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AMD XCKU095-2FFVB2104I
- Part No.:
- XCKU095-2FFVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,437
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Product details
Overview
XCKU095-2FFVB2104I from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acquisition systems requiring deterministic latency and real-time processing.
For engineers reviewing the XCKU095-2FFVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (832 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FFVB2104 package, and configuration interface compatibility (e.g., Quad-SPI, BPI, JTAG).
Technical Context
The XCKU095-2FFVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-gigabit transceivers. Its UltraScale architecture uses 20nm process technology and supports partial reconfiguration and dynamic function exchange.
It integrates 24 UltraScale+ GTY transceivers supporting protocols including CPRI, JESD204B/C, and 10GBASE-R. Configuration is performed via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 5,520 - enables high-throughput fixed/floating-point computation for signal processing pipelines |
| Block RAM | 64.2 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory access |
| User I/O Count | 832 - supports wide parallel interfaces, high-pin-count sensor arrays, or multi-lane communication buses |
| Transceiver Max Rate | 16.3 Gb/s - enables JESD204C compliance and 25G Ethernet PHY layer implementation |
| Speed Grade | -2 - guarantees timing closure at specified voltage/temperature conditions for industrial operation |
| Operating Temp | -40°C to +100°C - qualifies for deployment in uncontrolled industrial enclosures or outdoor base stations |
Pinout & Package
The XCKU095-2FFVB2104I is housed in a 2104-ball Fine-Pitch Flip-Chip Ball Grid Array (FFVB) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via solder balls and thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | Supplies 0.85 V ±3% to FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuitry |
| MGTAVCC | Transceiver Analog Supply | Delivers 0.95 V ±2% to GTY transceiver analog sections; sensitive to ripple and noise |
| CONFIG_IO | Configuration Interface I/O | Supports Master SPI, Slave SelectMAP, or JTAG modes; defines startup behavior and bitstream loading path |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; pulled high during valid bitstream load |
| PROGRAM_B | Configuration Reset | Active-low input that initiates configuration sequence and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| 24 GTY Transceivers (16.3 Gb/s) | Enables direct connection to high-speed ADCs/DACs and optical modules without retiming bridges |
| DDR4-2400 Memory Controller | Supports up to 8 banks of DDR4 with ECC, eliminating need for external memory controller ASIC |
| Secure Boot with HMAC Authentication | Prevents unauthorized bitstream execution by validating cryptographic signature before configuration |
| Partial Reconfiguration Support | Allows runtime logic module swapping without system reset, enabling adaptive compute architectures |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and matrix inversion kernels; GTY transceivers interface with RFICs via JESD204C. Use Value: Deterministic latency under 500 ns and 942K logic cells enable concurrent multi-target tracking at 10 kHz update rates. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in active antenna units. IC Role / Device Role / Timing Role: Configurable DPD engine processes 100+ MHz bandwidth signals; PCIe Gen3 x16 connects to host CPU for calibration data exchange. Use Value: 5,520 DSP slices deliver >200 GOPS for real-time DPD coefficient updates with sub-microsecond loop latency. |
| High-Energy Physics DAQ | Medical CT Image Reconstruction |
Use Scenario: Front-end digitization and zero-suppression in particle detector readout systems. IC Role / Device Role / Timing Role: Processes 128-channel ADC streams at 125 MSPS; block RAM buffers event windows before PCIe transfer. Use Value: 64.2 Mb block RAM allows storage of 16 full event frames (128×1024 samples) with no external DRAM access. | Use Scenario: Back-projection acceleration in cone-beam CT scanners using iterative reconstruction algorithms. IC Role / Device Role / Timing Role: Executes parallelized back-projection kernels across logic fabric; DDR4-2400 interface feeds projection data from frame buffer. Use Value: DDR4-2400 controller sustains 38.4 GB/s sustained bandwidth, reducing reconstruction time by 4.2× vs. GPU-only pipeline. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD2104I | Higher logic density (1,328K LC), 7,200 DSP slices, same FFVB2104 package | Better suited for multi-protocol aggregation or larger algorithm partitioning | Select when >942K LC or >5,520 DSP slices are required; higher static power and cost |
| XCKU060-2FFVA1156I | Lower density (565K LC), 3,328 DSP slices, smaller 1156-ball FCBGA package | Targeted at space-constrained edge nodes with reduced throughput requirements | Select when thermal envelope or PCB area limits FFVB2104 adoption; lower I/O count (528) |
Compared with XCKU095-2FFVB2104I, the XCKU115 offers headroom for future feature expansion but increases power and cost, while the XCKU060 reduces footprint and power at the expense of logic capacity and transceiver count-making each suitable for distinct performance tiers within UltraScale-based systems.
Availability
XCKU095-2FFVB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-energy physics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XCKU095-2FFVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high I/O bandwidth, advanced transceivers, and hardened IP-especially in wireless infrastructure, test & measurement, and scientific instrumentation.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-2FFVB2104I?
The XCKU095-2FFVB2104I supports DDR4-2400 (1200 MHz clock) with 16-bit or 32-bit interfaces. This is implemented via a hardened memory controller capable of managing eight banks, on-die termination, and write-leveling calibration. The XCKU095-2FFVB2104I achieves this rate under industrial temperature conditions with proper PCB layout and power delivery design per UG576 v1.14.
Does XCKU095-2FFVB2104I support partial reconfiguration?
Yes, the XCKU095-2FFVB2104I supports partial reconfiguration through Vivado Design Suite v2022.2 and later. This capability allows dynamic swapping of logic modules without resetting the entire device. The XCKU095-2FFVB2104I implements frame-based reconfiguration with dedicated configuration port arbitration and CRC-protected bitstream loading.
What transceiver protocols are natively supported by XCKU095-2FFVB2104I?
The XCKU095-2FFVB2104I's 24 GTY transceivers natively support JESD204B/C, CPRI, 10GBASE-R, and PCIe Gen3. Protocol support is enabled via hardened PCS layers and configurable PMA settings. The XCKU095-2FFVB2104I does not support native SATA or USB3.0 without external PHY bridging.
What is the recommended configuration mode for XCKU095-2FFVB2104I in production systems?
Master SPI is the recommended configuration mode for XCKU095-2FFVB2104I in production due to its single quad-SPI flash dependency, fast startup (<200 ms), and built-in AES-256 bitstream encryption. The XCKU095-2FFVB2104I also supports dual-image fallback and HMAC authentication for secure field updates.
How many PCIe Gen3 lanes does XCKU095-2FFVB2104I support?
The XCKU095-2FFVB2104I supports up to one PCIe Gen3 x16 endpoint or root port configuration. It can alternatively be partitioned into multiple smaller links (e.g., x8 + x8 or x4 + x4 + x4 + x4) using the integrated PCIe hard IP block. Lane allocation is fixed at configuration time and cannot be dynamically reassigned.
XCKU095-2FFVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU095-2FFVB2104I FAQ
1.How can I place an order for XCKU095-2FFVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVB2104I reliable?
The price and inventory of XCKU095-2FFVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVB2104I is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVB2104I?
XCKU095-2FFVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVB2104I?
For technical support, including XCKU095-2FFVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVB2104I requirements.
6.How does Aetrix verify that XCKU095-2FFVB2104I is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVB2104I meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVB2104I?
All XCKU095-2FFVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVB2104I part is unused and in its original packaging.
Return procedure for XCKU095-2FFVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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