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AMD XCKU115-1FLVD1924I
- Part No.:
- XCKU115-1FLVD1924I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVD1924I.pdf
- Description:
- IC FPGA 832 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,285
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Product details
Overview
XCKU115-1FLVD1924I from AMD is a high-performance Kintex UltraScale FPGA with 1,172K logic cells, 6,840 DSP slices, and 44.5 Mb of block RAM. It features 1924-pin Flip-Chip Land Grid Array (FC-LGA) packaging, supports PCIe Gen3 x16, and operates at -1 speed grade for industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU115-1FLVD1924I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (850 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements (VCCINT = 0.85 V ±3%), and thermal design margin for sustained 28W typical power dissipation.
Technical Context
The XCKU115-1FLVD1924I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, DDR4 controller), and high-speed serial transceivers. Its UltraScale architecture uses 20nm process technology and supports partial reconfiguration and AXI4-Stream interfaces.
It delivers deterministic timing closure with dedicated clock routing networks, supports JTAG and ICAP configuration interfaces, and includes built-in system monitoring (temperature, voltage, current) via on-die sensors aligned to Xilinx UG578 and UG909 specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,172,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 6,840 - enables parallel execution of multiply-accumulate operations for radar, AI inference, and filter pipelines |
| Block RAM | 44.5 Mb - supports large on-chip buffering for video frame stores, packet queues, and coefficient tables |
| User I/O Count | 850 - provides high-density interface connectivity to external memory, ADCs, DACs, and FMC mezzanine cards |
| Transceiver Line Rate | 16.3 Gb/s - enables direct connection to 10G/25G Ethernet PHYs and CPRI/eCPRI optical interfaces |
| VCCINT Voltage | 0.85 V ±3% - requires tightly regulated low-voltage power delivery with <±10 mV ripple for stable operation |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor base station environments without derating |
Pinout & Package
Package: 1924-pin Flip-Chip Land Grid Array (FC-LGA), 42.5 mm × 42.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multifunction I/O Bank | Configurable as GPIO, SDIO, SPI, UART, or PS peripheral interface; voltage-tolerant (1.8V/3.3V) |
| HR_IO_L[0:849] | High-Range I/O Bank | Supports LVDS, SSTL, HSTL up to 1.8V; includes programmable slew rate and termination |
| GTH_X0Y0_CH0..19 | GT Transceiver Channel | Each provides full-duplex 16.3 Gb/s serial link with built-in CDR and 8B/10B encoding |
| VCCINT, VCCAUX, VCCO | Power Supply Rails | Separate domains require independent regulation: VCCINT (0.85 V), VCCAUX (1.8 V), VCCO (1.2–3.3 V) |
| INIT_B, PROGRAM_B, DONE | Configuration Control | Active-low signals managing bitstream loading, reset assertion, and configuration completion status |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees sub-100 ns latency for host CPU offload applications |
| DDR4 Memory Controller | Supports dual 64-bit channels up to 2400 MT/s, enabling >38 GB/s memory bandwidth for streaming workloads |
| Partial Reconfiguration | Allows dynamic logic swapping without system reset-critical for multi-mode radar and protocol-agnostic comms |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× DSP throughput versus 7-series FPGAs at same power envelope |
| System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I2C/JTAG for thermal-aware scheduling |
Applications
| Radar Signal Processing | 5G Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; transceivers interface to RFICs via JESD204B. Use Value: 6,840 DSP slices enable concurrent 1024-point FFTs at 10 kHz update rate; 16.3 Gb/s transceivers sustain JESD204B subclass 1 links. | Use Scenario: Layer 1 PHY processing and massive MIMO precoding in 5G macrocell base stations. IC Role / Device Role / Timing Role: Accelerates OFDM modulation/demodulation, channel estimation, and digital pre-distortion using hardened DSP blocks. Use Value: Dual DDR4 controllers feed 2400 MT/s streams to support 100+ antenna element processing; PCIe Gen3 x16 connects to host DU/CU. |
| High-Frequency Trading | Test & Measurement Equipment |
Use Scenario: Sub-microsecond latency order matching and market data parsing in exchange co-location racks. IC Role / Device Role / Timing Role: Implements deterministic packet parsing, timestamping, and decision logic in programmable logic fabric. Use Value: 850 user I/Os route multiple 10G Ethernet and ultra-low-latency RDMA interfaces; -1 speed grade ensures <8 ns path delay. | Use Scenario: Real-time waveform generation and analysis in high-resolution oscilloscopes and protocol analyzers. IC Role / Device Role / Timing Role: Serves as acquisition engine and trigger processor, synchronizing ADC/DAC sampling with pattern generation. Use Value: 44.5 Mb block RAM buffers multi-channel 10 GS/s samples; HR I/O banks drive differential probe interfaces at 1.8V LVDS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | Faster -2 speed grade: 15% higher max clock frequency and reduced setup/hold margins | Better suited for designs requiring >300 MHz system clocks or tighter timing closure on critical paths | Select when timing margin is insufficient with -1 grade; requires identical PCB layout and power delivery |
