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AMD XCKU095-2FFVB1760I
- Part No.:
- XCKU095-2FFVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVB1760I.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,235
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Product details
Overview
XCKU095-2FFVB1760I from AMD is a high-performance Kintex UltraScale FPGA with 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It features 840 GTY transceivers supporting up to 32.75 Gb/s, integrated PCIe Gen3 x16 endpoint, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio unit baseband processing.
For engineers reviewing the XCKU095-2FFVB1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell count, block RAM depth, PCIe Gen3 endpoint integration, and FFVB1760 package thermal performance.
Technical Context
The XCKU095-2FFVB1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC), and multi-rate GTY transceivers. Its -2 speed grade guarantees timing closure at 32.75 Gb/s with 1.0V core voltage and industrial-grade thermal derating.
It supports partial reconfiguration, AXI4-Stream interfaces for high-throughput data movement, and dual-boot configuration via Quad-SPI or BPI flash. The device uses SelectIO technology with support for DDR4, LPDDR4, and RLDRAM3 memory interfaces up to 2400 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for complex signal processing pipelines |
| DSP Slices | 5,520 - enables parallel execution of 27×18-bit multiply-accumulate operations per slice for radar/beamforming |
| Block RAM | 64.2 Mb - provides on-die memory for buffering real-time wireless frame data without external DRAM latency |
| GTY Transceivers | 840 lanes @ 32.75 Gb/s - supports full-duplex 100G+ coherent optical or massive MIMO RF interface aggregation |
| PCIe Interface | Gen3 x16 endpoint - enables direct host CPU co-processing with ≤100 ns register access latency |
| Memory I/O | DDR4/LPDDR4/RLDRAM3 @ 2400 MT/s - sustains >38 GB/s aggregate memory bandwidth for baseband FFT engines |
| Speed Grade | -2 - guarantees timing closure under worst-case industrial temperature and voltage conditions |
Pinout & Package
The XCKU095-2FFVB1760I is housed in a 1760-pin FCBGA package (FFVB1760) with 35 mm × 35 mm body size, 0.8 mm ball pitch, and integrated thermal lid for industrial convection cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog & auxiliary supply for GTY transceivers | Requires independent low-noise regulation; violation causes bit error rate degradation above 25 Gb/s |
| VRP / VRN | Reference voltage for differential I/O standards | Must be connected to stable 0.75V source for SSTL15/POD12 termination accuracy |
| INIT_B / PROGRAM_B | Configuration control signals | Active-low; INIT_B asserts during CRC error or power-on reset; PROGRAM_B reloads configuration from flash |
| PCIE_CLK_P/N | Dedicated differential clock input | Drives hardened PCIe Gen3 PHY; must meet ±30 ppm frequency tolerance and <1.5 ps jitter RMS |
| CLK_IN_1_P/N | Primary user clock input pair | Feeds MMCM/PLL for system clock generation; supports single-ended LVCMOS or differential LVDS |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous UltraScale architecture | Combines programmable logic, hardened PCIe Gen3, and 100G Ethernet MAC for reduced latency in fronthaul offload |
| Partial reconfiguration support | Enables dynamic function swapping (e.g., 5G NR vs. LTE waveform) without full FPGA reboot |
| AXI4-Stream interconnect | Provides lockless, flow-controlled data transport between IP blocks at >200 Gbps aggregate throughput |
| SelectIO memory interface | Supports DDR4-2400 and LPDDR4-2400 with built-in write leveling and read deskew for reliable high-speed memory access |
| Industrial temperature rating | Validated operation from -40°C to +100°C ambient, enabling deployment in outdoor 5G macro base stations |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming coefficient calculation and RF channel calibration across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary baseband processor executing OFDM symbol generation, precoding, and IQ modulation with deterministic sub-µs latency. Use Value: 942K logic cells and 5,520 DSP slices enable concurrent execution of 32 independent beamformer chains at 200 MHz clock rate. | Use Scenario: Protocol-aware packet generation and error injection for 100G Ethernet switch validation. IC Role / Device Role / Timing Role: Line-rate traffic generator using hardened 100G Ethernet MAC and GTY transceivers as physical layer interface. Use Value: 840 GTY lanes at 32.75 Gb/s allow simultaneous stimulation of 8x 100G ports with precise inter-packet gap control. |
| Radar Signal Processing | AI Accelerator Prototyping |
