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AMD XCKU085-3FLVB1760E
- Part No.:
- XCKU085-3FLVB1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU085-3FLVB1760E.pdf
- Description:
- IC FPGA 676 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,484
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Product details
Overview
XCKU085-3FLVB1760E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for up to 48.8 Gbps GTY transceivers. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controller, targeting high-bandwidth data processing in 5G infrastructure and radar signal processing.
For engineers reviewing the XCKU085-3FLVB1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (-3), thermal performance in FLVB1760 package, I/O voltage flexibility (1.2–1.8 V), and configuration security options.
Technical Context
The XCKU085-3FLVB1760E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520), and integrated hard IP including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA. Its -3 speed grade guarantees operation at junction temperatures up to 100°C.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,053,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 64.8 Mb - enables large on-die buffering for packet processing or video frame storage |
| GTY Transceivers | 48.8 Gbps max - supports 100G KR4, CEI-28G-VSR, and CPRI over single lanes |
| DDR4 Interface | 2,400 Mbps - drives up to eight 72-bit DDR4 DIMMs with ECC support |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows direct interfacing with sensors, ADCs, and SerDes PHYs |
| Configuration Security | AES-256 + HMAC - prevents unauthorized bitstream loading and cloning |
Pinout & Package
The XCKU085-3FLVB1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm pitch, designed for high thermal dissipation and signal integrity in multi-GHz routing environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8 V I/O standard |
| HP[0:63] | High-Performance I/O Bank | Supports 1.2–1.35 V standards including DDR4 and MIPI D-PHY |
| GTY_TX/RX[0:23] | Transceiver Lane Pair | Each pair operates up to 48.8 Gbps; includes CDR, gearbox, and PRBS generator |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for differential I/O standards like LVDS and SLVS |
| CONFIG_MODE[0:2] | Configuration Mode Select | Determines boot source: SPI, BPI, or SelectMAP interface |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and ensures compliance without external PHY |
| Dual 100G Ethernet MAC | Enables line-rate packet forwarding in telecom core routers without external MAC logic |
| UltraScale+ DSP Slices | Deliver 10.9 TeraMAC/s for real-time beamforming or channel estimation |
| Partial Reconfiguration | Allows runtime swap of functional modules-e.g., switching between radar waveform engines |
| 16nm FinFET Process | Improves power efficiency by ~35% vs. 28nm Kintex-7 at equivalent throughput |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: Primary compute engine executing OFDM modulation, channel estimation, and digital pre-distortion algorithms. Use Value: XCKU085-3FLVB1760E delivers deterministic latency under 500 ns for closed-loop feedback control loops. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR systems operating at X-band. IC Role / Device Role / Timing Role: High-throughput FFT accelerator and matched filter engine synchronized to radar timing generator. Use Value: XCKU085-3FLVB1760E sustains 2.1 billion complex-point FFTs/sec using distributed memory and pipelined DSP slices. |
| High-Frequency Trading Engine | Optical Transport Network Switching |
Use Scenario: Sub-microsecond order matching and risk checking in co-located exchange gateways. IC Role / Device Role / Timing Role: Deterministic low-latency packet classifier and state-machine executor with timestamp alignment. Use Value: XCKU085-3FLVB1760E achieves 83 ns wire-to-wire latency from 10G Ethernet ingress to PCIe egress. | Use Scenario: OTU4 frame mapping, FEC decoding, and ODUk switching in metro DWDM line cards. IC Role / Device Role / Timing Role: Line-side framer and switch fabric controller with synchronous clock domain crossing. Use Value: XCKU085-3FLVB1760E supports full OTU4 (112 Gbps) line rate with <1 ppm frequency accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU085-2FLVB1760I | Lower speed grade (-2), rated for 85°C max junction temperature; 10–15% lower transceiver bandwidth | Suitable for cost-sensitive industrial controllers where thermal margin exceeds 15°C | Select when system cooling budget allows relaxed timing closure and lower power draw |
| VU13P-2FHGB2104E | Higher logic density (1.3M cells), 58 Gbps GTM transceivers, but larger 2104-pin package and higher static power | Better suited for AI inference acceleration or multi-100G packet processing requiring >1.2Tbps internal fabric bandwidth | Choose when XCKU085-3FLVB1760E logic or transceiver resources are saturated |
Compared with XCKU085-2FLVB1760I, the XCKU085-3FLVB1760E enables tighter timing closure in thermally constrained 5G radio units; versus VU13P-2FHGB2104E, it offers better power efficiency per Gbps and smaller PCB footprint for space-constrained line cards.
