfacing with LPDDR4, MIPI, and legacy CMOS peripherals |
Pinout & Package
The XCKU085-3FLVA1517E is housed in a 1517-ball Fine-Pitch Flip-Chip Ball Grid Array (FLVA) package with 1.0 mm ball pitch, designed for high-density interconnect and controlled impedance routing on 10+ layer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Transceiver reference clock input | Provides low-jitter timing source for all 32 GTH transceivers; requires external 100–300 MHz differential oscillator |
| VRP/VRN | Reference voltage for I/O banks | Configures input threshold and output drive strength per bank; must be externally decoupled |
| HP[0-71]_IO | High-performance I/O bank pins | Supports 1.8 V/1.5 V/1.35 V/1.2 V standards with programmable slew rate and termination |
| HR[0-47]_IO | High-range I/O bank pins | Compatible with 3.3 V/2.5 V/1.8 V interfaces; used for legacy peripheral bridging |
| INIT_B / PROGRAM_B | Configuration control | Active-low signals managing configuration state machine startup and reconfiguration sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol layers |
| Dual 100G Ethernet MAC + PCS | Enables line-rate packet processing without external PHY; supports IEEE 802.3bj/bs |
| UltraScale+ DSP slices | Delivers 10.3 TMAC/s peak throughput for real-time FIR filtering and beamforming |
| Partial reconfiguration support | Allows runtime logic module swaps in safety-critical systems without system reset or downtime |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I2C/JTAG |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and STAP on airborne radar platforms. IC Role / Device Role / Timing Role: Primary compute engine executing adaptive filtering, FFT, and CFAR detection using hardened DSP and transceiver links to ADC/DAC. Use Value: Achieves sub-100 ns latency between RF sampling and target detection decision via deterministic routing and no-OS firmware execution. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G macro base stations. IC Role / Device Role / Timing Role: Baseband processor interfacing with 4× 25 GbE fronthaul and 8× JESD204B DAC/ADC lanes. Use Value: Supports 8× concurrent DPD coefficient updates at 122.88 MSPS with <1.5% EVM degradation under 64-QAM modulation. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling and redundant link failover. Use Value: Guarantees ≤ 15 μs end-to-end latency and zero packet loss over dual 100 Mbps AFDX channels under DO-254 Level A compliance. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: Real-time digital down-converter and spectral analysis accelerator feeding FPGA-based trigger logic. Use Value: Enables 12-bit ENOB FFT computation at 1 GHz span with <−110 dBc/Hz phase noise floor using on-chip DSP blocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924E | Higher logic density (1,340K cells), 40 GTH transceivers, larger FLVF1924 package | Better suited for multi-100G aggregation or AI inference acceleration requiring >1.2M LUTs | Select when additional DSP slices or transceiver count exceeds XCKU085-3FLVA1517E capacity |
| XCKU060-2FFVA1156I | Lower logic count (740K cells), 24 GTH transceivers, -2 speed grade, industrial temp rating | Targeted at cost-sensitive industrial control with extended temperature operation (-40°C to +100°C) | Choose for thermal-constrained environments where 29.5 W TDP of XCKU085-3FLVA1517E exceeds cooling budget |
Compared with XCKU115-2FLVF1924E and XCKU060-2FFVA1156I, the XCKU085-3FLVA1517E balances transceiver bandwidth, logic capacity, and thermal envelope for mid-tier 5G and radar systems-offering optimal performance-per-watt where full XCKU115 resources are unused and XCKU060 I/O or speed margins are insufficient.
Availability
XCKU085-3FLVA1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics data concentrators requiring stable component supply across long production lifecycles.
Supply support for XCKU085-3FLVA1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Kintex UltraScale family targets high-throughput, low-latency applications in communications infrastructure, defense electronics, and test equipment-emphasizing transceiver bandwidth, DSP efficiency, and deterministic timing.
FAQ
What is the maximum supported data rate for the GTH transceivers on the XCKU085-3FLVA1517E?
The XCKU085-3FLVA1517E supports GTH transceivers rated up to 32.75 GT/s, enabling protocols such as 100G Ethernet (4×25G), CPRI Option 10, and JESD204B subclass 1. This rate is achievable under specified voltage, temperature, and board layout conditions per UG578 v1.14.
Does the XCKU085-3FLVA1517E support partial reconfiguration?
Yes, the XCKU085-3FLVA1517E fully supports partial reconfiguration as defined in UG909. It allows dynamic swapping of logical modules while maintaining active functionality in other regions-critical for fault-tolerant avionics and adaptive radio systems where continuous operation is mandatory.
What I/O standards are supported by the HP I/O banks on the XCKU085-3FLVA1517E?
The HP I/O banks on the XCKU085-3FLVA1517E support LVCMOS, SSTL, HSTL, and differential standards including LVDS and BLVDS at voltages from 1.2 V to 1.8 V. Each bank is independently configurable, allowing mixed-voltage interfaces on a single device.
Is the XCKU085-3FLVA1517E qualified for automotive applications?
No, the XCKU085-3FLVA1517E is not AEC-Q100 qualified. It is rated for commercial and industrial temperature ranges only (0°C to +100°C). For automotive use, AMD offers the XCKU085-3FLVA1517I variant with extended temperature screening and qualification documentation.
What configuration modes does the XCKU085-3FLVA1517E support?
The XCKU085-3FLVA1517E supports Master SPI, Slave SelectMAP, and JTAG configuration modes. It also enables fallback configuration from dual BPI flash devices and supports secure bitstream encryption using AES-256 keys stored in eFUSE.
XCKU085-3FLVA1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU085-3FLVA1517E FAQ
1.How can I place an order for XCKU085-3FLVA1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-3FLVA1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-3FLVA1517E reliable?
The price and inventory of XCKU085-3FLVA1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-3FLVA1517E is usually 5 days.
3.What payment methods are accepted for XCKU085-3FLVA1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-3FLVA1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-3FLVA1517E?
XCKU085-3FLVA1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-3FLVA1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-3FLVA1517E?
For technical support, including XCKU085-3FLVA1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-3FLVA1517E requirements.
6.How does Aetrix verify that XCKU085-3FLVA1517E is sourced from the original manufacturer or authorized distributors?
All XCKU085-3FLVA1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-3FLVA1517E meets industry standards.
7.What is the process for return or replacement of XCKU085-3FLVA1517E?
All XCKU085-3FLVA1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-3FLVA1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-3FLVA1517E part is unused and in its original packaging.
Return procedure for XCKU085-3FLVA1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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