AMD XCKU115-1FLVA1517I

Overview

XCKU115-1FLVA1517I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,138,400 logic cells, 6,935 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gbps GTY transceivers. Used in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU115-1FLVA1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support, thermal design power budget, and configuration interface options.

Technical Context

The XCKU115-1FLVA1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe, Ethernet MAC, memory controllers), and high-speed serial transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration.

Configuration is performed via quad-SPI, BPI, or JTAG; startup time is ≤100 ms. The device includes integrated clock management (MMCM/PLL) supporting jitter < 150 fs RMS and output frequencies from 10 MHz to 800 MHz.

Key Specifications

Pinout & Package

Package: 1517-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU115-2FLVA1517I, the XCKU115-1FLVA1517I trades peak timing margin for lower static power and reduced cooling requirements; versus XCKU085-1FLVA1517I, it delivers 48% more DSP slices and 51% more block RAM within identical board space.

Availability

XCKU115-1FLVA1517I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and medical imaging equipment requiring stable component supply across multi-year production cycles.

Supply support for XCKU115-1FLVA1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets.

The Kintex UltraScale family targets high-throughput, low-latency applications demanding hardened interfaces, scalable logic density, and power-efficient serial connectivity.

FAQ

What is the maximum supported DDR4 data rate for the XCKU115-1FLVA1517I?

The XCKU115-1FLVA1517I supports DDR4 memory interfaces up to 2400 Mbps per pin. This specification is validated across all I/O banks designated for memory interface use (HP banks 48–53), with built-in write leveling, read leveling, and gate training circuitry. The XCKU115-1FLVA1517I includes hardened DDR4 controller IP that handles refresh, self-refresh, and ZQ calibration automatically.

Does the XCKU115-1FLVA1517I include integrated transceivers, and what protocols do they support?

Yes, the XCKU115-1FLVA1517I integrates 40 GTY transceivers operating up to 32.75 Gbps. These support protocols including 100G Ethernet (CAUI-4), CPRI v7, PCIe Gen3 x16, and Interlaken. Each GTY transceiver includes TX/RX equalization, clock data recovery, and PRBS pattern generation/checking. The XCKU115-1FLVA1517I's transceivers are not compatible with older GTH or GTX families due to architectural differences.

What configuration modes are supported by the XCKU115-1FLVA1517I?

The XCKU115-1FLVA1517I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI mode enables fast boot from serial flash with configuration rates up to 800 Mbps. Configuration bitstream authentication and decryption are supported via AES-256 and HMAC-SHA256. The XCKU115-1FLVA1517I also supports fallback configuration and dual-boot capability using external flash devices.

Is partial reconfiguration supported on the XCKU115-1FLVA1517I, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XCKU115-1FLVA1517I using Vivado Design Suite 2022.2 or later. It requires dedicated Pblock constraints, checkpoint-based flow, and configuration port (ICAP) access. The XCKU115-1FLVA1517I allows dynamic replacement of up to 80% of logic fabric while maintaining active I/O and transceiver operation. Bitstream encryption must be disabled for partial bitstreams.

What thermal management guidance applies to the XCKU115-1FLVA1517I in continuous operation?

The XCKU115-1FLVA1517I has a maximum junction temperature of 100°C and requires a thermal solution capable of dissipating 35 W typical power under full utilization. AMD specifies a θJA of 5.2°C/W for the FLVA1517 package with 200 LFM airflow and 4-layer PCB. The XCKU115-1FLVA1517I includes on-die temperature sensors accessible via XADC, enabling closed-loop thermal throttling in system firmware.