Availability
XCKU085-3FLVB1760E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-frequency trading hardware requiring stable component supply across multi-year production cycles.
Supply support for XCKU085-3FLVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Kintex UltraScale family targets high-throughput, low-latency applications in wired communications, test & measurement, and defense electronics where deterministic timing and hardened IP are critical.
FAQ
What is the maximum operating junction temperature for XCKU085-3FLVB1760E?
The XCKU085-3FLVB1760E has a maximum junction temperature rating of 100°C, validated under the -3 speed grade specification. This allows deployment in forced-air-cooled 5G macro base stations without requiring liquid cooling. Thermal derating curves and power consumption tables for XCKU085-3FLVB1760E are provided in UG578 v1.14, Table 3-4.
Does XCKU085-3FLVB1760E support PCIe Gen4?
No, XCKU085-3FLVB1760E integrates hardened PCIe Gen3 x16 blocks only. It does not support Gen4 signaling rates or associated protocol extensions. For PCIe Gen4 capability, AMD recommends the Virtex UltraScale+ VU13P or Versal ACAP families. XCKU085-3FLVB1760E remains fully compliant with PCIe Gen3.1 specifications.
Can XCKU085-3FLVB1760E configure from a parallel NOR flash device?
Yes, XCKU085-3FLVB1760E supports Slave SelectMAP configuration mode, enabling boot from parallel NOR flash devices such as Spansion S29GL512S. Configuration data is loaded at up to 160 MHz, with CRC verification and fallback address support. This mode is commonly used in radar systems requiring fast, reliable cold-start behavior for XCKU085-3FLVB1760E.
What DDR4 memory configurations are supported by XCKU085-3FLVB1760E?
XCKU085-3FLVB1760E supports DDR4-2400 with 16-bit, 32-bit, and 72-bit (with ECC) interfaces across HP I/O banks. It implements a hardened memory controller with write leveling, read leveling, and gate training. Dual-rank, 8Gb-density DDR4 components are verified in Xilinx UG586 v1.11 for XCKU085-3FLVB1760E designs.
Is partial reconfiguration supported on XCKU085-3FLVB1760E?
Yes, XCKU085-3FLVB1760E fully supports dynamic partial reconfiguration (PR) using Vivado Design Suite 2022.2 or later. PR regions can be updated independently while the rest of the design remains operational-enabling waveform agility in radar or protocol adaptation in 5G front-haul. Bitstream validation and secure PR are implemented in XCKU085-3FLVB1760E hardware.
XCKU085-3FLVB1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 62190
- Number of Logic Elements/Cells:
- 1088325
- Total RAM Bits:
- 58265600
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU085-3FLVB1760E FAQ
1.How can I place an order for XCKU085-3FLVB1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU085-3FLVB1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU085-3FLVB1760E reliable?
The price and inventory of XCKU085-3FLVB1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-3FLVB1760E is usually 5 days.
3.What payment methods are accepted for XCKU085-3FLVB1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-3FLVB1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU085-3FLVB1760E?
XCKU085-3FLVB1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU085-3FLVB1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU085-3FLVB1760E?
For technical support, including XCKU085-3FLVB1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-3FLVB1760E requirements.
6.How does Aetrix verify that XCKU085-3FLVB1760E is sourced from the original manufacturer or authorized distributors?
All XCKU085-3FLVB1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-3FLVB1760E meets industry standards.
7.What is the process for return or replacement of XCKU085-3FLVB1760E?
All XCKU085-3FLVB1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-3FLVB1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU085-3FLVB1760E part is unused and in its original packaging.
Return procedure for XCKU085-3FLVB1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU085-3FLVB1760E Tags
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