AMD XCKU095-1FFVC1517C
- Part No.:
- XCKU095-1FFVC1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU095-1FFVC1517C.pdf
- Description:
- IC FPGA 520 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,089
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Product details
Overview
XCKU095-1FFVC1517C from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU095-1FFVC1517C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support, thermal performance in air-cooled rack environments, and configuration interface compatibility with BPI or SPI flash.
Technical Context
The XCKU095-1FFVC1517C implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC), and ultra-fast serial transceivers operating at 28.3 Gb/s. It uses 20nm bulk CMOS process technology and supports multi-voltage I/O banks (1.2V–1.8V).
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor. The device includes integrated clock management with MMCM and PLL blocks supporting jitter filtering and frequency synthesis for high-speed SerDes and memory interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 5,520 - dedicated arithmetic units supporting 27×18 multiply-accumulate per slice |
| Block RAM | 64.2 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering |
| Transceiver Speed | 28.3 Gb/s - maximum line rate per GTY transceiver channel, enabling 100G Ethernet and InfiniBand EDR |
| PCIe Interface | Gen3 x16 - hard IP block supporting root complex and endpoint roles with ASO and ACS |
| Memory Support | DDR4-2400 - 16-bit wide interfaces per memory controller, up to 4 controllers active |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - supports mixed-signal interfacing with ADCs, sensors, and FPGAs |
Pinout & Package
This device is packaged in a 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS-side peripherals |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8V/1.5V/1.35V signaling; used for DDR4, PCIe, and high-speed SerDes interfaces |
| HR[0:47] | High-Density I/O Bank | Supports 1.2V–1.8V; optimized for general-purpose I/O and low-power interfaces |
| GTYTX/RX[0:31] | Transceiver Lane | 28.3 Gb/s differential SerDes channels; each pair supports PMA/PMD functions |
| CLK_IN_0/1 | Global Clock Input | Dedicated differential inputs feeding MMCM/PLL for system clock distribution |
| PROGRAM_B | Configuration Control | Active-Low asynchronous reset initiating full reconfiguration from boot source |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and timing closure risk for host interface designs |
| 28.3 Gb/s GTY Transceivers | Enables direct connection to 100G QSFP28 optical modules without retimers |
| Integrated Memory Controllers | Four independent DDR4 controllers with ECC support for reliable high-bandwidth memory subsystems |
| UltraScale Architecture | Provides predictable timing convergence and scalable resource utilization across design sizes |
| Partial Reconfiguration Support | Allows dynamic logic swapping in operational systems without full device reset |
Applications
| 5G Wireless Baseband Processing | High-Frequency Trading Acceleration |
|---|---|
Use Scenario: Real-time layer-1 PHY processing for massive MIMO and beamforming in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Programmable baseband processor handling FFT, channel estimation, and LDPC decoding with deterministic latency. Use Value: 28.3 Gb/s transceivers interface directly with RFICs; 5,520 DSP slices enable parallel LDPC decoding at 10+ Gbps throughput. | Use Scenario: Low-latency order matching and risk calculation engine co-located with exchange gateways. IC Role / Device Role / Timing Role: Deterministic hardware accelerator executing custom trading logic with sub-250 ns end-to-end pipeline latency. Use Value: PCIe Gen3 x16 provides 16 GT/s host link bandwidth; 942K logic cells implement parallelized matching engines with zero software stack overhead. |
| Medical Imaging Data Pipeline | AI Inference at the Edge |
Use Scenario: Real-time reconstruction of CT/MRI raw sensor data into volumetric images using iterative algorithms. IC Role / Device Role / Timing Role: High-throughput data coprocessor managing DMA transfers between ADCs, DDR4 buffers, and GPU/FPGA compute clusters. Use Value: 64.2 Mb block RAM enables on-chip storage of multiple sinogram frames; HP I/O banks drive 2400 MT/s DDR4 for sustained 128 GB/s memory bandwidth. | Use Scenario: On-device inference for vision-based industrial inspection using quantized CNN models. IC Role / Device Role / Timing Role: Configurable AI accelerator executing INT8 convolution layers with pipelined DSP-slice matrix multiplication. Use Value: 5,520 DSP slices deliver >10 TOPS INT8 performance; partial reconfiguration allows model-swapping without system downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Higher speed grade (-2), larger package (1924-pin), 1.1M logic cells, 7,200 DSP slices | Targeted at higher-bandwidth applications requiring more transceivers and memory bandwidth | Select when >28.3 Gb/s aggregate SerDes bandwidth or >4 DDR4 controllers are required |
| XCKU060-2FFVA1156I | Lower density (560K LC), smaller FFVA package (1156-pin), -2 speed grade, industrial temperature range | Suitable for cost-sensitive embedded systems with extended thermal requirements | Choose for space-constrained industrial control where 28.3 Gb/s transceivers are not needed |
Compared with XCKU095-1FFVC1517C, the XCKU115 offers higher capacity and bandwidth at increased power and board area cost, while the XCKU060 reduces footprint and cost but sacrifices logic density and transceiver count-making the XCKU095-1FFVC1517C the optimal balance for mid-to-high-tier acceleration workloads.
