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AMD XCKU115-1FLVA1517C
- Part No.:
- XCKU115-1FLVA1517C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVA1517C.pdf
- Description:
- IC FPGA 624 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,070
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Product details
Overview
XCKU115-1FLVA1517C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,124K logic cells, 6,936 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and includes hardened 10/25/50 GbE MACs for high-speed networking applications in 5G infrastructure and radar signal processing.
For engineers reviewing the XCKU115-1FLVA1517C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (56 GTY), I/O voltage support (1.2–1.8 V), thermal design power (33.5 W typical), and package-specific routing constraints for FLVA1517.
Technical Context
The XCKU115-1FLVA1517C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, and multi-rate GTY transceivers supporting 10–50 Gb/s operation. It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC-compatible configuration only when paired with PS-side components - this part is PL-only and does not include processing system logic.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream security includes AES-256 decryption and HMAC authentication. The device targets deterministic low-latency signal processing where partial reconfiguration and clock domain crossing management are critical design considerations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 – determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 6,936 – enables parallel execution of high-throughput arithmetic operations in radar and AI inference pipelines |
| Block RAM | 48.5 Mb – provides on-chip memory for buffering real-time data streams without external DRAM latency |
| GTY Transceivers | 56 lanes @ 10–50 Gb/s – supports multi-channel 25G Ethernet, CPRI/eCPRI, and JESD204B/C serial links |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS – allows direct interfacing with DDR4, ADCs, DACs, and optical modules |
| Thermal Design Power | 33.5 W (typical) – defines heatsink and airflow requirements for sustained operation in enclosed 5G baseband units |
Pinout & Package
The XCKU115-1FLVA1517C is housed in a 1517-ball Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in carrier-grade systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C; shared with PS when used in MPSoC context - not active in PL-only XCKU115 |
| HR I/O Banks | High-Range I/O | Support 1.2–1.8 V signaling; compatible with DDR4 SDRAM and high-speed ADC interfaces |
| HP I/O Banks | High-Performance I/O | Support 1.0–1.8 V; optimized for source-synchronous interfaces like QDR SRAM and JESD204B |
| GTY_RXN/P[0:55] | Differential Transceiver Input | 56 dedicated differential pairs for multi-gigabit serial receive paths with integrated CDR |
| GTY_TXN/P[0:55] | Differential Transceiver Output | 56 dedicated differential pairs for transmit paths with programmable pre-emphasis and equalization |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables time-multiplexed logic and routing resources for higher effective utilization in packet classification engines |
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and ensures compliance with ECN and ASPM power management protocols |
| Integrated Clock Management | Includes MMCM and PLL blocks supporting jitter < 150 fs RMS for clean sampling clocks in RF front-end digitization |
| Partial Reconfiguration Support | Allows dynamic swapping of functional modules (e.g., modulation schemes) without system reset or downtime |
| Secure Bitstream Loading | AES-256 + HMAC prevents unauthorized configuration and ensures firmware integrity in deployed edge equipment |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Programmable logic fabric executes matrix multiplication and FFT kernels with deterministic latency under 200 ns. Use Value: 6,936 DSP slices enable concurrent processing of 128 spatial streams while maintaining timing closure at 300 MHz. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR and ground-based surveillance radars. IC Role / Device Role / Timing Role: High-speed GTY transceivers interface directly with ADC/DACs sampling at 2.4 GSPS; logic fabric performs real-time STAP filtering. Use Value: 48.5 Mb block RAM buffers full chirp waveforms for coherent integration without off-chip memory bottlenecks. |
| High-Speed Test Equipment | Optical Transport Network Line Card |
Use Scenario: Protocol-aware pattern generation and error injection for 100G/400G Ethernet compliance testing. IC Role / Device Role / Timing Role: GTY transceivers operate in loopback and PRBS modes; logic implements IEEE 802.3bj FEC encoding/decoding. Use Value: 56 GTY lanes allow simultaneous testing of multiple QSFP28/OSFP ports with independent BER monitoring per lane. | Use Scenario: OTU4 framing, forward error correction, and OTN switching in metro DWDM line cards. IC Role / Device Role / Timing Role: Hardened 10/25/50 GbE MACs handle client-side Ethernet mapping; logic implements G.709 OTU frame assembly. Use Value: PCIe Gen3 x16 interface enables high-bandwidth host CPU communication for control plane updates and performance monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FLVD1517I | Higher speed grade (-2), larger logic capacity (1,375K cells), same FLVD1517 package but different I/O bank distribution | Better suited for designs requiring >350 MHz system clock or additional DSP resources for AI acceleration | Select XCKU15P-2FLVD1517I only if timing closure fails on XCKU115-1FLVA1517C at target frequency |
| VU13P-2FLGA2577C | UltraScale+ architecture, 1,428K logic cells, 80 GTY transceivers, larger 2577-ball FCBGA package | Targets higher channel count systems (e.g., 8×100G line cards) where board space permits larger footprint and higher TDP | Choose VU13P-2FLGA2577C when >56 transceivers or >48.5 Mb BRAM are required for system scalability |
Compared with XCKU15P-2FLVD1517I and VU13P-2FLGA2577C, the XCKU115-1FLVA1517C delivers optimal balance of transceiver count, logic density, and thermal envelope for space-constrained 5G and radar platforms requiring 56-lane serial connectivity and deterministic processing latency.