Use Scenario: Pulse-Doppler processing and CFAR detection on FMCW radar returns with microsecond-level response. IC Role / Device Role / Timing Role: Real-time FFT engine and matched filter accelerator tightly coupled to ADC interface via AXI4-Stream. Use Value: 64.2 Mb block RAM buffers 4096-point time-domain samples while 5,520 DSP slices execute 16 parallel FFTs per clock cycle. | Use Scenario: Hardware-software co-design of sparse neural network inference kernels for edge vision systems. IC Role / Device Role / Timing Role: Configurable tensor accelerator with custom dataflow mapped to logic fabric and DSP resources. Use Value: Heterogeneous UltraScale architecture allows simultaneous execution of INT8 convolution, activation, and pooling with <500 ns pipeline latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 1.1M logic cells, 6,340 DSP slices, 72.2 Mb BRAM, same -2 speed grade but larger 1924-pin FLVD package | Higher compute density required for 400G coherent optics or dual-band 5G NR+LTE baseband | Select when >15% additional logic/DSP resources are needed and board layout accommodates larger package |
| VU9P-2FLGA2104I | Virtex UltraScale device with 1.2M logic cells, 6,840 DSP slices, 80.8 Mb BRAM, and 100G+ Ethernet MAC hard IP | Targeted at ultra-high-bandwidth applications like AI training accelerators or terabit switching where PCIe Gen4 x16 and higher transceiver count are mandatory | Choose for PCIe Gen4 host interface or when 100G Ethernet MAC hard IP is required over soft-core implementation |
Compared with XCKU095-2FFVB1760I, the XCKU115 offers higher resource density in a larger package, while the VU9P adds PCIe Gen4 and hardened 100G Ethernet-making the XCKU095 optimal for cost-sensitive 5G RU deployments requiring industrial temp and proven GTY reliability at 32.75 Gb/s.
Availability
XCKU095-2FFVB1760I is available at Aetrix Electronics and suitable for 5G infrastructure, radar systems, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU095-2FFVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.
The Kintex UltraScale family targets high-performance, cost-optimized applications such as wireless infrastructure, video processing, and test & measurement where balanced logic, DSP, memory, and I/O bandwidth are critical.
FAQ
What is the maximum guaranteed transceiver line rate for XCKU095-2FFVB1760I?
The XCKU095-2FFVB1760I guarantees operation up to 32.75 Gb/s per GTY transceiver lane under industrial temperature conditions and -2 speed grade specifications. This line rate is validated in AMD's UltraScale Architecture Transceiver Wizard and supported by reference designs for 100G KR4 and CEI-28G-VSR applications. The XCKU095-2FFVB1760I achieves this with calibrated PMA settings and requires strict PCB impedance control (85 Ω differential) for compliance.
Does XCKU095-2FFVB1760I support PCIe Gen4?
No, the XCKU095-2FFVB1760I integrates a hardened PCIe Gen3 x16 endpoint only. It does not include PCIe Gen4 PHY or link layer logic. Systems requiring PCIe Gen4 must use Virtex UltraScale+ or Versal ACAP devices. The XCKU095-2FFVB1760I remains fully compatible with PCIe Gen3 root complexes and endpoints, delivering up to 15.75 GB/s bidirectional bandwidth.
What memory interfaces are supported by XCKU095-2FFVB1760I?
The XCKU095-2FFVB1760I supports DDR4, LPDDR4, and RLDRAM3 interfaces at data rates up to 2400 MT/s using its SelectIO technology. It includes dedicated memory controller IP with calibration logic for write leveling and read deskew. The XCKU095-2FFVB1760I does not support GDDR6 or HBM; those require Virtex UltraScale+ or Versal devices.
Is XCKU095-2FFVB1760I qualified for automotive applications?
No, the XCKU095-2FFVB1760I is rated for industrial temperature (-40°C to +100°C) but is not AEC-Q100 qualified. It lacks automotive-specific process controls, failure-in-time (FIT) reporting, and qualification test documentation required for automotive ECUs. For automotive ADAS or infotainment, AMD offers Zynq UltraScale+ MPSoC devices with AEC-Q100 Grade 2 certification.
Can XCKU095-2FFVB1760I perform partial reconfiguration?
Yes, the XCKU095-2FFVB1760I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic module swapping without resetting the entire device. This capability is used in 5G base stations to switch between NR and LTE waveforms. The XCKU095-2FFVB1760I requires dedicated configuration port routing and secure bitstream encryption for safe runtime updates.
XCKU095-2FFVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU095-2FFVB1760I FAQ
1.How can I place an order for XCKU095-2FFVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVB1760I reliable?
The price and inventory of XCKU095-2FFVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVB1760I is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVB1760I?
XCKU095-2FFVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVB1760I?
For technical support, including XCKU095-2FFVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVB1760I requirements.
6.How does Aetrix verify that XCKU095-2FFVB1760I is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVB1760I meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVB1760I?
All XCKU095-2FFVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVB1760I part is unused and in its original packaging.
Return procedure for XCKU095-2FFVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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