AMD XCKU095-1FFVA1156C

Overview

XCKU095-1FFVA1156C from AMD is a high-performance Kintex UltraScale FPGA with 927,000 logic cells, 4,580 DSP slices, and 64.2 Mb of block RAM. It features 580 GTY transceivers supporting up to 32.75 Gb/s, integrated PCIe Gen3 x16 endpoint, and operates at -1 speed grade (1.0V core, 0°C to 85°C junction). It is deployed in 5G wireless infrastructure baseband processing units.

For engineers reviewing the XCKU095-1FFVA1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and data rate, DSP slice density for real-time signal processing, PCIe Gen3 endpoint integration, and thermal performance in air-cooled 5G macro base stations.

Technical Context

The XCKU095-1FFVA1156C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 endpoint, 100G Ethernet MAC, and UltraScale+ memory controllers. Its GTY transceivers support PAM4 and NRZ modulation with built-in PRBS generators/checkers.

It uses 20nm bulk CMOS process technology, supports DDR4-2400 memory interfaces with 16-bit/32-bit bus widths, and includes dual 32-bit AXI4 interconnects for high-throughput data movement between PL and PS domains when used with Zynq UltraScale+ MPSoC companion devices.

Key Specifications

Pinout & Package

Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, 35 mm × 35 mm body, RoHS-compliant, lead-free solder finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA-based 5G baseband processing applications.

Compared with XCKU095-1FFVA1156C, the XCKU115-2FLVD1517I offers higher thermal and timing headroom at the cost of larger footprint and higher power, while the XCKU085-1FLVA1156E reduces computational capacity within identical board space-enabling scalable 5G hardware platforms across macro, micro, and pico cell tiers.

Availability

XCKU095-1FFVA1156C is available at Aetrix Electronics and suitable for 5G wireless infrastructure, high-performance computing accelerators, and aerospace telemetry systems requiring stable component supply across multi-year production cycles.

Supply support for XCKU095-1FFVA1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA and adaptive SoC architectures since acquiring Xilinx in 2022.

The Kintex UltraScale family delivers optimized performance-per-watt for wired/wireless infrastructure, offering hardened IP and scalable logic resources for 5G, cloud, and test/measurement applications.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCKU095-1FFVA1156C?

The XCKU095-1FFVA1156C supports up to 32.75 Gb/s per GTY transceiver lane using NRZ signaling, and 58.0 Gb/s using PAM4 modulation. This capability is verified in the UltraScale Architecture GTY Transceiver User Guide (UG578 v1.12), and enables direct eCPRI fronthaul connectivity without external retimers in 5G radio units.

Does XCKU095-1FFVA1156C include a hardened PCIe Gen3 endpoint?

Yes, XCKU095-1FFVA1156C integrates a hardened PCIe Gen3 x16 endpoint block. It complies with PCI Express Base Specification Revision 3.0 and supports ECN 2.1. This eliminates the need for soft PCIe IP cores and ensures deterministic latency and power efficiency in vRAN distributed unit designs.

What is the operating temperature range for XCKU095-1FFVA1156C?

XCKU095-1FFVA1156C is rated for commercial temperature operation: 0°C to 85°C junction temperature. The "-C" suffix explicitly denotes this range, and thermal design must maintain junction temperature within these limits under full transceiver and DSP load in air-cooled 5G base station enclosures.

Can XCKU095-1FFVA1156C support DDR4 memory interfaces?

Yes, XCKU095-1FFVA1156C supports DDR4-2400 memory interfaces via its UltraScale+ memory controller. It implements 16-bit or 32-bit wide interfaces with on-die termination and ECC support, enabling direct connection to standard DDR4 SO-DIMMs in baseband processing units without external memory controller ASICs.

Is partial reconfiguration supported on XCKU095-1FFVA1156C?

Yes, XCKU095-1FFVA1156C supports Dynamic Function eXchange (DFX) for partial reconfiguration. Verified in UG909 (v2023.2), it allows runtime swapping of bitstreams targeting specific logic regions-used in 5G base stations to dynamically load numerology-specific PHY configurations without full device reset.