My Inquiry
My Account
AMD XCKU115-1FLVD1924C
- Part No.:
- XCKU115-1FLVD1924C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVD1924C.pdf
- Description:
- IC FPGA 832 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,597
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU115-1FLVD1924C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,840 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 16.3 Gb/s transceivers. It is deployed in high-bandwidth data center acceleration and 100G Ethernet line cards.
For engineers reviewing the XCKU115-1FLVD1924C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, I/O voltage support (1.2V/1.35V/1.8V), thermal design power (29W typical), and package-specific I/O banking constraints.
Technical Context
The XCKU115-1FLVD1924C implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen3, 100G Ethernet MAC, memory controllers), and multi-rate transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration.
It integrates dual 100G Ethernet MACs, AXI4-Stream interfaces for high-throughput data flow, and configurable I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - total available LUT-based fabric resources for custom logic implementation |
| DSP Slices | 6,840 - dedicated arithmetic units supporting 27×18 multiply-accumulate at 500+ MHz |
| Block RAM | 48.5 Mb - configurable memory blocks usable as FIFOs, buffers, or lookup tables |
| Transceiver Speed | 16.3 Gb/s - maximum line rate per GTY transceiver lane, supporting 100G KR4/CAUI-4 |
| PCIe Interface | Gen3 x16 - hard IP supporting root complex and endpoint roles with full protocol compliance |
| DDR4 Support | 2400 Mbps - validated interface to DDR4 SDRAM with on-die termination and write leveling |
| TDP | 29 W typical - thermal design power under typical high-activity configuration, guides heatsink selection |
Pinout & Package
The XCKU115-1FLVD1924C is housed in a 1924-ball Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference Clock Input | Provides clean low-jitter reference for GTY transceivers; requires AC-coupled 100 Ω differential termination |
| HR_IO[0-719] | High-Range I/O Bank | Supports 1.2V–1.8V single-ended and differential standards; bank-voltage dependent |
| HP_IO[0-539] | High-Performance I/O Bank | Supports 1.2V/1.35V only; optimized for DDR4 and high-speed serial protocols |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated differential input for PCIe Gen3 hard IP; must meet ±30 ppm frequency accuracy |
| VCCINT | Core Supply | 0.95 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Supply | 1.8 V ±3% supply for configuration, clocking, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated dual 100G MAC blocks compliant with IEEE 802.3bj, eliminating external PHY and reducing latency |
| PCIe Gen3 x16 Hard IP | Full root complex and endpoint capability with DMA engine and MSI-X support, reducing soft-core overhead |
| Partial Reconfiguration | Enables dynamic logic swapping without system reset, critical for adaptive compute and runtime protocol switching |
| GTY Transceivers | 32 lanes operating up to 16.3 Gb/s with built-in PRBS generation/checking and eye monitoring |
| UltraScale Architecture | Column-based tile layout with dedicated routing for predictable timing closure in large designs |
Applications
| Data Center Acceleration | 100G Optical Transport |
|---|---|
Use Scenario: Offloading encryption, compression, and packet processing from CPU in cloud servers. IC Role / Device Role / Timing Role: Programmable accelerator with deterministic latency and PCIe host interface. Use Value: Achieves >5× throughput vs. software-only implementation while maintaining sub-100 ns PCIe round-trip latency. | Use Scenario: Line-side framing and forward error correction in coherent optical modules. IC Role / Device Role / Timing Role: Protocol-aware transport processor with 100G KR4 and CAUI-4 transceiver interface. Use Value: Enables single-chip 100G client-side termination with integrated FEC and OTU4 mapping logic. |
| High-Frequency Trading | Test & Measurement Equipment |
Use Scenario: Real-time market data parsing, order matching, and low-latency execution logic. IC Role / Device Role / Timing Role: Deterministic timing engine with sub-nanosecond jitter clocking and ultra-low latency I/O paths. Use Value: Delivers consistent <80 ns end-to-end latency from network input to FPGA output under full load. | Use Scenario: High-resolution signal generation and analysis in modular instrumentation platforms. IC Role / Device Role / Timing Role: Multi-channel synchronized waveform generator with DDR4-based pattern memory and 16.3 Gb/s serial output. Use Value: Supports 12-bit, 2 GS/s arbitrary waveform generation using on-chip memory and transceiver serialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | Higher speed grade (-2), 10% higher max transceiver speed (16.8 Gb/s), 15% higher static power | Suitable for designs requiring margin in timing closure or higher serial line rates | Select when targeting worst-case PVT corners or needing >16.3 Gb/s operation |
| XCKU085-1FLVA1156C | Smaller logic capacity (820K LC), fewer GTY lanes (24 vs. 32), same package footprint but different ball map | Targeted at cost-sensitive 40G/50G systems where full XCKU115 capability is unused | Choose for reduced BOM cost and simpler thermal management where bandwidth and logic density allow |
Compared with XCKU115-2FLVD1924I, the XCKU115-1FLVD1924C trades speed margin for lower power and cost; compared with XCKU085-1FLVA1156C, it delivers 43% more logic and 33% more transceivers in a larger, thermally distinct package-critical for scalable 100G+ infrastructure.
