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AMD XCKU095-1FFVB2104C
- Part No.:
- XCKU095-1FFVB2104C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU095-1FFVB2104C.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,727
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Product details
Overview
XCKU095-1FFVB2104C from AMD is a high-performance Kintex UltraScale FPGA featuring 927,000 logic cells, 5,540 DSP slices, and 64.2 Mb of block RAM. It integrates 24 transceivers supporting up to 12.5 Gb/s, and is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU095-1FFVB2104C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (-1), I/O voltage support (1.2 V to 1.8 V), thermal design power (TDP = 35 W), and configuration interface compatibility (JTAG, SelectMAP, SPI).
Technical Context
The XCKU095-1FFVB2104C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3 x16, 10/25/100G Ethernet MACs, and AXI interconnect. Its UltraScale+ architecture supports time-multiplexed I/O and dynamic reconfiguration via partial reconfiguration bitstreams.
It delivers deterministic timing closure for multi-gigabit serial links and supports IEEE 1149.1/1149.6 JTAG boundary-scan testing. The device uses 20 nm bulk CMOS process technology and supports configuration security via AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 927,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 5,540 - enables parallel fixed/floating-point computation for radar FFT or 5G channel coding |
| Block RAM | 64.2 Mb - provides on-die memory for buffering high-throughput packet streams or frame storage |
| Transceivers | 24 × 12.5 Gb/s - supports dual 10G Ethernet + CPRI or single 25G Ethernet + JESD204B links |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to ADCs, DACs, and memory controllers |
| Configuration Interface | JTAG, SPIx4, SelectMAP x16 - allows flexible programming via debug probe, flash boot, or host processor |
| Thermal Design Power | 35 W - defines heatsink and airflow requirements for sustained operation in enclosed base stations |
Pinout & Package
Package: 2104-pin Flip-Chip BGA (FFVB), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric and CLBs |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and transceiver analog circuitry |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage per bank, enabling mixed-voltage interface design |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
| PROGRAM_B | Configuration control | Active-low input that triggers full reconfiguration and clears internal state |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port for boundary scan and debug |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces latency and resource usage versus soft IP; supports root complex and endpoint modes |
| UltraScale+ Memory Controller | Native DDR4/LPDDR4 interface with 2,400 MT/s data rate and ECC support |
| Partial Reconfiguration | Enables runtime logic swapping without system reset-critical for adaptive radio or protocol upgrades |
| AES-256 + HMAC Security | Prevents unauthorized bitstream cloning and ensures authenticated firmware updates |
| Dynamic Power Management | Per-bank I/O power gating and clock gating reduce active power by up to 30% in burst-mode operation |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time beam steering and precoding across 64+ antenna elements using massive matrix multiplication. IC Role / Device Role / Timing Role: Primary compute accelerator executing custom RTL kernels for channel estimation and spatial filtering. Use Value: 5,540 DSP slices deliver >1.2 TFLOPS INT8 throughput at 300 MHz, enabling sub-100 µs latency per beam update. | Use Scenario: Coherent integration of pulsed RF returns from phased array antennas in airborne SAR systems. IC Role / Device Role / Timing Role: High-precision timing engine synchronizing ADC sampling, pulse generation, and FFT processing pipelines. Use Value: Deterministic 12.5 Gb/s transceivers feed raw ADC data directly into block RAM, eliminating external FIFO bottlenecks. |
| High-Speed Test Equipment | Optical Transport Network Switching |
Use Scenario: Protocol-aware pattern generation and analysis for 25G/100G Ethernet compliance testing. IC Role / Device Role / Timing Role: Dual-role transceiver controller managing both TX stimulus and RX error detection in loopback mode. Use Value: 24 GTY transceivers operate simultaneously at 10.3125 Gb/s (10GBASE-R) and 25.78125 Gb/s (25GBASE-R), supporting multi-lane stress testing. | Use Scenario: Line-card packet classification and switching in 100G OTN multiplexers with ODUflex grooming. IC Role / Device Role / Timing Role: Traffic manager implementing hierarchical scheduling and deep buffer management across 16 x 10G interfaces. Use Value: 64.2 Mb block RAM enables 128 MB packet buffer depth at line rate, sustaining 100 Gbps aggregate throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD2104I | Higher speed grade (-2), 1,137K logic cells, 6,480 DSP slices, 72.2 Mb BRAM, TDP = 42 W | Supports higher clock frequencies and larger designs; requires enhanced thermal solution | Select when >10% additional logic/DSP resources or >300 MHz system clock is required |
| XCKU060-2FFVA1156I | Smaller footprint (1156-pin), 565K logic cells, 3,380 DSP slices, 42.2 Mb BRAM, TDP = 24 W | Lower I/O count (452 vs. 624) and reduced transceiver count (16 vs. 24) | Choose for cost-sensitive 10G/25G edge nodes where full XCKU095 capability is unused |
Compared with XCKU095-1FFVB2104C, the XCKU115 offers headroom for future design scaling but increases cooling complexity, while the XCKU060 reduces bill-of-materials cost and PCB area at the expense of transceiver bandwidth and memory capacity-making it suitable only for scaled-down implementations.
