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AMD XCKU095-2FFVA1156E
- Part No.:
- XCKU095-2FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVA1156E.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,428
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Product details
Overview
XCKU095-2FFVA1156E from AMD (formerly Xilinx) is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It integrates hardened 16.3 Gb/s transceivers and supports PCIe Gen3 x16, making it suitable for high-bandwidth data acquisition and real-time signal processing in radar and 5G infrastructure.
For engineers reviewing the XCKU095-2FFVA1156E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, I/O bank voltage support, thermal envelope, and configuration interface compatibility with JTAG and SelectMAP.
Technical Context
The XCKU095-2FFVA1156E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated transceivers supporting protocols including CPRI, JESD204B/C, and 10/25/100GbE. Its I/O subsystem supports 1.8 V, 1.5 V, 1.35 V, and 1.2 V signaling standards across 24 I/O banks.
Configuration is performed via quad-SPI, BPI, or JTAG interfaces, with dual-boot capability and AES-256 bitstream encryption. The device uses a 0.85 V core supply and operates over industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for custom datapaths and control units |
| DSP Slices | 5,520 - enables parallel execution of multiply-accumulate operations for FIR filters and FFTs |
| Block RAM | 64.2 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external DRAM |
| Transceivers | 32 lanes @ 16.3 Gb/s - supports multi-lane serial protocols including PCIe Gen3 and JESD204C |
| I/O Banks | 24 - allows mixed-voltage I/O interfacing with legacy and high-speed peripherals |
| Configuration Interface | Quad-SPI / BPI / JTAG - enables flexible, secure, and field-upgradable bitstream loading |
Pinout & Package
The XCKU095-2FFVA1156E is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package with 35×35 mm body size, 0.8 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or CAN controller pins for peripheral bridging |
| GTYP[0:31] | Transceiver Lane | High-speed serial I/O supporting 10–16.3 Gb/s with built-in clock recovery and equalization |
| HPC[0:63] | High-Performance Connector | Dedicated 1.8 V I/O bank for FMC+ mezzanine interconnect with 32 differential pairs |
| VCCINT | Core Power Supply | 0.85 V ±3% regulated supply required for logic fabric and CLB operation |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test and programming interface for configuration and debug |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables time-multiplexed logic and routing for higher effective LUT density and lower dynamic power per function |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized reprogramming by securing configuration memory against readback attacks |
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and timing closure risk for host-facing acceleration cards |
| Dynamic Reconfiguration | Allows partial bitstream updates during operation to adapt logic functionality without system reset |
| Integrated 100G Ethernet MAC | Offloads TCP/IP stack processing and reduces latency in network packet inspection and forwarding |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and matrix inversion; transceivers interface with ADC/DAC arrays at JESD204B/C rates. Use Value: 5,520 DSP slices enable concurrent 128-channel beamformer computation; 32 transceiver lanes support full-duplex RF chain I/O. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel coding in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable accelerator for LDPC encoding/decoding and OFDM modulation/demodulation; PCIe Gen3 x16 connects to host CPU. Use Value: 942,000 logic cells accommodate multiple parallel DPD engines; hardened PCIe endpoint ensures deterministic latency under 100 µs. |
| High-Throughput Test Equipment | AI Edge Inference Accelerator |
Use Scenario: Multi-port protocol-aware traffic generation and analysis in 100GbE compliance testers. IC Role / Device Role / Timing Role: Line-rate packet parsing, modification, and timestamping engine; transceivers drive QSFP28 optical modules. Use Value: 64.2 Mb block RAM buffers full-frame 100G traffic bursts; 16.3 Gb/s transceivers meet IEEE 802.3bs electrical specs. | Use Scenario: Low-latency inference for vision analytics on factory-floor edge servers with limited cooling. IC Role / Device Role / Timing Role: Hardware-accelerated CNN layer execution; HPC I/O connects to DDR4 memory and NVMe SSDs. Use Value: Dynamic reconfiguration allows model-swapping without reboot; industrial temp rating supports fanless enclosure operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | Higher logic density (1,322K LC), larger package (1517-ball), extended temperature (–40°C to +100°C) | Better suited for thermally constrained aerospace deployments requiring margin beyond industrial spec | Select when additional logic headroom and extended thermal performance outweigh cost and board area penalties |
| XCKU060-2FFVA1156I | Fewer logic cells (562K), reduced DSP slices (3,328), same FFVA-1156 package and I/O count | Targeted at cost-sensitive 5G small cell and video processing where full XCKU095 capacity is unused | Choose for designs that fit within 60% of XCKU095 resources but require identical footprint and pin compatibility |
Compared with XCKU095-2FFVA1156E, the XCKU115-2FLVD1517I offers greater scalability for future-proofing, while the XCKU060-2FFVA1156I delivers identical mechanical integration with lower power and cost-enabling tiered product variants from a single PCB layout.
Availability
XCKU095-2FFVA1156E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-throughput test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU095-2FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions through its acquisition of Xilinx, with expertise in FPGA, adaptive SoC, and ACAP technologies.
The Kintex UltraScale family targets high-performance, cost-optimized applications in communications, test & measurement, and aerospace, balancing logic capacity, transceiver bandwidth, and power efficiency.
FAQ
What is the maximum supported transceiver data rate for XCKU095-2FFVA1156E?
The XCKU095-2FFVA1156E supports transceiver line rates up to 16.3 Gb/s per lane. This is confirmed in the UltraScale Architecture Transceivers User Guide (UG578 v1.12). All 32 GTY transceiver lanes on the XCKU095-2FFVA1156E are rated for this speed under industrial temperature conditions with proper reference clock jitter and PCB channel loss budgets.
Does XCKU095-2FFVA1156E support PCIe Gen4?
No, the XCKU095-2FFVA1156E does not support PCIe Gen4. It integrates hardened PCIe Gen3 x16 endpoints only, as documented in DS892 and UG578. For PCIe Gen4 capability, AMD recommends the Virtex UltraScale+ or Versal ACAP families. The XCKU095-2FFVA1156E remains fully compliant with PCIe Gen3.0 specification (8 GT/s per lane).
What configuration modes are supported by XCKU095-2FFVA1156E?
The XCKU095-2FFVA1156E supports three primary configuration modes: Quad-SPI flash, BPI parallel NOR flash, and JTAG. Dual-boot capability is enabled via mode pin settings, allowing fallback to a secondary bitstream if CRC validation fails. Configuration security features include AES-256 decryption and HMAC authentication, both enforced during boot.
Is XCKU095-2FFVA1156E pin-compatible with other Kintex UltraScale devices in FFVA-1156 package?
Yes, the XCKU095-2FFVA1156E shares identical pinout and package dimensions with XCKU060-2FFVA1156I and XCKU085-2FFVA1156I. All three use the same 1156-ball FFVA footprint, enabling direct substitution within the same family when logic and transceiver resource requirements align. Power and thermal design must still be verified per device.
What is the operating temperature grade of XCKU095-2FFVA1156E?
The XCKU095-2FFVA1156E is specified for industrial temperature range: –40°C to +100°C junction temperature. The "E" suffix denotes industrial grade, distinct from commercial ("C") or extended ("I") grades. Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation and ambient conditions.
XCKU095-2FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU095-2FFVA1156E FAQ
1.How can I place an order for XCKU095-2FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVA1156E reliable?
The price and inventory of XCKU095-2FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVA1156E?
XCKU095-2FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVA1156E?
For technical support, including XCKU095-2FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVA1156E requirements.
6.How does Aetrix verify that XCKU095-2FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVA1156E?
All XCKU095-2FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU095-2FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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