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AMD XCKU095-1FFVA1156I
- Part No.:
- XCKU095-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU095-1FFVA1156I.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,400
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Product details
Overview
XCKU095-1FFVA1156I from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -40°C to +100°C junction temperature. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU095-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (32 GTY), I/O voltage support (1.2V/1.35V/1.8V), thermal design power (170W typical), and package footprint compatibility with FFVA1156.
Technical Context
The XCKU095-1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet, and memory controllers. Its GTY transceivers deliver 32.75 Gb/s per lane with built-in PRBS generation and error detection.
It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC variant-but the XCKU095-1FFVA1156I is a standalone FPGA without integrated processors. Configuration occurs via quad-SPI, BPI, or JTAG, supporting bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 5,520 - enables parallel fixed/floating-point computation for radar, AI inference, or video encoding |
| Block RAM | 64.2 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTY Transceivers | 32 lanes @ 32.75 Gb/s - supports 100G Ethernet, CPRI, or high-speed serial backplane interconnect |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - allows direct interface to DDR4, sensors, FMC mezzanines, and ADCs/DACs |
| Operating Temp | -40°C to +100°C - qualified for industrial and aerospace environments without derating |
| TDP | 170 W typical - requires active cooling and careful PCB thermal vias placement in dense layouts |
Pinout & Package
Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, thermally enhanced with exposed thermal slug. Compatible with standard reflow profiles and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, SPI, UART, or I2C; shared with PS in MPSoC variants but unused in XCKU095-1FFVA1156I |
| HR Bank 0–3 | High-Range I/O | Supports 1.2V–1.8V signaling; used for DDR4 address/control and peripheral interfaces |
| HP Bank 4–7 | High-Performance I/O | Supports 1.2V/1.35V; optimized for DDR4 data bus and high-speed SerDes reference clocks |
| GTY_RXN/P[0:31] | Transceiver Input | Differential AC-coupled inputs for 32 GTY lanes; require precise 100Ω differential trace routing |
| GTY_TXN/P[0:31] | Transceiver Output | Differential AC-coupled outputs; each pair drives one 32.75 Gb/s serial lane |
| VCCINT | Core Power | 0.95V supply for logic fabric and CLBs; requires low-noise, high-current VRM regulation |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables time-multiplexed logic (SRL, LUTRAM) and hierarchical clocking for deterministic timing closure |
| 32 GTY Transceivers | Each supports protocol stacks including 100G Ethernet MAC, OTN, and JESD204B/C for ADC/DAC interfacing |
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees compliance with ECN and LTSSM state machine requirements |
| DDR4 Memory Controller | Hardened controller supports dual-rank 72-bit wide DDR4-2400 with ECC, eliminating soft-core latency and calibration overhead |
| Bitstream Encryption | AES-256 + HMAC-SHA256 prevents cloning and unauthorized configuration loading in field-deployed systems |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers interface with high-speed ADC/DAC FMC modules. Use Value: 942K logic cells enable full pipeline implementation of multi-channel digital beamformer; 32 GTY lanes support simultaneous I/Q data streaming from 64 antenna elements. | Use Scenario: Distributed unit (DU) baseband processing for 5G NR with 256-QAM modulation and 100 MHz channel bandwidth. IC Role / Device Role / Timing Role: Accelerates layer-1 PHY functions (FFT/iFFT, LDPC encoding/decoding) and handles fronthaul (eCPRI) transport over 25G Ethernet. Use Value: 5,520 DSP slices deliver >2.1 TMAC/s for real-time LDPC decoding; PCIe Gen3 x16 connects to host CPU for control plane offload. |
| High-Frequency Trading Engine | Medical Imaging Reconstruction |
Use Scenario: Sub-microsecond latency order matching and risk checking in co-located exchange gateways. IC Role / Device Role / Timing Role: Implements deterministic packet parsing, rule evaluation, and order dispatch using hardwired logic and low-latency BRAM-based lookup tables. Use Value: 170W TDP allows sustained 500+ MHz clock domains; HR/HP I/O banks directly drive 10G SFP+ and ultra-low-jitter clock distribution networks. | Use Scenario: Real-time iterative reconstruction of PET/CT volumetric images from raw sinogram data. IC Role / Device Role / Timing Role: Executes GPU-like parallel backprojection kernels and compressed sensing solvers using DSP-rich fabric and block RAM buffers. Use Value: 64.2 Mb block RAM stores multiple sinogram frames and intermediate reconstructions; DDR4-2400 controller feeds high-throughput data pipelines to compute units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 1.14M logic cells, 6,320 DSP slices, 72.2 Mb BRAM, 36 GTY lanes, larger 1517-pin FLVD package | Higher density and bandwidth; suited for next-gen 400G Ethernet line cards and AI training accelerators | Select when >942K logic cells or >32 GTY lanes are required; verify PCB redesign for FLVD1517 mechanical footprint |
| VU37P-2FLGC2104I | Virtex UltraScale+ device with 3.7M logic cells, 12,288 DSP slices, 102.4 Mb BRAM, 64 GTY lanes, 2104-pin FLGC package | Targeted at extreme-scale compute: ASIC prototyping, cloud FPGA acceleration, and multi-terabit switching | Choose for maximum scalability and transceiver count; expect higher cost, power (250W+), and cooling complexity than XCKU095-1FFVA1156I |
Compared with XCKU095-1FFVA1156I, the XCKU115-2FLVD1517I offers incremental density and I/O expansion within the same UltraScale family, while the VU37P-2FLGC2104I represents a step-up to the Virtex tier for applications demanding significantly higher logic, DSP, and serial bandwidth-requiring reassessment of thermal, power delivery, and board layout constraints.
