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AMD XCKU095-2FFVB2104E
- Part No.:
- XCKU095-2FFVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,700
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Product details
Overview
XCKU095-2FFVB2104E from AMD is a high-performance Kintex UltraScale FPGA featuring 927,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gb/s GTY transceivers. It is deployed in high-bandwidth data processing systems such as 100G/400G optical transport line cards.
For engineers reviewing the XCKU095-2FFVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support, thermal envelope, and configuration interface compatibility with Xilinx/AMD Vivado toolchain.
Technical Context
The XCKU095-2FFVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC), and multi-rate transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration.
Configuration is performed via Master SPI or BPI mode using dedicated CONFIG_IO pins; bitstream encryption and HMAC authentication are supported for secure boot. The device includes dual-boot capability and fallback recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 927,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 5,520 - enables high-throughput fixed/floating-point arithmetic for signal processing pipelines |
| Block RAM | 64.2 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTY Transceivers | 32.75 Gb/s - supports 100G KR4, CEI-28G-VSR, and OTU4 protocols with PRBS generation/checking |
| DDR4 Interface | 2400 Mbps - enables direct connection to commodity DDR4 SO-DIMMs with 1.2 V I/O voltage |
| I/O Pins | 820 - configurable across 24 I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards |
| Speed Grade | -2 - specifies timing closure margin for worst-case junction temperature and voltage conditions |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FFVB) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder sphere array optimized for high-power FPGA thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/BPI/JTAG) and configuration mode during power-up reset |
| CCLK | Configuration Clock | Drives internal configuration logic; frequency up to 100 MHz in Master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error detection |
| VRP/VRN | Analog Reference | Provides precision reference for differential I/O standards including SSTL and HSTL |
| HP[0:71] | High-Performance I/O | Supports 1.8 V/1.5 V/1.35 V/1.2 V single-ended and differential signaling with programmable slew rate |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol layers |
| UltraScale+ SelectIO Technology | Enables mixed-voltage I/O banks with per-bank voltage control and simultaneous switching noise mitigation |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without full device reboot, enabling adaptive compute architectures |
| Secure Boot with AES-256 + HMAC | Prevents unauthorized bitstream execution and ensures firmware integrity across field updates |
| Dual-Boot with Fallback | Guarantees system recoverability after failed field upgrade by retaining validated golden image |
Applications
| 100G Optical Transport Line Card | High-Frequency Trading Accelerator |
|---|---|
Use Scenario: Aggregating and grooming 100G client signals into OTU4 line-side interfaces with FEC and ODUk switching. IC Role / Device Role / Timing Role: FPGA fabric implements OTN framer, mapper, and switch fabric; GTY transceivers handle line-rate SerDes. Use Value: XCKU095-2FFVB2104E delivers deterministic latency under 500 ns and supports 128-lane OTN switching with sub-microsecond reconfiguration. | Use Scenario: Offloading order matching, risk checking, and market data parsing in sub-500 ns latency-critical paths. IC Role / Device Role / Timing Role: XCKU095-2FFVB2104E serves as low-latency packet processor with deterministic pipeline stages and time-stamped DMA engines. Use Value: XCKU095-2FFVB2104E achieves 320 ns round-trip latency for FIX message processing with hardware-accelerated regex and checksum engines. |
| 5G Massive MIMO Baseband Unit | Radar Signal Processing Module |
