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AMD XCKU115-1FLVA2104C
- Part No.:
- XCKU115-1FLVA2104C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVA2104C.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,055
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Product details
Overview
XCKU115-1FLVA2104C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It integrates 24 GTY transceivers supporting up to 32.75 Gb/s, and is packaged in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU115-1FLVA2104C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support (1.2 V/1.35 V/1.8 V), thermal performance under sustained 28 W typical power, and configuration interface compatibility (e.g., x4 PCIe Gen3, Quad-SPI).
Technical Context
The XCKU115-1FLVA2104C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 10/25/100G Ethernet MAC), and multi-rate transceivers. Its GTY transceivers support PAM4 and NRZ modulation, and the device includes dedicated clock management tiles with MMCM and PLL resources.
Configuration is performed via Master SPI or SelectMAP interfaces, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 6,930 - enables parallel execution of high-precision arithmetic operations for real-time filtering and FFTs |
| Block RAM | 48.5 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external memory latency |
| GTY Transceivers | 24 × up to 32.75 Gb/s - supports multi-lane serial protocols including CPRI, eCPRI, and OTN framing |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - enables direct interfacing with ADCs, DACs, FPGAs, and display controllers |
| Configuration Interface | Master SPI x4, SelectMAP x32 - allows flexible boot modes and secure bitstream loading |
| Thermal Design Power | 28 W typical - defines heatsink sizing and airflow requirements for continuous operation in enclosed enclosures |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source (SPI/SelectMAP/BPI) and configuration mode at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic timing; supports up to 100 MHz during bitstream load |
| DIN | Serial Data Input | Receives encrypted bitstream from SPI flash; requires precise setup/hold timing relative to CCLK |
| INIT_B | Initialization Status | Open-drain active-low signal indicating configuration readiness or error state |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| GTYP/GTYN | Differential Transceiver Pairs | Support AC-coupled 100 Ω differential routing; require strict length matching within ±5 mil |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol layers |
| UltraScale+ SelectIO Technology | Enables simultaneous operation across multiple I/O standards in adjacent banks without interference |
| Integrated 100G Ethernet MAC | Offloads MAC-layer processing from CPU/FPGA fabric, reducing latency for packet classification and forwarding |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized bitstream execution and detects tampering during field updates |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions while maintaining system operation-critical for radar waveform agility |
Applications
| 5G Massive MIMO Baseband Processing | Aerospace Radar Signal Conditioning |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary baseband processor executing OFDM symbol generation, MIMO precoding, and digital up/down conversion. Use Value: 6,930 DSP slices enable concurrent execution of 128×128 matrix inversion; GTY transceivers interface directly with RFICs at 28.5 Gb/s. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: High-throughput digital receiver front-end handling ADC sampling at 2.4 GS/s and real-time STAP filtering. Use Value: 48.5 Mb block RAM buffers full-frame IQ data; hardened Ethernet MAC streams processed radar video over deterministic 100G links. |
| High-Frequency Trading Acceleration | Test & Measurement Instrumentation |
Use Scenario: Low-latency order matching and risk engine execution with sub-500 ns end-to-end pipeline delay. IC Role / Device Role / Timing Role: Deterministic hardware accelerator co-located with x86 host via PCIe Gen3 x16, bypassing OS stack. Use Value: Hardened PCIe endpoint guarantees ≤125 ns transaction latency; logic cells implement custom matching engines with zero software jitter. | Use Scenario: Multi-channel oscilloscope with 16-bit, 1 GS/s sampling and real-time FFT spectrum analysis. IC Role / Device Role / Timing Role: Time-interleaved ADC controller, digital down-converter, and spectral post-processing unit. Use Value: SelectIO supports LVDS input from 16-bit ADCs; DSP slices compute 16k-point FFT in <1.2 μs per frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVA2104I | Higher speed grade (-2): supports 32.75 Gb/s GTY at junction temperature up to 100°C vs. 85°C for -1 grade | Required for extended-temperature industrial or avionics deployments where ambient exceeds 70°C | Select when thermal margin is constrained and transceiver speed headroom must be preserved across temperature range |
| XCKU085-1FLVA1517C | Smaller footprint (1517-pin), reduced resources: 832K logic cells, 5,420 DSP slices, 32.1 Mb BRAM, 16 GTY transceivers | Suitable for cost-optimized 5G small cells or mid-tier test equipment where full XCKU115 capability is unused | Choose when design fits within lower resource ceiling and board space is limited by 1517-pin package constraints |
Compared with XCKU115-2FLVA2104I, the XCKU115-1FLVA2104C trades thermal robustness for lower static power and cost; compared with XCKU085-1FLVA1517C, it delivers 41% more logic cells and 28% more transceivers at the expense of larger PCB area and higher cooling demand.
