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AMD XCKU115-1FLVF1924C
- Part No.:
- XCKU115-1FLVF1924C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XCKU115-1FLVF1924C.pdf
- Description:
- IC FPGA 728 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,511
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Product details
Overview
XCKU115-1FLVF1924C from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,840 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 16.3 Gb/s transceivers, deployed in high-throughput data center acceleration and radar signal processing systems.
For engineers reviewing the XCKU115-1FLVF1924C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility, thermal envelope (1924-pin flip-chip BGA), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XCKU115-1FLVF1924C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MACs, and memory controllers, plus integrated ADCs for system monitoring. Its UltraScale+ interconnect hierarchy enables deterministic timing closure across multi-million-gate designs.
It operates at -1 speed grade (1.0V core, 0.95V VCCINT), supports HP and HR I/O banks with 1.8V/1.5V/1.35V/1.2V/1.0V signaling, and includes dual-boot capability via primary/secondary configuration flash interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - Enables complex RTL implementations including multi-channel packet processors or real-time video pipelines. |
| DSP Slices | 6,840 - Supports concurrent 27×18-bit multiply-accumulate operations for radar beamforming or AI inference kernels. |
| Block RAM | 48.5 Mb - Provides on-die buffering for streaming data at 10+ Gbps without external memory latency. |
| Transceivers | 40 × 16.3 Gb/s - Delivers full-duplex serial links for 100G Ethernet KR4 or CPRI fronthaul interfaces. |
| I/O Pins | 624 user-configurable - Supports mixed-voltage interfaces across 22 HP and 8 HR I/O banks. |
| Speed Grade | -1 - Specifies maximum operating frequency under industrial temperature range (0°C to 100°C junction). |
Pinout & Package
Package: 1924-pin flip-chip BGA (FLVF1924), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank 65 | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8V/3.3V I/O standards with internal pull-up/down. |
| GTH_RXN0/GTH_RXP0 | Transceiver differential input pair | Receives 10–16.3 Gb/s serial data; requires AC-coupling capacitor and 100Ω differential termination. |
| VCCINT | Core power supply | Supplies 1.0V to programmable logic and routing; requires low-noise regulation and local decoupling. |
| PROGRAM_B | Configuration reset control | Active-low asynchronous reset; initiates reconfiguration from master SPI flash upon deassertion. |
| INIT_B | Configuration status indicator | Open-drain output signals configuration completion or error; pulled high externally via 4.7kΩ resistor. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 hard IP | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol requirements. |
| DDR4 memory controller | Supports dual-rank 72-bit interfaces up to 2400 Mbps, eliminating need for external PHY and simplifying board layout. |
| UltraScale+ interconnect | Provides predictable timing convergence for designs exceeding 10 million ASIC gates with hierarchical clocking. |
| System Monitor ADC | Measures on-die temperature and supply voltages (VCCINT, VCCAUX, VCCBRAM) with ±5°C accuracy for thermal management. |
Applications
| Data Center Acceleration | Radar Signal Processing |
|---|---|
Use Scenario: Offloading encryption, compression, and database query execution from CPU to FPGA-accelerated servers. IC Role / Device Role / Timing Role: Configurable compute engine with deterministic low-latency response (<500 ns) for packet-level decision making. Use Value: Achieves 3.2× throughput gain over software-only implementation using 40 PCIe Gen3 lanes and on-chip memory buffers. | Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-speed digital front-end processor synchronizing 128+ RF channels with sub-nanosecond clock skew. Use Value: Enables 16-bit resolution FFT computation at 2.4 GS/s using 6,840 DSP slices and distributed memory architecture. |
| 5G Wireless Fronthaul | High-Performance Test Equipment |
Use Scenario: Implementing eCPRI and OBSAI protocols in radio unit (RU) baseband units with deterministic jitter <0.3 ps RMS. IC Role / Device Role / Timing Role: Serial data concentrator and forward-error-correction engine handling 24 × 24.33 Gb/s CPRI-equivalent streams. Use Value: Meets 3GPP TR 38.813 latency budget (<100 μs) using hardened transceivers and low-latency fabric routing. | Use Scenario: Generating and analyzing multi-GHz analog waveforms in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and real-time analyzer with synchronized 16-channel 1.2 GS/s DAC/ADC control. Use Value: Reduces calibration overhead by 70% via on-chip System Monitor ADC and dynamic supply compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | Faster -2 speed grade (1.1V core), higher transceiver data rate (16.8 Gb/s), wider operating temperature (-40°C to 100°C). | Suitable for extended-temperature avionics or defense systems requiring guaranteed performance at cold start. | Select when design requires margin for timing closure under worst-case voltage/temperature corners. |
| XCKU085-1FLVA1156C | Smaller footprint (1156-pin), reduced resources (821K LC, 4,032 DSP, 32.1 Mb BRAM), same -1 speed grade and I/O voltage support. | Targeted at cost-sensitive 5G small cell baseband or edge AI inference where full XCKU115 capacity is unnecessary. | Choose for lower BOM cost and simplified thermal management without sacrificing PCIe Gen3 or DDR4 support. |
Compared with XCKU115-2FLVF1924I, the XCKU115-1FLVF1924C trades 500 MHz transceiver headroom and extended temperature range for lower power consumption (≈18W typical) and industrial-grade qualification. Against XCKU085-1FLVA1156C, it delivers 43% more logic and 69% more DSP slices within identical speed grade and I/O flexibility, justifying its use in full-scale data center accelerators.
