My Inquiry
My Account
AMD XCKU095-2FFVB1760E
- Part No.:
- XCKU095-2FFVB1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVB1760E.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,810
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU095-2FFVB1760E from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with extended temperature range (–40°C to +100°C). It is deployed in high-bandwidth data acquisition systems requiring deterministic latency and real-time signal processing.
For engineers reviewing the XCKU095-2FFVB1760E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.35 V/1.8 V), transceiver line rates up to 16.3 Gb/s, thermal design power (TDP) of 38 W, and configuration via Quad-SPI or BPI.
Technical Context
The XCKU095-2FFVB1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet MACs, and UltraScale+ memory controllers. Its transceivers support PAM4 and NRZ modulation schemes across 24 GTY lanes.
Configuration occurs through master SPI or JTAG, with bitstream authentication and AES-256 encryption enabled. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 5,520 - enables parallel fixed/floating-point arithmetic for radar, AI inference, and filter pipelines |
| Block RAM | 64.2 Mb - provides on-die memory for FIFOs, frame buffers, and coefficient storage without external DRAM |
| Transceiver Lanes | 24 GTY - delivers 16.3 Gb/s serial I/O for optical interconnects, CPRI, and JESD204B links |
| I/O Standards | SSTL-15/18, HSTL-I, LVDS_25 - ensures compatibility with DDR4, QDR-IV, and high-speed ADC/DAC interfaces |
| Speed Grade | -2 - guarantees timing closure at 1.2 GHz system clock with 1.0 V core supply under extended temperature |
| TDP | 38 W - defines thermal envelope for heatsink sizing and airflow planning in conduction-cooled enclosures |
Pinout & Package
Package: 1760-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with 888 user I/Os distributed across 22 banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-use I/O | Configurable as SDIO, UART, SPI, or GPIO; connects to PS-side peripherals in Zynq UltraScale+ MPSoC hybrid mode |
| GTY_TXN[0:23] | Differential Transmitter Output | Drives high-speed serial lanes compliant with PCIe Gen3, 10G-KR, and CPRI v6.1 protocols |
| VRP/VRN | Reference Voltage Pins | Provide termination reference for differential I/O standards; require 0.65×VCCO biasing per bank |
| INIT_B | Configuration Status | Active-low open-drain output indicating bitstream loading success or CRC error during startup |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence from boot source |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables time-multiplexed logic (Time-Division Multiplexing) for 2× effective LUT utilization in high-frequency control loops |
| Hardened PCIe Gen3 x16 Block | Eliminates soft IP resource consumption and guarantees sub-100 ns transaction latency for host DMA transfers |
| Integrated 10/25G Ethernet MAC | Reduces PHY interface complexity and supports IEEE 802.3by for backplane and optical module connectivity |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning by encrypting configuration memory during SPI flash read |
| SelectIO Technology | Allows mixed-voltage operation across I/O banks enabling direct interfacing with legacy 3.3 V peripherals and modern 1.2 V memory |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing on airborne SAR platforms with SWaP-C constraints. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and STAP algorithms; GTY transceivers stream digitized RF samples to ADC/DAC ASICs. Use Value: 942K logic cells enable concurrent multi-channel processing; 16.3 Gb/s GTY lanes sustain 8× 12-bit @ 1.2 GSps ADC data ingestion. | Use Scenario: Distributed unit (DU) baseband processing in Open RAN deployments requiring low-latency Layer 1 acceleration. IC Role / Device Role / Timing Role: Implements flexible numerology mapping, LDPC encoding/decoding, and precoding using DSP slices and block RAM. Use Value: 5,520 DSP slices deliver 1.2 TOPS INT8 throughput; PCIe Gen3 x16 enables fronthaul offload to x86 host. |
| High-Energy Physics Trigger | Medical CT Image Reconstruction |
Use Scenario: Front-end trigger decision engine in particle collider detectors processing 40 MHz hit streams from silicon trackers. IC Role / Device Role / Timing Role: Configurable logic evaluates coincidence patterns; block RAM stores track-fit coefficients and calibration tables. Use Value: 64.2 Mb block RAM holds full detector geometry map; -2 speed grade ensures < 8 ns path delay for Level-1 trigger response. | Use Scenario: Real-time back-projection and iterative reconstruction in spectral CT scanners with dual-energy photon counting. IC Role / Device Role / Timing Role: Accelerates forward projection kernels and sinogram correction using pipelined DSP chains. Use Value: TDP of 38 W fits within liquid-cooled gantry thermal budget; DDR4-2400 interface sustains 25.6 GB/s memory bandwidth for voxel updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | 1.1M logic cells, 6,340 DSP slices, 72.2 Mb BRAM, 28 GTY lanes, larger 1924-pin FLVD package | Higher gate count and transceiver count suit multi-protocol aggregation (PCIe + 100G Ethernet + CPRI) | Select when >942K logic cells or >24 GTY lanes are required; requires PCB redesign due to different footprint |
| VU37P-2FHGB2104E | Virtex UltraScale+ device with 3.7M logic cells, 10,560 DSP slices, 102.4 Mb BRAM, 64 GTY lanes, higher TDP (52 W) | Targeted at extreme compute density: AI training accelerators, exascale computing nodes, and quantum control systems | Choose for applications needing >2× logic resources and >2× transceiver bandwidth; verify thermal management for 52 W TDP |
Compared with XCKU095-2FFVB1760E, the XCKU115 offers scalable capacity within the same Kintex UltraScale family but demands layout changes, while the VU37P delivers significantly higher throughput at the cost of power and board space-making XCKU095 optimal for balanced performance-per-watt in embedded high-throughput systems.