Availability
XCKU115-1FLVA2104C is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-frequency trading hardware requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU115-1FLVA2104C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding high I/O bandwidth, advanced transceivers, and hardened IP-especially in wireless infrastructure and defense electronics.
FAQ
What is the maximum supported GTY transceiver data rate for XCKU115-1FLVA2104C?
The XCKU115-1FLVA2104C supports GTY transceivers up to 32.75 Gb/s in NRZ mode and 58.0 Gb/s in PAM4 mode under specified operating conditions. This rating applies to all 24 GTY channels and is validated per AMD UG578 v1.14. The actual achievable rate depends on PCB interconnect quality, reference clock stability, and temperature. XCKU115-1FLVA2104C must be configured with appropriate GTY settings and equalization to sustain these rates in production systems.
Does XCKU115-1FLVA2104C support partial reconfiguration?
Yes, XCKU115-1FLVA2104C fully supports partial reconfiguration through Vivado Design Suite v2022.2 and later. This capability allows dynamic logic module swapping without resetting the entire device. XCKU115-1FLVA2104C uses frame-based reconfiguration with CRC-protected bitstreams and supports both hierarchical and modular flows. It is widely used in radar and communications systems where waveform agility or protocol adaptation is required.
What configuration modes are supported by XCKU115-1FLVA2104C?
XCKU115-1FLVA2104C supports Master SPI (x1/x2/x4), Slave SelectMAP (x8/x16/x32), and BPI parallel NOR flash modes. Configuration is initiated via PROGRAM_B and controlled by M0–M2 pins. XCKU115-1FLVA2104C also supports JTAG for debugging and fallback configuration. All modes support AES-256 bitstream encryption and HMAC authentication as defined in UG570.
What is the I/O voltage range supported by XCKU115-1FLVA2104C banks?
XCKU115-1FLVA2104C supports I/O voltages of 1.2 V, 1.35 V, and 1.8 V across its 24 SelectIO banks. Each bank operates independently, enabling mixed-voltage interfaces on a single device. XCKU115-1FLVA2104C does not support 2.5 V or 3.3 V I/O standards. Bank-specific VCCO and VRP/VRN references must be supplied per UG571, and incompatible voltage combinations are prohibited.
Is XCKU115-1FLVA2104C qualified for automotive applications?
No, XCKU115-1FLVA2104C is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for commercial (0°C to 85°C) and industrial (−40°C to 100°C) temperature ranges depending on speed grade. XCKU115-1FLVA2104C lacks automotive-specific features such as dual-lockstep processors, ISO 26262 documentation packages, or fault-injection test reports. For automotive use, AMD offers Zynq UltraScale+ MPSoC devices instead.
XCKU115-1FLVA2104C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU115-1FLVA2104C FAQ
1.How can I place an order for XCKU115-1FLVA2104C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVA2104C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVA2104C reliable?
The price and inventory of XCKU115-1FLVA2104C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVA2104C is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVA2104C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVA2104C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVA2104C?
XCKU115-1FLVA2104C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVA2104C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVA2104C?
For technical support, including XCKU115-1FLVA2104C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVA2104C requirements.
6.How does Aetrix verify that XCKU115-1FLVA2104C is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVA2104C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVA2104C meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVA2104C?
All XCKU115-1FLVA2104C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVA2104C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVA2104C part is unused and in its original packaging.
Return procedure for XCKU115-1FLVA2104C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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