Availability
XCKU095-1FFVB2104C is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test equipment requiring stable component supply across multi-year production cycles.
Supply support for XCKU095-1FFVB2104C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high logic density, multi-gigabit transceivers, and hardened IP-especially in wireless infrastructure and defense electronics.
FAQ
What is the maximum supported transceiver data rate for XCKU095-1FFVB2104C?
The XCKU095-1FFVB2104C supports GTY transceivers rated up to 12.5 Gb/s per lane. This rating is guaranteed under the -1 speed grade at junction temperatures ≤85°C and VCCINT = 1.0 V. The device achieves this rate with PRBS31 pattern compliance and meets jitter specifications per IEEE 802.3ba for 10GBASE-KR and 25GBASE-KR applications. XCKU095-1FFVB2104C does not support rates above 12.5 Gb/s.
Does XCKU095-1FFVB2104C support PCI Express Gen4?
No, XCKU095-1FFVB2104C integrates hard IP for PCI Express Gen3 x16 only. It lacks the Gen4 PHY layer and associated equalization features required for 16 GT/s signaling. While Gen4 endpoints can be implemented using soft logic, they incur significant resource overhead and do not meet Gen4 compliance requirements. XCKU095-1FFVB2104C is validated and documented exclusively for Gen3 operation.
What configuration modes are supported by XCKU095-1FFVB2104C?
XCKU095-1FFVB2104C supports three primary configuration modes: Master SPI (x4), Slave SelectMAP (x16), and JTAG. It also supports fallback configuration from dual SPI flash and daisy-chained JTAG for multi-device systems. Configuration bitstream authentication via HMAC-SHA256 and decryption via AES-256 are mandatory for secure boot. XCKU095-1FFVB2104C does not support BPI or NAND flash native configuration.
Is partial reconfiguration supported on XCKU095-1FFVB2104C?
Yes, XCKU095-1FFVB2104C fully supports dynamic partial reconfiguration (PR) using Vivado Design Suite v2020.2 or later. PR regions can be defined at the logical block level, and bitstream swapping occurs in <50 ms without resetting the entire device. This capability is verified for use cases like protocol stack updates in 5G NR basebands and adaptive filter coefficient loading in radar systems. XCKU095-1FFVB2104C requires dedicated configuration controller logic and secure PR bitstream signing.
What is the I/O voltage range supported by XCKU095-1FFVB2104C banks?
XCKU095-1FFVB2104C supports I/O voltages from 1.2 V to 1.8 V across its 24 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces-for example, 1.2 V for MIPI D-PHY and 1.8 V for DDR4 address/control signals. Bank-specific VCCO must be supplied within ±2.5% tolerance. The device does not support 2.5 V or 3.3 V I/O standards.
XCKU095-1FFVB2104C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU095-1FFVB2104C FAQ
1.How can I place an order for XCKU095-1FFVB2104C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-1FFVB2104C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-1FFVB2104C reliable?
The price and inventory of XCKU095-1FFVB2104C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-1FFVB2104C is usually 5 days.
3.What payment methods are accepted for XCKU095-1FFVB2104C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-1FFVB2104C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-1FFVB2104C?
XCKU095-1FFVB2104C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-1FFVB2104C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-1FFVB2104C?
For technical support, including XCKU095-1FFVB2104C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-1FFVB2104C requirements.
6.How does Aetrix verify that XCKU095-1FFVB2104C is sourced from the original manufacturer or authorized distributors?
All XCKU095-1FFVB2104C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-1FFVB2104C meets industry standards.
7.What is the process for return or replacement of XCKU095-1FFVB2104C?
All XCKU095-1FFVB2104C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-1FFVB2104C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-1FFVB2104C part is unused and in its original packaging.
Return procedure for XCKU095-1FFVB2104C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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