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AMD XCKU095-2FFVC1517I
- Part No.:
- XCKU095-2FFVC1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU095-2FFVC1517I.pdf
- Description:
- IC FPGA 520 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,410
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Product details
Overview
XCKU095-2FFVC1517I from AMD is a high-performance Kintex UltraScale FPGA featuring 942,000 logic cells, 5,520 DSP slices, and 64.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU095-2FFVC1517I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (832 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FFVC1517 package, and configuration interface compatibility (e.g., SPIx4, BPI, SelectMAP).
Technical Context
The XCKU095-2FFVC1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 24 GTY transceivers, 4 PCIe Gen3 x16 endpoints, and dual 12-bit 1MSPS ADCs. It uses 20nm bulk CMOS process and supports partial reconfiguration.
Configuration is performed via master SPI or JTAG, with support for AES-256 bitstream encryption and HMAC authentication. The device integrates dedicated clock management tiles (CMTs) with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 942,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 5,520 - enables high-throughput fixed/floating-point arithmetic for radar, AI inference, or video encoding |
| Block RAM | 64.2 Mb - provides on-die memory for buffering, FIFOs, or lookup tables without external memory latency |
| User I/O Count | 832 - supports wide parallel interfaces, multi-lane SerDes expansion, or high-pin-count peripheral bridging |
| GTY Transceivers | 24 × 16.3 Gb/s - delivers aggregate bandwidth up to 391.2 Gb/s for optical interconnect or backplane applications |
| Speed Grade | -2 - guarantees timing closure at highest operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualifies for deployment in uncooled industrial enclosures or outdoor base stations |
Pinout & Package
The XCKU095-2FFVC1517I is housed in a 1517-ball Flip-Chip Very Fine Pitch Ball Grid Array (FFVC) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via thermal lid and solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.95 V ±3% to FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration, clocking, and transceiver reference circuitry |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V); sets output voltage level and input threshold for connected peripherals |
| M0–M2 | Configuration mode pins | Determine boot source (SPI, BPI, or SelectMAP) and bus width during power-on initialization |
| CCLK | Configuration clock | Drives internal configuration shift register; may be internally generated or externally supplied |
| INIT_B | Configuration status | Active-low open-drain signal indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol specifications |
| Hardened DDR4 Memory Controller | Supports up to 2400 MT/s with ECC, eliminating need for external PHY and simplifying memory subsystem design |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized cloning of programmed functionality |
| Partial Reconfiguration | Enables dynamic logic swapping without system reset-critical for adaptive computing and mission-critical uptime |
| Integrated ADC (2×) | Provides 12-bit, 1 MSPS analog monitoring of power rails, temperature, or sensor inputs without external ADC components |
Applications
| 5G Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and massive MIMO precoding in active antenna systems. IC Role / Device Role / Timing Role: Primary compute accelerator handling L1/L2 PHY layer processing with deterministic latency. Use Value: 24 GTY transceivers enable direct fronthaul interface to remote radio units; -2 speed grade ensures timing margin for 400+ MHz clock domains. | Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture generation in airborne SAR platforms. IC Role / Device Role / Timing Role: High-throughput digital backend performing FFT, filtering, and matrix operations on digitized IF data. Use Value: 5,520 DSP slices deliver >2.2 TMAC/s throughput; integrated ADC monitors front-end gain stages for closed-loop calibration. |
| High-Performance Computing Acceleration | Industrial Machine Vision |
Use Scenario: Offloading convolution, reduction, and sparse matrix operations from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: Co-processor implementing custom neural network accelerators with low-latency host interface via PCIe Gen3 x16. Use Value: 942K logic cells accommodate large-scale systolic arrays; 64.2 Mb block RAM buffers multi-frame feature maps locally. | Use Scenario: Real-time defect classification, sub-pixel metrology, and multi-camera synchronization in semiconductor inspection tools. IC Role / Device Role / Timing Role: Deterministic image pipeline controller managing camera sensors, frame buffers, and FPGA-based CNN engines. Use Value: 832 user I/Os support parallel LVDS camera interfaces; industrial temp rating ensures reliability in factory-floor thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | Higher logic density (1,133K LC), 28 GTY transceivers, larger FFVD1924 package (1924-ball) | Better suited for designs requiring >1M LC or >24 transceivers; higher power and board area demand | Select when XCKU095-2FFVC1517I resource utilization exceeds 90% or additional transceivers are needed |
| XCKU060-2FFVA1156I | Lower logic count (562K LC), 16 GTY transceivers, smaller FFVA1156 package (1156-ball) | Targeted at cost-sensitive or space-constrained applications where full XCKU095 capability is unused | Choose if design fits within XCKU060 resources and requires lower thermal envelope or PCB layer count |
Compared with XCKU095-2FFVC1517I, the XCKU115-2FLVD1924I offers headroom for future scalability but increases BOM and cooling complexity, while the XCKU060-2FFVA1156I reduces footprint and power at the expense of DSP and transceiver bandwidth-making each alternative optimal only within distinct resource and thermal boundaries.