Availability
XCKU115-1FLVF1924C is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G wireless fronthaul requiring stable component supply across multi-year production cycles.
Supply support for XCKU115-1FLVF1924C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale family targets high-performance, cost-optimized FPGA solutions for infrastructure acceleration, wireless infrastructure, and test & measurement systems.
FAQ
What is the maximum supported DDR4 data rate for the XCKU115-1FLVF1924C?
The XCKU115-1FLVF1924C supports DDR4 memory interfaces up to 2400 Mbps per pin. This is achieved using the integrated DDR4 memory controller with hardened PHY, supporting dual-rank configurations and on-die termination calibration. The XCKU115-1FLVF1924C achieves this rate across all 72-bit wide interfaces without requiring external memory PHY chips.
Does the XCKU115-1FLVF1924C include built-in transceivers, and what protocols do they support?
Yes, the XCKU115-1FLVF1924C integrates 40 GTH transceivers operating up to 16.3 Gb/s. These support PCIe Gen3 x16, 100G Ethernet KR4, CPRI, and JESD204B/C protocols. Each transceiver bank includes dedicated clocking, gearbox logic, and PRBS generators. The XCKU115-1FLVF1924C transceivers comply with IEEE 802.3bj and ANSI T11.2 specifications.
What configuration modes are supported by the XCKU115-1FLVF1924C?
The XCKU115-1FLVF1924C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Primary boot uses quad-SPI flash; fallback mode enables dual-image switching via PROGRAM_B assertion. Configuration bitstream authentication and AES-256 decryption are supported. The XCKU115-1FLVF1924C also allows partial reconfiguration during runtime without interrupting active logic.
What thermal management considerations apply to the XCKU115-1FLVF1924C package?
The XCKU115-1FLVF1924C uses a 1924-pin flip-chip BGA with integrated thermal lid. Its thermal design requires a 4-layer PCB with ≥4 thermal vias per mm² under the package and a heatsink rated for 18W typical dissipation. Junction temperature must remain ≤100°C. The XCKU115-1FLVF1924C includes on-die thermal sensors reporting via System Monitor ADC for closed-loop fan control.
Is the XCKU115-1FLVF1924C pin-compatible with other Kintex UltraScale devices?
No, the XCKU115-1FLVF1924C is not pin-compatible with other Kintex UltraScale devices due to its unique 1924-pin FLVF package and I/O bank arrangement. Migration to XCKU085 or XCKU060 requires PCB redesign. The XCKU115-1FLVF1924C shares architectural compatibility and toolchain support with the family but has no mechanical or electrical pinout overlap.
XCKU115-1FLVF1924C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 728
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XCKU115-1FLVF1924C FAQ
1.How can I place an order for XCKU115-1FLVF1924C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-1FLVF1924C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-1FLVF1924C reliable?
The price and inventory of XCKU115-1FLVF1924C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-1FLVF1924C is usually 5 days.
3.What payment methods are accepted for XCKU115-1FLVF1924C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-1FLVF1924C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-1FLVF1924C?
XCKU115-1FLVF1924C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-1FLVF1924C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-1FLVF1924C?
For technical support, including XCKU115-1FLVF1924C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-1FLVF1924C requirements.
6.How does Aetrix verify that XCKU115-1FLVF1924C is sourced from the original manufacturer or authorized distributors?
All XCKU115-1FLVF1924C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-1FLVF1924C meets industry standards.
7.What is the process for return or replacement of XCKU115-1FLVF1924C?
All XCKU115-1FLVF1924C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-1FLVF1924C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-1FLVF1924C part is unused and in its original packaging.
Return procedure for XCKU115-1FLVF1924C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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