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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCKU085-L1FLVB1760I

Name: XCKU085-L1FLVB1760I
Brand: AMD
SKU: XCKU085-L1FLVB1760I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCKU085-L1FLVB1760I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 1760-BBGA, FCBGA

Datasheet:: XCKU085-L1FLVB1760I.pdf

Description:: IC FPGA 676 I/O 1760FCBGA

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Product details

Overview

XCKU085-L1FLVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,053K logic cells, 64.8 Mb of block RAM, and support for up to 48.8 Gbps GTY transceivers. It integrates hardened PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.

For engineers reviewing the XCKU085-L1FLVB1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance under sustained 28 W typical power, and configuration via dual BPI NOR flash or JTAG.

Technical Context

The XCKU085-L1FLVB1760I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and integrated hard IP including 24 GTY transceivers, 4 PCIe Gen3 x16 blocks, and 4 100G Ethernet MACs. It supports multi-rate serial protocols from 1.6 to 32.75 Gbps per GTY channel.

Configuration uses 32-bit wide x16 parallel NOR flash or JTAG boundary-scan, with bitstream encryption via AES-256 and HMAC authentication. I/O banks are independently configurable for SSTL, HSTL, LVCMOS, and differential standards including LVDS and MIPI D-PHY.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	1,053,000 - determines maximum combinational/sequential logic capacity for complex algorithm acceleration
Block RAM	64.8 Mb - enables large on-die buffering for video frame stores or packet reassembly
GTY Transceivers	24 × up to 32.75 Gbps - supports 100G/400G Ethernet, CPRI/eCPRI, and JESD204B/C interfaces
PCIe Interface	Gen3 x16 hard IP - delivers 16 GT/s per lane with full protocol stack offload
DDR4 Support	2,400 MT/s across 4 banks - enables high-throughput memory access for real-time baseband processing
Thermal Design Power	28 W typical - defines heatsink sizing and airflow requirements for conduction-cooled enclosures
I/O Standards	SSTL-12/15/18, HSTL-I/II, LVDS, MIPI D-PHY - allows direct interfacing to FPGAs, ADCs, DACs, and SerDes PHYs

Pinout & Package

This device is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via exposed thermal lid.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O Bank 65	Configurable as SDIO, UART, SPI, or GPIO; voltage selectable between 1.8 V and 3.3 V
HP[0:71]	High-Performance I/O Banks 48–53	Supports 1.2 V to 1.8 V operation; compatible with DDR4, LPDDR4, and QDR IV interfaces
GTY_TX/RX[0:23]	Transceiver Differential Pairs	Each pair operates at 1.6–32.75 Gbps; requires AC-coupled 100 Ω differential routing
PCIE_CLK_P/N	Dedicated PCIe Reference Clock Input	25 MHz or 100 MHz differential input; feeds all four PCIe hard blocks
VCCINT	Core Logic Supply	0.85 V ±3% regulated supply; powers CLBs, routing, and interconnect
VCCAUX	Auxiliary Supply	1.8 V ±3% supply for configuration logic, clock management, and transceiver analog circuitry

Key Features

Feature	Design Value
Hardened PCIe Gen3 x16	Reduces RTL integration effort by eliminating soft-core PCIe controller synthesis and timing closure risk
24 GTY Transceivers	Enables single-chip 100G Ethernet + 4×10G KR backplane links without external retimers
AES-256 Bitstream Encryption	Prevents IP theft during field programming and ensures secure remote updates
UltraScale+ DSP Slices	Delivers 10.9 TMAC/s peak compute for radar FFTs, beamforming, and 5G channel estimation
Multi-Voltage I/O Banks	Eliminates level-shifter ICs when interfacing with legacy 3.3 V peripherals and modern 1.2 V memory

Applications

Radar Signal Processing	5G Massive MIMO Baseband
Use Scenario: Real-time pulse-Doppler processing and CFAR detection on airborne SAR platforms. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, filtering, and beam steering algorithms with deterministic latency. Use Value: 2,520 DSP slices deliver 10.9 TMAC/s to sustain 200 MHz sample rates across 128 antenna channels.	Use Scenario: Uplink/downlink precoding and channel coding for 64T64R massive MIMO radio units. IC Role / Device Role / Timing Role: Baseband processor handling Layer 1 PHY functions with tight synchronization to RF front-end clocks. Use Value: 24 GTY transceivers interface directly to eight 25G optical modules, eliminating external SerDes chips.
High-Fidelity Test Equipment	Avionics Data Concentrators
Use Scenario: Multi-channel arbitrary waveform generation and real-time spectral analysis in PXIe vector signal analyzers. IC Role / Device Role / Timing Role: Timing-critical waveform synthesis engine synchronized to ultra-low-jitter 10 MHz reference clocks. Use Value: 48.8 Gbps GTY aggregate bandwidth supports simultaneous streaming of 16× 14-bit 1.25 GS/s ADC channels.	Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic network switch and protocol accelerator with sub-microsecond packet latency. Use Value: Hardened 100G Ethernet MACs enable AFDX virtual link shaping at 100 Mbps with guaranteed jitter < 100 ns.

Radar Signal Processing

5G Massive MIMO Baseband

Use Scenario: Real-time pulse-Doppler processing and CFAR detection on airborne SAR platforms.

IC Role / Device Role / Timing Role: Primary compute engine executing FFT, filtering, and beam steering algorithms with deterministic latency.

Use Value: 2,520 DSP slices deliver 10.9 TMAC/s to sustain 200 MHz sample rates across 128 antenna channels.

Use Scenario: Uplink/downlink precoding and channel coding for 64T64R massive MIMO radio units.