Availability
XCKU095-2FFVC1517I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-end test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU095-2FFVC1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, communications, and embedded markets.
The Kintex UltraScale family targets applications demanding high logic density, high-speed serial connectivity, and hardened memory/protocol controllers-optimized for compute acceleration and real-time signal processing.
FAQ
What is the maximum supported DDR4 data rate for XCKU095-2FFVC1517I?
The XCKU095-2FFVC1517I supports DDR4 memory interfaces up to 2400 MT/s using its hardened memory controller. This capability is verified in UG576 and applies to all I/O banks configured for SSTL12 I/O standard. The controller includes built-in write leveling, read leveling, and training sequences to ensure signal integrity across varying PCB trace lengths and temperatures. XCKU095-2FFVC1517I does not require external PHY components for DDR4 operation.
Does XCKU095-2FFVC1517I support partial reconfiguration?
Yes, XCKU095-2FFVC1517I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swapping without full device reset. This feature relies on dedicated configuration logic and frame-based bitstream addressing. XCKU095-2FFVC1517I requires proper floorplanning and checkpointed synthesis to isolate reconfigurable partitions. Use cases include runtime algorithm adaptation and fault-tolerant system updates.
What configuration modes are supported by XCKU095-2FFVC1517I?
XCKU095-2FFVC1517I supports master SPI, slave SPI, BPI, SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for compact, single-chip boot; BPI suits high-speed parallel flash devices. XCKU095-2FFVC1517I also supports fallback configuration and multi-boot images stored in external flash memory.
Is XCKU095-2FFVC1517I qualified for automotive applications?
No, XCKU095-2FFVC1517I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, AMD offers Zynq UltraScale+ MPSoC derivatives-not the XCKU095-2FFVC1517I.
How many GTY transceivers does XCKU095-2FFVC1517I include?
XCKU095-2FFVC1517I integrates 24 GTY transceivers, each capable of line rates from 500 Mb/s to 16.3 Gb/s. These transceivers support protocols including PCIe Gen3, SATA, CPRI, and custom high-speed serial links. All 24 GTYs are accessible in the FFVC1517 package, with dedicated reference clock inputs and power domains. XCKU095-2FFVC1517I's transceiver count is fixed and cannot be increased via software or configuration.
XCKU095-2FFVC1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 67200
- Number of Logic Elements/Cells:
- 1176000
- Total RAM Bits:
- 60518400
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU095-2FFVC1517I FAQ
1.How can I place an order for XCKU095-2FFVC1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU095-2FFVC1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU095-2FFVC1517I reliable?
The price and inventory of XCKU095-2FFVC1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU095-2FFVC1517I is usually 5 days.
3.What payment methods are accepted for XCKU095-2FFVC1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU095-2FFVC1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU095-2FFVC1517I?
XCKU095-2FFVC1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU095-2FFVC1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU095-2FFVC1517I?
For technical support, including XCKU095-2FFVC1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU095-2FFVC1517I requirements.
6.How does Aetrix verify that XCKU095-2FFVC1517I is sourced from the original manufacturer or authorized distributors?
All XCKU095-2FFVC1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU095-2FFVC1517I meets industry standards.
7.What is the process for return or replacement of XCKU095-2FFVC1517I?
All XCKU095-2FFVC1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU095-2FFVC1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU095-2FFVC1517I part is unused and in its original packaging.
Return procedure for XCKU095-2FFVC1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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