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AMD XCKU095-1FFVB1760I
- Part No.:
- XCKU095-1FFVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU095-1FFVB1760I.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,561
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Product details
Overview
XCKU095-1FFVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU095-1FFVB1760I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, I/O bank voltage support, thermal envelope (1760-pin flip-chip BGA), and configuration interface compatibility with SPIx4 or BPI.
Technical Context
The XCKU095-1FFVB1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, and multi-rate transceivers supporting protocols including CPRI, JESD204B/C, and SATA. Its UltraScale architecture uses 20nm process technology and includes dedicated routing for clock and reset distribution.
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor. The device supports partial reconfiguration and dynamic function exchange, enabling runtime adaptation in radar and software-defined radio applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 5,520 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 64.2 Mb - supports large on-die buffering for video frame stores or packet queues |
| Transceiver Speed | 28.3 Gb/s - meets line rates for 100G KR4, CEI-28G, and 400G-FR8 optical interfaces |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows direct interfacing with ADCs, DACs, and memory without level-shifting |
| Configuration Interface | Master SPI x4 or Slave SelectMAP - defines boot source flexibility and programming bandwidth |
Pinout & Package
Package: 1760-pin Flip-Chip Ball Grid Array (FFVB), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V/3.3V operation |
| HR_IO_L[0:76] | High-Range I/O Bank | Supports 1.2V–3.3V signaling; used for DDR4 address/control and peripheral interfaces |
| HP_IO_L[0:119] | High-Performance I/O Bank | 1.2V/1.35V/1.8V only; required for 28.3 Gb/s transceiver lanes and memory data bus |
| CLK_IN_0/1 | Dedicated Clock Input | Accepts differential LVDS or single-ended CMOS clocks for MMCM/PLL reference |
| CONFIG_MODE[0:2] | Configuration Mode Pins | Set boot mode at power-up (e.g., Master SPI, Slave SelectMAP, JTAG) |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables hierarchical design partitioning and predictable timing closure across multi-million-gate systems |
| Hardened PCIe Gen3 x16 Block | Reduces integration effort and latency for host CPU offload in compute-accelerated servers |
| JESD204B/C Support | Direct link to high-speed ADC/DACs with deterministic latency and lane synchronization |
| Partial Reconfiguration | Allows functional modules to be swapped dynamically without system reset-critical for adaptive radar waveforms |
| Integrated Memory Controller | Supports DDR4-2400 and LPDDR4-4266 with ECC, eliminating need for external controller logic |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface with RFICs via JESD204C. Use Value: 28.3 Gb/s transceivers and 5,520 DSP slices enable sub-microsecond latency loop closure for adaptive waveform updates. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR base stations with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Configurable logic implements DPD lookup tables and adaptive filtering; PCIe Gen3 x16 connects to host CPU for control plane. Use Value: High DSP density and low-latency memory subsystem allow concurrent execution of multiple DPD kernels per antenna sector. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: Hardware-accelerated database query processing and AI inference offload in cloud server racks. IC Role / Device Role / Timing Role: Logic fabric hosts custom search engines and quantized neural network accelerators; DDR4-2400 buffers dataset streams. Use Value: 64.2 Mb block RAM and 942K logic cells support large-scale hash tables and parallel inference pipelines without external DRAM bottlenecks. | Use Scenario: High-fidelity protocol analysis and jitter tolerance testing for 100G/400G Ethernet and InfiniBand links. IC Role / Device Role / Timing Role: Transceivers capture and regenerate multi-lane serial traffic; logic fabric performs real-time BER calculation and eye diagram generation. Use Value: Deterministic transceiver calibration and on-chip clock data recovery eliminate external test instrumentation for compliance validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Higher speed grade (-2), 1,133K logic cells, 1924-pin package, larger thermal footprint | Better suited for designs requiring >28.3 Gb/s transceiver margin or >64.2 Mb on-chip memory | Select when timing closure requires additional slack or higher I/O count is needed for multi-chip interconnect |
| XCKU085-2FFVA1156I | Fewer logic cells (820K), lower transceiver count (40 vs. 52), 1156-pin package, reduced power envelope | Targeted at cost-sensitive 5G small cells and mid-tier test equipment where full XCKU095 capability is unused | Choose when design fits within 820K LC budget and 40 transceivers suffice for target protocol stack |
Compared with XCKU095-1FFVB1760I, the XCKU115 offers higher performance headroom at increased cost and board area, while the XCKU085 delivers proportional reduction in logic, I/O, and transceiver resources-enabling tiered platform scaling without architectural redesign.