Availability
XCKU115-1FLVA1517C is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCKU115-1FLVA1517C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt leadership.
The Kintex UltraScale family targets high-throughput, low-latency applications in wireless infrastructure, defense electronics, and instrumentation where transceiver bandwidth and logic efficiency are critical.
FAQ
What is the maximum supported data rate per GTY transceiver lane in the XCKU115-1FLVA1517C?
The XCKU115-1FLVA1517C supports GTY transceiver data rates from 10 Gb/s up to 50 Gb/s per lane, with validated operation at 25.78125 Gb/s for 25G Ethernet and 28.05 Gb/s for CPRI. These rates are achievable using the device's built-in CDR and equalization circuitry without external retiming.
Does the XCKU115-1FLVA1517C include an integrated ARM processor subsystem?
No, the XCKU115-1FLVA1517C is a programmable logic-only (PL-only) device and does not contain a processing system (PS). It lacks ARM Cortex-A53 cores, DDR controllers, or peripheral interfaces found in Zynq UltraScale+ MPSoC devices. All processing must be implemented in fabric logic or offloaded to external processors.
What configuration modes are supported by the XCKU115-1FLVA1517C?
The XCKU115-1FLVA1517C supports master SPI (quad and standard), slave SPI, BPI, and JTAG configuration modes. Configuration bitstreams can be loaded from external flash memory or streamed via PCIe using partial reconfiguration controllers, enabling field-upgradable functionality without hardware reset.
Is the XCKU115-1FLVA1517C pin-compatible with other Kintex UltraScale devices in the FLVA1517 package?
No, the XCKU115-1FLVA1517C is not pin-compatible with other Kintex UltraScale devices in the FLVA1517 package. While sharing the same 1517-ball FCBGA mechanical footprint, I/O bank assignments, voltage requirements, and transceiver placement differ significantly between speed grades and logic densities, requiring unique PCB layout per part number.
What is the recommended operating junction temperature range for the XCKU115-1FLVA1517C?
The XCKU115-1FLVA1517C is rated for commercial temperature operation from 0 °C to 85 °C junction temperature. Thermal design must ensure that under worst-case power conditions (33.5 W typical, up to 42 W peak), the silicon junction remains within this range using appropriate heatsinking and airflow per AMD UG578 guidelines.
XCKU115-1FLVA1517C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 624
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU115-1FLVA1517C FAQ
1.How can I place an order for XCKU115-1FLVA1517C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVA1517C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVA1517C reliable?
The price and inventory of XCKU115-1FLVA1517C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVA1517C is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVA1517C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVA1517C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVA1517C?
XCKU115-1FLVA1517C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVA1517C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVA1517C?
For technical support, including XCKU115-1FLVA1517C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVA1517C requirements.
6.How does Aetrix verify that XCKU115-1FLVA1517C is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVA1517C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVA1517C meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVA1517C?
All XCKU115-1FLVA1517C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVA1517C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVA1517C part is unused and in its original packaging.
Return procedure for XCKU115-1FLVA1517C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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