AMD XCKU115-1FLVF1924I

Overview

XCKU115-1FLVF1924I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,840 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU115-1FLVF1924I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (520 HP I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements, thermal envelope, and configuration interface compatibility (e.g., SPIx4, BPI, JTAG).

Technical Context

The XCKU115-1FLVF1924I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and ultra-low-latency transceivers. Its UltraScale+ architecture enables time-critical deterministic timing closure for multi-gigabit serial protocols and high-throughput memory subsystems.

It uses 20nm bulk CMOS process technology, supports partial reconfiguration, and includes integrated clock management (MMCM/PLL) with sub-150 fs jitter performance. Configuration is performed via dual-boot capable flash or JTAG, with AES-256 bitstream encryption and HMAC authentication support.

Key Specifications

Pinout & Package

Package: 1924-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU115-2FLVF1924I, the XCKU115-1FLVF1924I trades timing margin for lower static power and thermal load; compared with XCKU085-1FLVB1760I, it delivers 43% more logic, 24% more DSP, and native support for 25G transceivers-enabling scalable architecture without redesign.

Availability

XCKU115-1FLVF1924I is available at Aetrix Electronics and suitable for radar signal processing, 5G infrastructure, and medical imaging systems requiring stable component supply across long production lifecycles.

Supply support for XCKU115-1FLVF1924I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and edge applications.

The Kintex UltraScale family targets high-performance, cost-optimized FPGA solutions for bandwidth-intensive and latency-critical systems such as communications infrastructure and real-time instrumentation.

FAQ

What is the maximum supported DDR4 data rate for the XCKU115-1FLVF1924I?

The XCKU115-1FLVF1924I supports DDR4 memory interfaces up to 2400 Mbps with its integrated hard memory controller. This capability is validated across all I/O banks configured for SSTL12 I/O standard and requires proper board-level termination and layout adherence to AMD UG571 guidelines. The XCKU115-1FLVF1924I achieves this rate using calibrated read/write leveling and on-die termination control.

Does the XCKU115-1FLVF1924I support partial reconfiguration?

Yes, the XCKU115-1FLVF1924I supports dynamic partial reconfiguration through its ICAP and PCAP interfaces. This allows selective logic modules to be updated during operation without resetting the entire device. The XCKU115-1FLVF1924I implements this using frame-based bitstream loading and hierarchical design partitioning, as documented in AMD UG909.

What transceiver protocols are natively supported by the XCKU115-1FLVF1924I?

The XCKU115-1FLVF1924I includes GTY transceivers that natively support 10GBASE-R, 25GBASE-R, CPRI, eCPRI, JESD204B/C, and PCIe Gen3 protocols via hardened PHY logic. These protocols are implemented without soft logic overhead, and the XCKU115-1FLVF1924I provides protocol-specific TX/RX equalization, clock data recovery, and link training engines.

What is the operating temperature range for the XCKU115-1FLVF1924I?

The XCKU115-1FLVF1924I is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the FLVF1924 package variant and is verified per JEDEC JESD22-A104 and JESD22-A108 standards. The XCKU115-1FLVF1924I maintains full functionality and timing compliance across this range when powered within specified voltage tolerances.

How many PCIe Gen3 lanes does the XCKU115-1FLVF1924I support?

The XCKU115-1FLVF1924I integrates a hard PCIe Gen3 x16 endpoint/root port block, supporting full-width configurations with split transaction handling and address translation services. It also supports lane widths down to x1, x2, x4, x8, and x16, and the XCKU115-1FLVF1924I can be configured as either endpoint or root complex depending on system architecture requirements.