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AMD XCKU095-2FFVC1517E
- Part No.:
- XCKU095-2FFVC1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVC1517E.pdf
- Description:
- IC FPGA 468 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,292
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Product details
Overview
XCKU095-2FFVC1517E from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with extended temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU095-2FFVC1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 16.3 Gb/s, and configuration via Master SPI or BPI.
Technical Context
The XCKU095-2FFVC1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet MACs, and integrated memory controllers. It includes 24 UltraScale+ transceivers supporting protocols including CPRI, JESD204B/C, and SATA.
Configuration uses dual-boot capability with fallback support, and security features include AES-256 bitstream encryption and HMAC authentication. The device targets deterministic low-latency processing in radar, 5G infrastructure, and high-throughput test equipment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 5,520 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 64.2 Mb - supports large on-die buffering for video frame stores or packet queues |
| Transceiver Max Rate | 16.3 Gb/s - meets line-rate requirements for 25G Ethernet and JESD204C links |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI - allows direct interfacing with DDR4, LPDDR4, and image sensors |
| Speed Grade | -2 - guarantees timing closure at 1.0 GHz internal clocking with worst-case voltage/temperature |
Pinout & Package
Package: 1517-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVC) with 0.8 mm pitch, thermally enhanced for high-power operation (25W typical).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog power for transceivers | Must be independently filtered and regulated to ±3% for jitter compliance |
| VRP / VRN | Reference voltage for differential I/O | Enables precise termination calibration for SSTL-12 and POD12 interfaces |
| CCLK / INIT_B / DONE | Configuration control signals | Control FPGA startup sequence and indicate configuration completion status |
| HP[0:71] | High-performance I/O bank | Supports 1.8V/1.5V/1.35V/1.2V single-ended and differential standards |
| HR[0:95] | High-range I/O bank | Provides robust drive strength for legacy interfaces including LVDS and TMDS |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees sub-100ns transaction latency |
| Integrated DDR4 Memory Controller | Delivers 25.6 GB/s peak bandwidth with ECC support for mission-critical buffers |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of configured logic |
| UltraScale+ Transceivers | Enable protocol-transparent serial link design with programmable equalization |
| Dual-Boot Configuration | Allows field-upgradable firmware with guaranteed fallback to known-good image |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in airborne radar systems. IC Role / Device Role / Timing Role: FPGA acts as deterministic low-latency datapath accelerator with synchronized multi-channel ADC/DAC interface. Use Value: 942K logic cells and 5,520 DSP slices enable concurrent FFTs and CFAR detection across 32 antenna channels. | Use Scenario: Layer 1 baseband processing for 64T64R massive MIMO radio units. IC Role / Device Role / Timing Role: Implements configurable OFDM modulation/demodulation, channel estimation, and precoding pipelines. Use Value: 16.3 Gb/s transceivers interface directly to RFICs via JESD204C, eliminating external serializer/deserializer chips. |
| High-Throughput Test Equipment | AI Inference Acceleration |
Use Scenario: Protocol-aware traffic generation and analysis in 100G/400G Ethernet testers. IC Role / Device Role / Timing Role: Performs wire-speed packet classification, timestamping, and error injection using deep pipeline logic. Use Value: 64.2 Mb block RAM buffers full 100G line-rate streams for >10 ms, enabling burst-mode analysis. | Use Scenario: Low-latency matrix multiplication offload for edge inference engines. IC Role / Device Role / Timing Role: Configurable systolic array mapped onto logic fabric and DSP slices for INT8/FP16 compute. Use Value: -2 speed grade ensures 1.0 GHz clocking for tight loop timing in convolution kernels without pipelining penalties. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | Higher logic density (1,133K LC), larger package (1924-pin), higher static power | Better suited for multi-protocol aggregation with >32 transceivers | Select when additional logic resources or transceiver count exceeds XCKU095-2FFVC1517E capacity |
| XCKU085-2FFVA1156E | Fewer logic cells (832K), smaller 1156-pin package, lower thermal envelope (18W) | Targeted at cost-sensitive 5G small cell and embedded vision platforms | Choose when system power budget or PCB area constraints preclude FFVC1517 packaging |
Compared with XCKU095-2FFVC1517E, the XCKU115 offers headroom for future feature expansion but increases cooling complexity, while the XCKU085 reduces bill-of-materials cost and layout area at the expense of DSP slice count and transceiver bandwidth.
Availability
XCKU095-2FFVC1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-throughput test equipment requiring stable component supply and long-term industrial availability.
Supply support for XCKU095-2FFVC1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale family delivers optimized performance-per-watt for high-bandwidth, low-latency applications including wireless infrastructure, aerospace avionics, and automated test systems.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-2FFVC1517E?
The XCKU095-2FFVC1517E supports DDR4-2400 (1200 MHz) with its integrated memory controller, delivering up to 25.6 GB/s peak bandwidth across a 64-bit interface. This capability is validated per UG576 and applies specifically to the XCKU095-2FFVC1517E's HP I/O banks configured for SSTL12_I_DCI standard.
Does XCKU095-2FFVC1517E support JESD204C protocol natively?
Yes, the XCKU095-2FFVC1517E supports JESD204C through its UltraScale+ transceivers operating at up to 16.3 Gb/s. The device implements the required 64b/66b encoding, lane synchronization, and deterministic latency features defined in JESD204C Rev 1.1, confirmed in PG269 v1.11.
What configuration modes are supported by XCKU095-2FFVC1517E?
XCKU095-2FFVC1517E supports Master SPI, Slave Serial, Slave SelectMAP, and BPI configuration modes. Dual-boot capability with fallback is enabled via dedicated CONFIG_MODE pins and internal boot ROM, allowing field updates without hardware modification.
Is AES-256 bitstream encryption available on XCKU095-2FFVC1517E?
Yes, XCKU095-2FFVC1517E includes hardware-accelerated AES-256 bitstream encryption with HMAC-SHA256 authentication. Key provisioning uses battery-backed SRAM or eFUSE, and decryption occurs transparently during configuration, as documented in UG578 v1.13.
What is the thermal design power (TDP) rating for XCKU095-2FFVC1517E?
The XCKU095-2FFVC1517E has a typical thermal design power of 25W under full utilization at maximum junction temperature (100°C) and -2 speed grade. Power estimates must be generated using Xilinx Vivado Power Estimator with actual design netlist and activity files.
XCKU095-2FFVC1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU095-2FFVC1517E FAQ
1.How can I place an order for XCKU095-2FFVC1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVC1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVC1517E reliable?
The price and inventory of XCKU095-2FFVC1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVC1517E is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVC1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVC1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVC1517E?
XCKU095-2FFVC1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVC1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVC1517E?
For technical support, including XCKU095-2FFVC1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVC1517E requirements.
6.How does Aetrix verify that XCKU095-2FFVC1517E is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVC1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVC1517E meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVC1517E?
All XCKU095-2FFVC1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVC1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVC1517E part is unused and in its original packaging.
Return procedure for XCKU095-2FFVC1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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