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AMD XCKU115-1FLVB1760I
- Part No.:
- XCKU115-1FLVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVB1760I.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,497
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Product details
Overview
XCKU115-1FLVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,143,200 logic cells, 6,935 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU115-1FLVB1760I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (520 HP I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal management for FLVB1760 package, and configuration interface compatibility (e.g., Quad-SPI, BPI, JTAG).
Technical Context
The XCKU115-1FLVB1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-gigabit transceivers. Its UltraScale+ architecture enables time-multiplexed I/O and dynamic reconfiguration via partial reconfiguration support.
It integrates 24 GTY transceivers supporting protocols including CPRI, JESD204B/C, and 10G/25G Ethernet. Configuration is performed through Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,143,200 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 6,935 - enables high-throughput fixed/floating-point computation for radar, AI inference, and filtering |
| Block RAM | 48.5 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceiver Max Rate | 16.3 Gb/s - supports JESD204C and 25G Ethernet physical layer signaling |
| I/O Count | 520 HP I/Os - delivers high-speed single-ended and differential I/O across HR and HP banks |
| Speed Grade | -1 - specifies timing closure margin and maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualifies for deployment in industrial control, aerospace, and base station environments |
Pinout & Package
The XCKU115-1FLVB1760I is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and mechanical design requires adherence to AMD's PCB stack-up guidelines and use of thermal vias under the die pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, JTAG) and configuration width during power-on reset |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated clock for Master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device initialization |
| INIT_B | Configuration Initialization | Active-low signal indicating readiness to accept configuration data or presence of error |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
| HP[0–31]_IO | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V I/O standards with adjustable drive strength and slew rate |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic updates without system reset-critical for adaptive radio and mission-critical fault recovery |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× more DSP throughput versus previous generation Kintex devices |
| Secure Boot with HMAC | Verifies bitstream authenticity using SHA-256-based HMAC before execution-prevents unauthorized firmware injection |
| Hardened PCIe Gen3 x16 Block | Reduces integration effort and resource usage for host interface connectivity in compute-accelerated platforms |
| DDR4 Memory Controller | Supports dual-rank, 64-bit-wide DDR4-2400 interfaces with ECC-enables high-bandwidth, reliable system memory subsystems |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and digital down-conversion in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFTs and channel compensation algorithms; GTY transceivers interface with ADC/DAC FMC modules. Use Value: 16.3 Gb/s transceivers enable direct sampling of IF signals up to 3 GHz, eliminating analog mixing stages. | Use Scenario: Uplink/downlink precoding and channel estimation in 5G NR base stations. IC Role / Device Role / Timing Role: Configurable logic implements massive MIMO matrix inversion and OFDM modulation/demodulation pipelines. Use Value: 6,935 DSP slices deliver >2.1 TMAC/s for real-time spatial processing across 64+ antenna elements. |
| High-Frequency Trading Engine | AI Inference Accelerator |
Use Scenario: Sub-microsecond order routing and risk checking in financial exchange gateways. IC Role / Device Role / Timing Role: Deterministic latency path from network interface (25G Ethernet) to decision logic and market feed parser. Use Value: 520 HP I/Os allow concurrent 25G Ethernet, PCIe Gen3 x16, and DDR4-2400 interfaces-minimizing interconnect bottlenecks. | Use Scenario: Low-latency, batch-size-1 inference for vision and NLP models at edge data centers. IC Role / Device Role / Timing Role: Custom systolic array mapped to logic fabric; block RAM used for weight caching; PCIe Gen3 x16 for host model upload. Use Value: 48.5 Mb block RAM reduces off-chip DRAM accesses by >70% for LLM attention layers with <128-token context. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVB1760I | Faster speed grade (-2) enabling higher clock frequencies and tighter timing margins; higher static power consumption | Better suited for designs requiring >300 MHz system clocks or aggressive timing closure on large datapaths | Select when timing closure fails at -1 grade or when target frequency exceeds 280 MHz in critical paths |
| XCKU085-1FLVB1517I | Reduced logic cells (832,000), fewer DSP slices (5,400), smaller 1517-pin FCBGA package, lower I/O count (420) | Targeted at cost-optimized 5G small cells and mid-tier radar where full XCKU115 capacity is unused | Choose when design fits within 85% of XCKU115 resources and thermal/power envelope must be reduced by ≥22% |
Compared with XCKU115-2FLVB1760I, the XCKU115-1FLVB1760I trades peak performance for lower power and cost; compared with XCKU085-1FLVB1517I, it delivers 37% more logic and 28% more DSP for scalable infrastructure upgrades without board redesign.
Availability
XCKU115-1FLVB1760I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and high-frequency trading systems requiring stable component supply over extended production lifecycles.
Supply support for XCKU115-1FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-optimized for wireless infrastructure, test & measurement, and real-time video processing.
FAQ
What is the maximum supported DDR4 data rate for the XCKU115-1FLVB1760I?
The XCKU115-1FLVB1760I supports DDR4 memory interfaces up to 2400 Mbps per pin (1200 MHz clock). This is implemented via its hardened DDR4 memory controller supporting dual-rank, 64-bit-wide configurations with on-die termination and ECC capability. The controller is validated for JEDEC-compliant DDR4-2400 modules and requires specific PCB layout rules for signal integrity.
Does the XCKU115-1FLVB1760I support partial reconfiguration?
Yes, the XCKU115-1FLVB1760I supports partial reconfiguration through its UltraScale architecture. This allows dynamic replacement of logic modules while the rest of the design remains operational. Implementation requires Vivado Design Suite 2020.2 or later, proper Pblock constraints, and bitstream encryption keys managed via AMD's Secure Boot flow. The feature is used in radar and comms systems requiring runtime protocol adaptation.
What configuration modes are supported by the XCKU115-1FLVB1760I?
The XCKU115-1FLVB1760I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Master SPI is most common for compact, low-pin-count boot; Slave SelectMAP enables high-speed parallel configuration; JTAG is used for debugging and programming during development. All modes support bitstream encryption and HMAC verification.
What is the thermal design power (TDP) of the XCKU115-1FLVB1760I?
The XCKU115-1FLVB1760I has a typical thermal design power of 35 W under representative high-activity workloads, with a maximum junction temperature of 100°C. Actual power varies significantly based on logic utilization, I/O activity, and transceiver usage. AMD's XPE (Xilinx Power Estimator) tool v2023.1 provides accurate estimates using user-specific design netlists and constraints.
Is the XCKU115-1FLVB1760I pin-compatible with other Kintex UltraScale devices?
No, the XCKU115-1FLVB1760I is not pin-compatible with other Kintex UltraScale devices due to its unique 1760-ball FLVB package and I/O bank arrangement. While XCKU085 and XCKU115 share architectural similarities, their packages differ (1517 vs. 1760 balls), and ball assignments for HR/HP banks, configuration, and power domains are not interchangeable. Board-level migration requires PCB redesign.
XCKU115-1FLVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU115-1FLVB1760I FAQ
1.How can I place an order for XCKU115-1FLVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVB1760I reliable?
The price and inventory of XCKU115-1FLVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVB1760I is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVB1760I?
XCKU115-1FLVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVB1760I?
For technical support, including XCKU115-1FLVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVB1760I requirements.
6.How does Aetrix verify that XCKU115-1FLVB1760I is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVB1760I meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVB1760I?
All XCKU115-1FLVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVB1760I part is unused and in its original packaging.
Return procedure for XCKU115-1FLVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU115-1FLVB1760I Tags
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