AMD XCKU095-1FFVB1760C

Overview

XCKU095-1FFVB1760C from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU095-1FFVB1760C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (29.5 W typical).

Technical Context

The XCKU095-1FFVB1760C implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, and scalable transceiver banks supporting PAM4 and NRZ signaling. Its UltraScale+ architecture enables time-division multiplexing across I/O banks and dynamic reconfiguration via partial reconfiguration bitstreams.

It integrates 24 clock management tiles (CMTs) with MMCM and PLL resources, supports JTAG and ICAP configuration interfaces, and complies with IEEE 1149.1 and 1532 standards for boundary-scan and programming. Configuration occurs via quad-SPI, BPI, or SelectMAP interfaces with AES-256 bitstream encryption.

Key Specifications

Pinout & Package

The XCKU095-1FFVB1760C is housed in a 1760-pin FCBGA package (Fine-Pitch Column Grid Array) with 35 mm × 35 mm body size, 0.8 mm pitch, and thermal lid. It features 624 user I/O pins distributed across 24 banks, each supporting independent VCCO and VREF settings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU095-1FFVB1760C, the XCKU115 offers greater scalability at higher power and board area cost, while the XCKU060 trades capacity and speed for thermal robustness and footprint reduction-enabling tiered platform design across performance bands.

Availability

XCKU095-1FFVB1760C is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-frequency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCKU095-1FFVB1760C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and datacenter acceleration technologies.

The Kintex UltraScale family delivers optimized balance of logic capacity, transceiver bandwidth, and power efficiency for compute-intensive, I/O-rich applications including wired/wireless infrastructure and real-time analytics.

FAQ

What is the maximum supported DDR4 data rate for XCKU095-1FFVB1760C?

XCKU095-1FFVB1760C supports DDR4 memory interfaces up to 2400 MT/s with native controller hard IP. This includes support for x4/x8/x16 configurations, on-die termination, and ECC. The memory controller is integrated into the UltraScale+ architecture and does not require external PHY components. XCKU095-1FFVB1760C achieves this rate using calibrated I/O banks with programmable drive strength and fine-grained timing controls.

Does XCKU095-1FFVB1760C support partial reconfiguration?

Yes, XCKU095-1FFVB1760C fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of logic modules without resetting the entire device. XCKU095-1FFVB1760C uses frame-based bitstream loading and hierarchical design partitioning to isolate reconfigurable regions. Applications such as protocol adaptation and real-time filter updates rely on this feature in XCKU095-1FFVB1760C-based systems.

What configuration modes are supported by XCKU095-1FFVB1760C?

XCKU095-1FFVB1760C supports Quad-SPI, BPI, and SelectMAP configuration modes. Quad-SPI enables fast boot from serial flash with single- or dual-image fallback. BPI mode supports parallel NOR flash with high throughput. SelectMAP allows host processor-driven configuration via 8-/16-bit parallel bus. All modes support AES-256 encrypted bitstreams. XCKU095-1FFVB1760C also supports JTAG for debugging and ICAP for runtime reconfiguration.

What is the operating temperature range for XCKU095-1FFVB1760C?

XCKU095-1FFVB1760C is rated for commercial temperature operation: 0°C to +85°C ambient. Its thermal design power is specified at 29.5 W under typical workload conditions. Adequate airflow and a properly mounted heatsink are required to maintain junction temperature within safe limits. XCKU095-1FFVB1760C includes on-die temperature sensors and thermal shutdown circuitry. Derating guidelines apply above 65°C ambient.

How many transceiver quads does XCKU095-1FFVB1760C include?

XCKU095-1FFVB1760C contains 32 transceiver quads, delivering up to 128 transceiver lanes. Each quad supports NRZ signaling up to 28.3 Gb/s and PAM4 up to 56 Gb/s. Transceiver banks are grouped into four I/O columns with independent power and reference voltage domains. XCKU095-1FFVB1760C uses GTY transceivers with built-in PRBS generators, eye monitors, and adaptive equalization for signal integrity optimization.