AMD XCKU095-2FFVA1156I

Overview

XCKU095-2FFVA1156I from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, 28.3 Gb/s transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acquisition systems requiring deterministic latency and real-time signal processing.

For engineers reviewing the XCKU095-2FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal design power (TDP), and configuration interface compatibility with JTAG and SelectMAP.

Technical Context

The XCKU095-2FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25/100G Ethernet MACs, and integrated memory controllers for DDR4/LPDDR4. Its UltraScale+ architecture uses 20nm FinFET process technology to deliver improved performance-per-watt over previous generations.

It supports multi-voltage I/O banks (1.2V–1.8V), includes 528 user-configurable I/O pins with SSTL/HSTL/LVCMOS signaling, and features dual-boot capability via Quad-SPI flash and BPI parallel NOR flash interfaces.

Key Specifications

Pinout & Package

Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, thermally enhanced with exposed thermal pad. Compatible with standard reflow profiles for lead-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU095-2FFVA1156I, the XCKU115-2FLVD1517I offers 17% more logic and 17% more DSP but requires board rework, while the VU37P-2FLGC2104I delivers 290% more logic at triple the power and cost-making XCKU095-2FFVA1156I optimal for balanced high-performance embedded acceleration.

Availability

XCKU095-2FFVA1156I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCKU095-2FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on adaptive computing, AI acceleration, and high-performance processing solutions for data centers, edge, and embedded markets.

The Kintex UltraScale family delivers optimized performance-per-watt for compute-intensive, I/O-rich applications including wireless infrastructure, test & measurement, and aerospace avionics.

FAQ

What is the maximum supported DDR4 data rate for XCKU095-2FFVA1156I?

The XCKU095-2FFVA1156I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s with 16-bit or 32-bit interfaces. It complies with JEDEC DDR4-2400 specifications and includes calibration logic for write-leveling and gate training. The controller connects directly to external DDR4 SODIMMs or discrete components without requiring external PHY. XCKU095-2FFVA1156I achieves this performance using dedicated I/O banks with programmable output drive strength and fine-grained delay control.

Does XCKU095-2FFVA1156I support partial reconfiguration?

Yes, XCKU095-2FFVA1156I fully supports partial reconfiguration through Vivado Design Suite tools and runtime reconfiguration engines. This allows dynamic swapping of logic modules while maintaining system operation-critical for adaptive radio protocols and multi-standard communication systems. XCKU095-2FFVA1156I implements frame-based reconfiguration with CRC-protected bitstreams and secure loading via eFUSE-controlled keys.

What transceiver protocols are natively supported by XCKU095-2FFVA1156I?

XCKU095-2FFVA1156I natively supports PCIe Gen3 x16, 10/25/100G Ethernet (KR/KR4), CPRI v7.0, JESD204B/C, and SATA Gen3 via its 24 GTH transceiver channels. Each GTH channel operates up to 28.3 Gb/s and includes built-in PRBS generators/checkers, eye diagram monitors, and automatic equalization. XCKU095-2FFVA1156I does not require external retimers for these protocols when used within specified channel loss budgets.

What is the thermal pad specification for XCKU095-2FFVA1156I's FFVA package?

XCKU095-2FFVA1156I uses an 1156-pin FFVA package with a 10.0 mm × 10.0 mm exposed copper thermal pad centered on the underside. The pad requires solder paste stencil opening of 70% area ratio and NiAu surface finish for reliable thermal transfer. Thermal resistance (θJA) is 5.2°C/W under JEDEC JESD51-2 conditions with 2-layer 2 oz copper PCB and 200 LFM airflow. XCKU095-2FFVA1156I must be mounted with controlled pressure during reflow to ensure void-free thermal interface.

Can XCKU095-2FFVA1156I be configured via Quad-SPI flash?

Yes, XCKU095-2FFVA1156I supports master SPI configuration mode using standard Quad-SPI NOR flash devices with 3-byte or 4-byte addressing. It boots from QSPI at up to 100 MHz (single I/O) or 200 MHz (dual I/O) and supports continuous read, fast read quad I/O, and wrap-around burst modes. XCKU095-2FFVA1156I includes internal pull-ups on IO0–IO3 and dedicated CONFIG_IO pins that auto-detect flash vendor ID and page size during power-up initialization.