Availability
XCKU115-1FLVD1924C is available at Aetrix Electronics and suitable for data center acceleration, 100G optical transport, and high-frequency trading systems requiring stable component supply across multi-year production cycles.
Supply support for XCKU115-1FLVD1924C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale family targets high-throughput, low-latency applications such as networking, compute acceleration, and test equipment-designed to balance performance, power, and cost in mid-range FPGA deployments.
FAQ
What is the maximum supported DDR4 data rate for the XCKU115-1FLVD1924C?
The XCKU115-1FLVD1924C supports DDR4 SDRAM at up to 2400 Mbps per pin, validated with JEDEC-compliant timing parameters, on-die termination, and write-leveling calibration. This rate applies to HP I/O banks configured for 1.2 V operation and requires matched trace lengths and proper VREF routing per UG576.
Does the XCKU115-1FLVD1924C include hardened PCIe Gen3 IP?
Yes, the XCKU115-1FLVD1924C integrates hardened PCIe Gen3 x16 root complex and endpoint IP with full protocol compliance, MSI-X support, and integrated DMA engines. The IP operates without soft-core overhead and meets PCI-SIG specification requirements for link training and error handling.
What package type and ball count does the XCKU115-1FLVD1924C use?
The XCKU115-1FLVD1924C uses a 1924-ball Flip-Chip BGA (FCBGA) package with 0.8 mm pitch and an integrated heat spreader. Its mechanical dimensions are 45 mm × 45 mm, and it complies with JEDEC MO-271AB standard for thermal and mechanical reliability.
Can the XCKU115-1FLVD1924C support 100G Ethernet without external PHY chips?
Yes, the XCKU115-1FLVD1924C includes dual hardened 100G Ethernet MACs compliant with IEEE 802.3bj, enabling direct KR4/CAUI-4 interface to gearbox ICs or direct copper backplane connection-eliminating the need for discrete PHYs in many 100G line card designs.
What is the typical thermal design power (TDP) of the XCKU115-1FLVD1924C?
The XCKU115-1FLVD1924C has a typical TDP of 29 W under representative high-activity conditions, as defined in Xilinx UG579. Actual power varies with design utilization, I/O activity, and transceiver count; thermal solution must accommodate peak junction temperature of 100°C per device specifications.
XCKU115-1FLVD1924C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-1FLVD1924C FAQ
1.How can I place an order for XCKU115-1FLVD1924C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVD1924C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVD1924C reliable?
The price and inventory of XCKU115-1FLVD1924C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVD1924C is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVD1924C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVD1924C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVD1924C?
XCKU115-1FLVD1924C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVD1924C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVD1924C?
For technical support, including XCKU115-1FLVD1924C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVD1924C requirements.
6.How does Aetrix verify that XCKU115-1FLVD1924C is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVD1924C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVD1924C meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVD1924C?
All XCKU115-1FLVD1924C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVD1924C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVD1924C part is unused and in its original packaging.
Return procedure for XCKU115-1FLVD1924C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU115-1FLVD1924C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