Availability
XCKU095-2FFVB1760E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-energy physics instrumentation requiring stable component supply across long production lifecycles.
Supply support for XCKU095-2FFVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies, with leadership in FPGA, CPU, and GPU architectures.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding superior logic density and I/O bandwidth-designed specifically for communications infrastructure, test & measurement, and aerospace systems.
FAQ
What is the maximum supported DDR4 memory speed for XCKU095-2FFVB1760E?
The XCKU095-2FFVB1760E supports DDR4-2400 (1200 MHz) with 16-bit or 32-bit interfaces using its dedicated memory controller. This speed is validated across all I/O banks configured for SSTL-12, with write-leveling and read-leveling calibration enabled. XCKU095-2FFVB1760E achieves this performance with 1.2 V VCCO and meets JEDEC JESD79-4 timing requirements for tFAW, tRRD, and tRP under industrial temperature conditions.
Does XCKU095-2FFVB1760E support PCIe Gen4?
No, XCKU095-2FFVB1760E does not support PCIe Gen4. It integrates hardened PCIe Gen3 x16 endpoints with link training compliant to PCI Express Base Specification Revision 3.1. While GTY transceivers operate up to 16.3 Gb/s, the PCIe hard IP block lacks Gen4 protocol stack and electrical compliance features such as modified equalization and 128b/130b encoding for Gen4. XCKU095-2FFVB1760E remains fully compatible with Gen3 root complexes and switches.
What configuration modes are supported by XCKU095-2FFVB1760E?
XCKU095-2FFVB1760E supports master SPI, slave serial, BPI, and JTAG configuration modes. Master SPI is the default boot method using external Quad-SPI flash; slave serial allows configuration from microcontroller-controlled shift registers. BPI mode supports parallel NOR flash with 8- or 16-bit bus widths. JTAG is used for debugging, boundary scan, and indirect programming. All modes support AES-256 decryption when enabled in bitstream generation.
How many GTY transceiver quads does XCKU095-2FFVB1760E contain?
XCKU095-2FFVB1760E contains six GTY transceiver quads, totaling 24 GTY transceiver lanes. Each quad comprises four transceivers sharing common clocking and reset resources. These quads are distributed across the die to minimize skew and support independent protocol instantiation-for example, two quads for PCIe Gen3, two for 10G Ethernet, and two for JESD204B links-all operating simultaneously in XCKU095-2FFVB1760E.
Is XCKU095-2FFVB1760E qualified for automotive applications?
No, XCKU095-2FFVB1760E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for extended industrial temperature (–40°C to +100°C) and meets RoHS and REACH requirements, but lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and ASIL-certified toolchain support. For automotive use, AMD recommends the XCKU095-2FFVB1760I variant with industrial-grade screening or dedicated automotive FPGA families.
XCKU095-2FFVB1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU095-2FFVB1760E FAQ
1.How can I place an order for XCKU095-2FFVB1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVB1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVB1760E reliable?
The price and inventory of XCKU095-2FFVB1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVB1760E is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVB1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVB1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVB1760E?
XCKU095-2FFVB1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVB1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVB1760E?
For technical support, including XCKU095-2FFVB1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVB1760E requirements.
6.How does Aetrix verify that XCKU095-2FFVB1760E is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVB1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVB1760E meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVB1760E?
All XCKU095-2FFVB1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVB1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVB1760E part is unused and in its original packaging.
Return procedure for XCKU095-2FFVB1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU095-2FFVB1760E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