Availability
XCKU095-1FFVC1517C is available at Aetrix Electronics and suitable for 5G infrastructure, financial data acceleration, and medical imaging systems requiring stable component supply and long-term production support.
Supply support for XCKU095-1FFVC1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex UltraScale family delivers high performance-per-watt FPGA solutions targeting high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and real-time video processing.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-1FFVC1517C?
The XCKU095-1FFVC1517C supports DDR4 memory interfaces operating at up to 2400 MT/s across four independent memory controllers. Each controller drives a 16-bit wide bus with built-in ECC and address/command training. This capability is verified in AMD UG576 v1.14 and applies specifically to the -1 speed grade under commercial temperature conditions.
Does XCKU095-1FFVC1517C include hardened PCIe Gen3 IP?
Yes, XCKU095-1FFVC1517C integrates a hardened PCIe Gen3 x16 endpoint/root complex block compliant with PCI Express Base Specification Revision 3.0. It supports advanced features including ACS, ASO, and ECRC, and requires no external PHY. Configuration is managed through dedicated AXI4-Stream interfaces per lane group.
What is the operating temperature range for XCKU095-1FFVC1517C?
XCKU095-1FFVC1517C is rated for commercial temperature operation (0°C to +85°C case temperature). The "C" suffix in the part number explicitly denotes this grade. Thermal design must maintain junction temperature below 100°C under full static and dynamic loading, as specified in AMD UG576 Table 1-2.
How many GTY transceivers does XCKU095-1FFVC1517C provide?
XCKU095-1FFVC1517C provides 32 GTY transceiver quads, totaling 128 transceiver lanes. Each GTY channel operates up to 28.3 Gb/s and supports protocols including 100G Ethernet, CPRI, and InfiniBand EDR. All GTY banks are located in HP I/O banks and require dedicated reference clocks.
Is partial reconfiguration supported on XCKU095-1FFVC1517C?
Yes, XCKU095-1FFVC1517C fully supports partial reconfiguration as defined in AMD UG909. This allows dynamic replacement of logical partitions during runtime without resetting the entire device. Implementation requires Vivado Design Suite 2022.1 or later and adherence to frame-based placement constraints.
XCKU095-1FFVC1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU095-1FFVC1517C FAQ
1.How can I place an order for XCKU095-1FFVC1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-1FFVC1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-1FFVC1517C reliable?
The price and inventory of XCKU095-1FFVC1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-1FFVC1517C is usually 5 days.
3.What payment methods are accepted for XCKU095-1FFVC1517C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-1FFVC1517C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-1FFVC1517C?
XCKU095-1FFVC1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-1FFVC1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-1FFVC1517C?
For technical support, including XCKU095-1FFVC1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-1FFVC1517C requirements.
6.How does Aetrix verify that XCKU095-1FFVC1517C is sourced from the original manufacturer or authorized distributors?
All XCKU095-1FFVC1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-1FFVC1517C meets industry standards.
7.What is the process for return or replacement of XCKU095-1FFVC1517C?
All XCKU095-1FFVC1517C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-1FFVC1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-1FFVC1517C part is unused and in its original packaging.
Return procedure for XCKU095-1FFVC1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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