Availability
XCKU095-1FFVA1156I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-frequency trading systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU095-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex UltraScale family targets high-performance, cost-optimized applications such as communications infrastructure, test & measurement, and vision systems where balanced logic density, transceiver count, and power efficiency are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-1FFVA1156I?
The XCKU095-1FFVA1156I supports DDR4 memory interfaces up to 2400 MT/s with its hardened memory controller. This capability is verified in UG576 and applies to both single- and dual-rank configurations with ECC enabled. The controller handles write leveling, read leveling, and gate training automatically, reducing system-level calibration burden. XCKU095-1FFVA1156I achieves this performance using HP I/O banks configured for 1.2V operation and matched-length fly-by topology routing.
Does XCKU095-1FFVA1156I include integrated ARM processors?
No, the XCKU095-1FFVA1156I is a standalone FPGA and does not contain integrated ARM Cortex-A53 or Cortex-R5 processors. Those are present only in Zynq UltraScale+ MPSoC variants (e.g., XCZU9EG). The XCKU095-1FFVA1156I relies entirely on programmable logic for user-defined functionality and uses external processors for control-plane tasks. All configuration and debug interfaces-including JTAG and ICAP-are accessible via dedicated pins on the XCKU095-1FFVA1156I package.
What transceiver protocols are natively supported by XCKU095-1FFVA1156I's GTY lanes?
XCKU095-1FFVA1156I's 32 GTY transceivers natively support PCIe Gen3, 10/25/100G Ethernet (via USRCLK and GTYE3_CHANNEL primitives), CPRI, OBSAI, and JESD204B/C. Protocol stack implementation is achieved through Xilinx IP cores (e.g., 100G Ethernet Subsystem, CPRI LogiCORE) validated for UltraScale architecture. XCKU095-1FFVA1156I does not support native SATA or USB3.0 without external bridging logic.
What is the recommended configuration mode for XCKU095-1FFVA1156I in production systems?
For production systems, master SPI (quad-SPI) is the recommended configuration mode for XCKU095-1FFVA1156I due to its balance of speed, pin count efficiency, and security. Quad-SPI supports bitstream encryption (AES-256) and HMAC authentication, preventing unauthorized programming. XCKU095-1FFVA1156I also supports BPI and JTAG, but quad-SPI offers faster load times (~100 ms for full bitstream) and simpler board routing than parallel BPI. Configuration fallback and multi-boot are supported via QSPI flash partitioning.
Is XCKU095-1FFVA1156I pin-compatible with other Kintex UltraScale devices?
No, XCKU095-1FFVA1156I is not pin-compatible with other Kintex UltraScale devices-even those in the same FFVA1156 package variant-due to differences in I/O bank allocation, GTY transceiver placement, and power/ground pin mapping. For example, XCKU060-2FFVA1156I uses different HR/HP bank assignments and lacks GTY transceivers entirely. Migration between Kintex UltraScale parts requires PCB redesign. XCKU095-1FFVA1156I pinout is fixed and documented in UG575 Table 1-12.
XCKU095-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU095-1FFVA1156I FAQ
1.How can I place an order for XCKU095-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-1FFVA1156I reliable?
The price and inventory of XCKU095-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU095-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-1FFVA1156I?
XCKU095-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-1FFVA1156I?
For technical support, including XCKU095-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU095-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU095-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU095-1FFVA1156I?
All XCKU095-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU095-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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