Availability
XCKU095-1FFVB1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and data center acceleration requiring stable component supply across long production cycles.
Supply support for XCKU095-1FFVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Kintex UltraScale family targets high-throughput, low-latency applications demanding hardened interfaces, scalable logic, and advanced memory subsystems-optimized for 5G infrastructure, aerospace radar, and accelerated computing platforms.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-1FFVB1760I?
The XCKU095-1FFVB1760I supports DDR4 memory interfaces up to 2400 MT/s with built-in memory controller hard IP. This rate is validated across all I/O banks designated for memory interface use and includes on-die termination and write-leveling calibration. XCKU095-1FFVB1760I achieves this performance using HP I/O banks operating at 1.2 V and requires matched trace lengths and proper VREF routing per UG576 guidelines.
Does XCKU095-1FFVB1760I support partial reconfiguration?
Yes, XCKU095-1FFVB1760I fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of logical modules-such as filter banks or modulation schemes-without resetting the entire device. XCKU095-1FFVB1760I implements this using frame-based bitstream loading and secure configuration ports, enabling runtime adaptation in radar and software-defined radio systems.
What transceiver protocols are natively supported by XCKU095-1FFVB1760I?
XCKU095-1FFVB1760I natively supports PCIe Gen3, CPRI, JESD204B/C, SATA, and 10G/25G/100G Ethernet via its 52 GTY transceiver quads. Protocol support is implemented in hardened logic blocks-not soft IP-ensuring deterministic latency and minimal resource usage. XCKU095-1FFVB1760I transceivers operate up to 28.3 Gb/s and include built-in PRBS generators and error detectors for link validation.
What is the operating temperature range for XCKU095-1FFVB1760I?
XCKU095-1FFVB1760I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the -1 speed grade and is verified under specified voltage and airflow conditions per DS892. XCKU095-1FFVB1760I thermal management relies on its FFVB package's integrated heat spreader and requires PCB copper pour and thermal vias per AMD's thermal design guide.
How many PCIe Gen3 lanes does XCKU095-1FFVB1760I support?
XCKU095-1FFVB1760I integrates a hardened PCIe Gen3 x16 endpoint/root port block, supporting full-width link operation with automatic negotiation down to x1, x2, x4, x8, or x16 widths. The block includes AXI4 streaming interfaces and MSI-X interrupt support. XCKU095-1FFVB1760I implements this functionality in dedicated silicon, requiring zero LUTs or DSPs-unlike soft PCIe cores.
XCKU095-1FFVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU095-1FFVB1760I FAQ
1.How can I place an order for XCKU095-1FFVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-1FFVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-1FFVB1760I reliable?
The price and inventory of XCKU095-1FFVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-1FFVB1760I is usually 5 days.
3.What payment methods are accepted for XCKU095-1FFVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-1FFVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-1FFVB1760I?
XCKU095-1FFVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-1FFVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-1FFVB1760I?
For technical support, including XCKU095-1FFVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-1FFVB1760I requirements.
6.How does Aetrix verify that XCKU095-1FFVB1760I is sourced from the original manufacturer or authorized distributors?
All XCKU095-1FFVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-1FFVB1760I meets industry standards.
7.What is the process for return or replacement of XCKU095-1FFVB1760I?
All XCKU095-1FFVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-1FFVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-1FFVB1760I part is unused and in its original packaging.
Return procedure for XCKU095-1FFVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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