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AMD XCKU115-1FLVB2104I
- Part No.:
- XCKU115-1FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,844
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Product details
Overview
XCKU115-1FLVB2104I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,935 DSP slices, 48.5 Mb of block RAM, 96 GTY transceivers supporting up to 32.75 Gb/s, and integrated PCI Express Gen3 x16 endpoint capability - deployed in high-throughput data center acceleration and radar signal processing systems.
For engineers reviewing the XCKU115-1FLVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, PCIe Gen3 endpoint integration, and thermal performance under sustained 28W typical power draw.
Technical Context
The XCKU115-1FLVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, memory controllers), and multi-rate GTY transceivers. It supports DDR4, LPDDR4, and RLDRAM3 interfaces with deterministic timing closure up to 2,400 MT/s.
Configuration occurs via quad-SPI or BPI flash, JTAG, or SelectMAP interface; partial reconfiguration is supported. The -1 speed grade guarantees operation at junction temperatures up to 100°C with VCCINT = 0.85V ±3%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - determines maximum concurrent parallel logic depth and resource availability for complex RTL implementations |
| DSP Slices | 6,935 - enables high-throughput fixed/floating-point computation for FFT, filtering, and matrix operations |
| Block RAM | 48.5 Mb - supports large on-die buffering, FIFOs, and coefficient storage without external memory |
| GTY Transceivers | 96 lanes, up to 32.75 Gb/s - delivers serial connectivity for optical interconnects, AIB, and high-speed backplanes |
| PCIe Interface | Gen3 x16 endpoint - provides direct host CPU attachment with ≤100 ns transaction latency and DMA support |
| I/O Standards | Supports LVDS, SSTL, HSTL, MIPI, and sub-1.0V banks - enables direct interfacing with sensors, ADCs, and memory |
| Speed Grade | -1 - specifies guaranteed timing performance at 0.85V VCCINT and 100°C junction temperature |
Pinout & Package
The XCKU115-1FLVB2104I is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V/3.3V I/O standards |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4/LPDDR4 interfaces up to 2400 MT/s with calibrated termination |
| HR[0:47] | High-Density I/O Bank | Provides flexible single-ended and differential signaling including LVDS and MIPI D-PHY |
| GTYTXn/GTYRXn | Transceiver Differential Pair | Each pair operates from 500 Mb/s to 32.75 Gb/s with built-in CDR and PRBS generation |
| PCIE_CLK/MGTREFCLK | Reference Clock Input | Accepts 100 MHz differential clock for PCIe root port or transceiver PLL reference |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate 0.85V (core), 1.8V (aux), and programmable 1.2–3.3V (I/O) domains enable low-noise partitioning |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort by eliminating soft IP synthesis and verification overhead |
| 96 GTY Transceivers | Enables 3×100G Ethernet or 12×25G SerDes links without external retimers |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× DSP throughput versus 7-series FPGAs |
| Partial Reconfiguration Support | Allows dynamic function swapping in operational systems without full device reboot |
| Integrated Memory Controllers | Supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 with ECC and calibration logic |
Applications
| Data Center Acceleration | Radar Signal Processing |
|---|---|
Use Scenario: Real-time packet classification and encryption offload in SmartNICs and DPU platforms. IC Role / Device Role / Timing Role: Configurable hardware accelerator executing parallel match-action pipelines and AES-GCM engines. Use Value: Achieves 100+ Gbps line-rate processing with <5 µs latency using on-die GTY transceivers and hardened PCIe Gen3 x16. | Use Scenario: Digital beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Real-time correlator and FFT engine synchronizing 128+ RF channels with deterministic sub-cycle timing. Use Value: Leverages 6,935 DSP slices and 48.5 Mb block RAM to sustain 2.1 TFLOPS peak compute without external memory bottlenecks. |
| 5G Baseband Processing | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing for massive MIMO and channel coding in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing LDPC encoding/decoding and OFDM modulation/demodulation. Use Value: Uses hardened 100G Ethernet MAC and GTY transceivers to interface directly with fronthaul optics at 25.78125 Gb/s. | Use Scenario: High-resolution digital sampling and real-time waveform analysis in modular PXIe oscilloscopes. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and pattern generator with jitter-clean clock distribution. Use Value: Delivers <100 fs RMS jitter on GTY outputs and supports 16-bit, 1 GS/s acquisition via synchronized HP I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVB2104I | Higher -2 speed grade: supports 10% faster logic timing and 100 MHz higher transceiver reference clock tolerance | Suitable for designs requiring tighter setup/hold margins or >30 Gb/s transceiver operation | Select when timing closure fails at -1 grade or when operating beyond 32.75 Gb/s with custom equalization |
| XCKU085-1FLVB2104I | Reduced resources: 832K logic cells, 5,200 DSP slices, 32.1 Mb BRAM, 60 GTY transceivers | Better cost/performance fit for mid-scale 5G L1 or vision preprocessing where full XCKU115 capacity is unused | Choose to reduce BOM cost and power consumption while retaining FLVB2104 package compatibility and I/O pinout |
Compared with XCKU115-2FLVB2104I, the XCKU115-1FLVB2104I trades speed margin for lower static power and thermal footprint; versus XCKU085-1FLVB2104I, it delivers 41% more logic and 32% more transceivers within identical mechanical and thermal constraints.