| XCKU085-1FLVA1156I | Smaller footprint (1156-pin), lower logic count (762K cells), fewer transceivers (16 vs. 20), same -1 speed grade | Targeted at cost-sensitive 5G small cells or mid-tier test equipment where full XCKU115 capability is unused | Choose for BOM cost reduction where 850 I/Os and 20 GT lanes are not required; pin-compatible package variant unavailable |
Compared with XCKU115-2FLVD1924I, the XCKU115-1FLVD1924I trades peak performance for lower static power and relaxed thermal design; compared with XCKU085-1FLVA1156I, it delivers 54% more logic and 25% more transceivers within the same industrial temperature rating but demands larger board area and higher power delivery capability.
Availability
XCKU115-1FLVD1924I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-frequency trading systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU115-1FLVD1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale family targets high-throughput, low-latency applications such as wireless infrastructure, aerospace avionics, and real-time instrumentation where performance-per-watt and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver line rate for XCKU115-1FLVD1924I?
The XCKU115-1FLVD1924I supports a maximum transceiver line rate of 16.3 Gb/s per channel. This specification is validated across all 20 GTH transceivers in the device and enables compliance with 25G Ethernet, CPRI, and JESD204B subclass 1 standards. The -1 speed grade ensures this rate is achievable under industrial temperature conditions with standard power delivery.
Does XCKU115-1FLVD1924I include a hard PCIe Gen3 controller?
Yes, the XCKU115-1FLVD1924I integrates a hardened PCIe Gen3 x16 endpoint/root port controller. This block operates independently of the programmable logic fabric, delivering deterministic latency below 100 ns and eliminating the need for soft IP synthesis. It is fully compliant with PCIe Base Spec 3.1 and supports advanced features including ASPM L0s/L1 and ECRC.
What is the operating temperature range for XCKU115-1FLVD1924I?
The XCKU115-1FLVD1924I is rated for industrial temperature operation from -40°C to +100°C. This range is verified per JEDEC JESD22-A104 and applies to junction temperature under specified power and airflow conditions. The device includes on-die thermal sensors that report real-time die temperature via the System Monitor interface.
How many user I/O pins does XCKU115-1FLVD1924I provide?
The XCKU115-1FLVD1924I provides 850 user-configurable I/O pins distributed across 22 I/O banks. These support multiple standards including LVDS, SSTL-18, HSTL-I, and MIPI D-PHY. Each bank is independently voltage configurable (1.2 V to 3.3 V), and all I/Os support programmable slew rate and on-die termination.
Is partial reconfiguration supported on XCKU115-1FLVD1924I?
Yes, partial reconfiguration is fully supported on XCKU115-1FLVD1924I through Vivado Design Suite tools and runtime ICAP interface access. This allows dynamic swapping of logic modules without resetting the entire device-enabling multi-standard radio operation, adaptive test patterns, and field-upgradable functionality in deployed systems.
XCKU115-1FLVD1924I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-1FLVD1924I FAQ
1.How can I place an order for XCKU115-1FLVD1924I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVD1924I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVD1924I reliable?
The price and inventory of XCKU115-1FLVD1924I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVD1924I is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVD1924I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVD1924I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVD1924I?
XCKU115-1FLVD1924I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVD1924I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVD1924I?
For technical support, including XCKU115-1FLVD1924I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVD1924I requirements.
6.How does Aetrix verify that XCKU115-1FLVD1924I is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVD1924I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVD1924I meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVD1924I?
All XCKU115-1FLVD1924I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVD1924I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVD1924I part is unused and in its original packaging.
Return procedure for XCKU115-1FLVD1924I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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