IC Role / Device Role / Timing Role: Baseband processor handling Layer 1 PHY functions with tight synchronization to RF front-end clocks.

Use Value: 24 GTY transceivers interface directly to eight 25G optical modules, eliminating external SerDes chips.

High-Fidelity Test Equipment

Avionics Data Concentrators

Use Scenario: Multi-channel arbitrary waveform generation and real-time spectral analysis in PXIe vector signal analyzers.

IC Role / Device Role / Timing Role: Timing-critical waveform synthesis engine synchronized to ultra-low-jitter 10 MHz reference clocks.

Use Value: 48.8 Gbps GTY aggregate bandwidth supports simultaneous streaming of 16× 14-bit 1.25 GS/s ADC channels.

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers.

IC Role / Device Role / Timing Role: Deterministic network switch and protocol accelerator with sub-microsecond packet latency.

Use Value: Hardened 100G Ethernet MACs enable AFDX virtual link shaping at 100 Mbps with guaranteed jitter < 100 ns.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCKU115-FLVD1924E	1,322K logic cells, 76.2 Mb BRAM, same GTY count but higher speed grade (−2E)	Targets higher-clock-frequency DSP kernels and wider datapaths in military EW systems	Select when >280 MHz system clock or >32 Gbps GTY line rate is required
XCKU060-FFVA1156I	747K logic cells, 45.1 Mb BRAM, 16 GTY transceivers, smaller 1156-pin FCBGA	Suitable for cost-optimized 25G Ethernet switches and mid-tier radar processors	Choose for reduced BOM cost and simpler thermal design where 24 GTY lanes are unnecessary

Compared with XCKU085-L1FLVB1760I, the XCKU115-FLVD1924E offers higher logic density and speed grade for extreme throughput, while the XCKU060-FFVA1156I trades transceiver count and logic capacity for lower cost and footprint-enabling tiered platform scaling across performance bands.

Availability

XCKU085-L1FLVB1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics data concentrator designs requiring stable component supply and long-term industrial lifecycle support.

Supply support for XCKU085-L1FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding high I/O bandwidth, hardened protocol engines, and scalable logic resources-optimized for 5G infrastructure, defense radar, and test instrumentation.

FAQ

What is the maximum supported DDR4 data rate for XCKU085-L1FLVB1760I?

The XCKU085-L1FLVB1760I supports DDR4 memory interfaces operating at up to 2,400 MT/s across four independent memory controller banks. This capability is implemented using dedicated hard IP with calibrated write leveling and read-leveling circuitry, enabling reliable high-speed memory access for real-time signal processing workloads without custom PHY development.

Does XCKU085-L1FLVB1760I include built-in PCIe Gen3 support?

Yes, the XCKU085-L1FLVB1760I integrates four hardened PCIe Gen3 x16 endpoints, each supporting full 8 GT/s per lane with integrated DMA engines and TLP parsing. These blocks operate independently and can be configured as root complexes or endpoints, reducing FPGA resource usage and simplifying compliance testing compared to soft-core implementations.

What configuration methods are supported by XCKU085-L1FLVB1760I?

XCKU085-L1FLVB1760I supports primary configuration via 32-bit-wide x16 parallel NOR flash using BPI mode, as well as JTAG boundary-scan for debugging and programming. It also supports fallback configuration from secondary flash and secure boot with AES-256 decryption and HMAC authentication to prevent unauthorized bitstream loading.

What is the thermal design power (TDP) of XCKU085-L1FLVB1760I under typical operation?

The XCKU085-L1FLVB1760I has a typical thermal design power of 28 W under representative high-activity conditions, including active GTY transceivers, DDR4 memory controllers, and 70% logic utilization. This value guides heatsink selection and airflow requirements for conduction- or forced-air-cooled enclosures in ruggedized deployments.

Which I/O standards are supported on the HP I/O banks of XCKU085-L1FLVB1760I?

The HP I/O banks of XCKU085-L1FLVB1760I support SSTL-12, SSTL-15, SSTL-18, HSTL-I, HSTL-II, LVDS, and MIPI D-PHY standards, with programmable drive strength and on-die termination. Voltage levels are configurable per bank from 1.2 V to 1.8 V, enabling direct interface to DDR4, LPDDR4, and high-speed ADC/DAC devices without external level shifters.

XCKU085-L1FLVB1760I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Kintex® UltraScale™

Package/Case:: 1760-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 62190

Number of Logic Elements/Cells:: 1088325

Total RAM Bits:: 58265600

Number of I/O:: 676

Number of Gates:: -

Voltage - Supply:: 0.880V ~ 0.979V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 1760-FCBGA (42.5x42.5)

XCKU085-L1FLVB1760I FAQ

1.How can I place an order for XCKU085-L1FLVB1760I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU085-L1FLVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU085-L1FLVB1760I reliable?

The price and inventory of XCKU085-L1FLVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU085-L1FLVB1760I is usually 5 days.

3.What payment methods are accepted for XCKU085-L1FLVB1760I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU085-L1FLVB1760I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU085-L1FLVB1760I?

XCKU085-L1FLVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU085-L1FLVB1760I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU085-L1FLVB1760I?

For technical support, including XCKU085-L1FLVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU085-L1FLVB1760I requirements.

6.How does Aetrix verify that XCKU085-L1FLVB1760I is sourced from the original manufacturer or authorized distributors?

All XCKU085-L1FLVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU085-L1FLVB1760I meets industry standards.

7.What is the process for return or replacement of XCKU085-L1FLVB1760I?

All XCKU085-L1FLVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU085-L1FLVB1760I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU085-L1FLVB1760I part is unused and in its original packaging.

Return procedure for XCKU085-L1FLVB1760I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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