Availability
XCKU115-1FLVB2104I is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G baseband applications requiring stable component supply across multi-year production cycles.
Supply support for XCKU115-1FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with focus on performance-per-watt innovation.
The Kintex UltraScale family targets high-throughput, low-latency applications demanding hardened I/O, transceivers, and memory controllers - optimized for infrastructure acceleration and real-time signal processing.
FAQ
What is the maximum supported transceiver data rate for the XCKU115-1FLVB2104I?
The XCKU115-1FLVB2104I supports GTY transceivers operating up to 32.75 Gb/s per lane. This rate is guaranteed under specified conditions including VCCINT = 0.85V, junction temperature ≤100°C, and use of proper reference clocks and PCB stack-up per AMD UG578. The XCKU115-1FLVB2104I does not support PAM4 signaling natively.
Does the XCKU115-1FLVB2104I include a hardened PCIe Gen3 controller?
Yes, the XCKU115-1FLVB2104I integrates a hardened PCIe Gen3 x16 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports link training, power management states (L0s/L1), and DMA transfers without consuming programmable logic resources. The XCKU115-1FLVB2104I does not include a root complex configuration.
What I/O standards are supported by the HP I/O banks on the XCKU115-1FLVB2104I?
The HP I/O banks on the XCKU115-1FLVB2104I support DDR4, LPDDR4, and RLDRAM3 memory interfaces with calibrated output drivers and input receivers. They operate at VCCO voltages of 1.2V, 1.35V, and 1.5V, and include dedicated write-leveling and read-leveling circuitry required for JEDEC-compliant memory subsystems. The XCKU115-1FLVB2104I HP banks do not support SSTL-18 for non-memory applications.
Is partial reconfiguration supported on the XCKU115-1FLVB2104I?
Yes, the XCKU115-1FLVB2104I fully supports partial reconfiguration through the Vivado Design Suite using frame-based bitstream updates. This allows dynamic replacement of logical modules while maintaining system operation - critical for mission-critical radar and telecom systems. The XCKU115-1FLVB2104I requires specific placement constraints and checkpointed synthesis to ensure timing integrity during reconfiguration.
What is the thermal design power (TDP) of the XCKU115-1FLVB2104I under typical operation?
The XCKU115-1FLVB2104I has a typical power consumption of 28W under representative high-activity workloads including GTY transceivers at 25.78125 Gb/s, DDR4-2400 interfaces, and 70% logic utilization. Peak power may reach 42W under worst-case corner conditions. Thermal solution design must accommodate 100°C maximum junction temperature per AMD DS923. The XCKU115-1FLVB2104I thermal lid is soldered and not user-replaceable.
XCKU115-1FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU115-1FLVB2104I FAQ
1.How can I place an order for XCKU115-1FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVB2104I reliable?
The price and inventory of XCKU115-1FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVB2104I?
XCKU115-1FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVB2104I?
For technical support, including XCKU115-1FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVB2104I requirements.
6.How does Aetrix verify that XCKU115-1FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVB2104I?
All XCKU115-1FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVB2104I part is unused and in its original packaging.
Return procedure for XCKU115-1FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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