Use Scenario: Real-time precoding, channel estimation, and FFT/IFFT computation for 64T64R antenna arrays. IC Role / Device Role / Timing Role: XCKU095-2FFVB2104E hosts beamforming kernels and CPRI/eCPRI interface logic with deterministic JESD204B v1.1 link timing. Use Value: XCKU095-2FFVB2104E supports 8× JESD204B lanes at 12.5 Gbps and delivers 2.1 TMAC/s for massive MIMO matrix operations. | Use Scenario: Pulse compression, CFAR detection, and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: XCKU095-2FFVB2104E implements real-time matched filtering and phase-coherent beam steering with synchronized ADC/DAC clock domains. Use Value: XCKU095-2FFVB2104E sustains 4.8 GSPS aggregate ADC throughput and maintains <100 fs jitter on 122.88 MHz sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD2104I | Higher logic density (1,133K LC), extended temperature range (–40°C to +100°C), same package footprint | Preferred for extended-temperature industrial radar and avionics where thermal margin is critical | Select XCKU115-2FLVD2104I when additional logic resources or industrial temp grade is required; no PCB change needed |
| VU13P-2FHGB2104E | UltraScale+ Virtex variant with 1.3M LC, higher GTY count (64), but larger thermal envelope and higher static power | Better suited for ultra-high-channel-count 400G coherent optics requiring >32 transceivers | Choose VU13P-2FHGB2104E only if transceiver count or logic headroom exceeds XCKU095-2FFVB2104E capacity |
Compared with XCKU095-2FFVB2104E, the XCKU115-2FLVD2104I offers guaranteed operation at higher ambient temperatures without derating, while the VU13P-2FHGB2104E provides greater transceiver scalability at the cost of increased power and board-level cooling complexity.
Availability
XCKU095-2FFVB2104E is available at Aetrix Electronics and suitable for 100G optical transport, high-frequency trading accelerators, and 5G massive MIMO baseband units requiring stable component supply across multi-year production cycles.
Supply support for XCKU095-2FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high I/O bandwidth, transceiver density, and logic capacity without Virtex-level power or cost premiums.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU095-2FFVB2104E?
The XCKU095-2FFVB2104E supports GTY transceivers rated up to 32.75 Gb/s, validated for protocols including 100G KR4, CEI-28G-VSR, and OTU4. This rating applies across all GTY quads in the -2 speed grade under standard thermal and voltage conditions specified in the AMD UltraScale Architecture FPGA Data Sheet.
Does the XCKU095-2FFVB2104E support partial reconfiguration?
Yes, the XCKU095-2FFVB2104E fully supports partial reconfiguration through the Vivado Design Suite, enabling dynamic logic module replacement without full device reset. This capability is implemented in hardware and requires no external controllers or special configuration modes beyond standard bitstream generation flow.
What configuration interfaces are supported by the XCKU095-2FFVB2104E?
The XCKU095-2FFVB2104E supports Master SPI, Slave Serial, Slave SelectMAP, and BPI configuration modes. Dedicated CONFIG_IO pins and internal configuration logic enable seamless boot from flash devices or JTAG-based programming, with optional AES-256 encryption and HMAC authentication enabled per bitstream.
Is the XCKU095-2FFVB2104E pin-compatible with other Kintex UltraScale devices?
No, the XCKU095-2FFVB2104E is not pin-compatible with other Kintex UltraScale FPGAs due to unique ball map assignments for GTY transceivers, I/O banks, and power delivery networks. Migration between variants requires PCB redesign even within the same FFVB2104 package family.
What is the operating temperature range for the XCKU095-2FFVB2104E?
The XCKU095-2FFVB2104E is rated for commercial temperature operation from 0°C to +85°C ambient, with junction temperature limits defined in the AMD Kintex UltraScale FPGA Data Sheet. Thermal design must maintain Tj ≤ 100°C under worst-case power dissipation conditions.
XCKU095-2FFVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU095-2FFVB2104E FAQ
1.How can I place an order for XCKU095-2FFVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVB2104E reliable?
The price and inventory of XCKU095-2FFVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVB2104E is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVB2104E?
XCKU095-2FFVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVB2104E?
For technical support, including XCKU095-2FFVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVB2104E requirements.
6.How does Aetrix verify that XCKU095-2FFVB2104E is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVB2104E meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVB2104E?
All XCKU095-2FFVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVB2104E part is unused and in its original packaging.
Return procedure for XCKU095-2FFVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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