AMD XCKU115-2FLVA1517E

Overview

XCKU115-2FLVA1517E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,124K logic cells, 6,840 DSP slices, and 44.6 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gb/s transceivers - deployed in 5G radio units, radar signal processors, and high-throughput data acquisition systems.

For engineers reviewing the XCKU115-2FLVA1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, thermal envelope (1517-pin FC-BGA, 35×35 mm), and speed grade (-2) for deterministic timing closure in real-time processing pipelines.

Technical Context

The XCKU115-2FLVA1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-rate transceivers supporting protocols including CPRI, JESD204B/C, and SATA. Its UltraScale+ interconnect backbone enables low-latency routing across 1,124K LUTs and 2,248K flip-flops.

It integrates 6,840 DSP48E2 slices with 27×18 multiplier support and cascading capability for high-precision filtering and FFT acceleration. The device uses selective I/O banking (1.2V/1.35V/1.8V) and supports configuration via Quad-SPI, BPI, or JTAG, with dual-boot capability for field-upgradable designs.

Key Specifications

Pinout & Package

FLVA1517 is a 1517-pin flip-chip ball grid array package with integrated thermal lid, designed for conduction-cooled industrial applications requiring sustained operation at junction temperatures up to 100°C. Ball map follows AMD's UltraScale+ FPGA pinout standard with dedicated configuration, clock, power, and high-speed transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-2FLVA1517E, the XCKU115-2FLVD1517I trades thermal lid for lower cost in less demanding thermal environments, while the XCKU085-2FLVA1517E reduces logic and DSP resources without changing package or speed - enabling scalable platform design across performance tiers.

Availability

XCKU115-2FLVA1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and high-energy physics instrumentation requiring stable component supply across long production lifecycles.

Supply support for XCKU115-2FLVA1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.

The Kintex UltraScale family targets high-throughput, low-latency signal processing systems where deterministic timing, hardened I/O protocols, and scalable logic density are critical - especially in wireless infrastructure and defense electronics.

FAQ

What is the maximum supported DDR4 data rate for XCKU115-2FLVA1517E?

The XCKU115-2FLVA1517E supports DDR4 SDRAM interfaces at up to 2400 Mbps per pin using its hardened memory controller. This capability is validated across all HP I/O banks and requires proper PCB layout adherence to AMD UG571 guidelines. The XCKU115-2FLVA1517E achieves this rate with on-die termination calibration and write-leveling support, enabling reliable 64-bit-wide memory subsystems in baseband processing applications.

Does XCKU115-2FLVA1517E include a hardened PCIe Gen3 controller?

Yes, the XCKU115-2FLVA1517E integrates a fully compliant PCIe Gen3 x16 endpoint block with support for SR-IOV, ATS, and MSI-X. It operates at 8 GT/s per lane and handles link training, error reporting, and power management autonomously. The XCKU115-2FLVA1517E does not require external PHY or protocol translation logic for standard host interface implementations.

What transceiver protocols are natively supported by XCKU115-2FLVA1517E?

The XCKU115-2FLVA1517E GTY transceivers natively support JESD204B/C, CPRI, eCPRI, 10GBASE-R, 25GBASE-R, SATA III, and PCIe Gen3. Protocol selection is configured per lane via GTYE4_CHANNEL attributes in Vivado. The XCKU115-2FLVA1517E achieves bit-error rates <10⁻¹² at 32.75 Gb/s under specified jitter conditions, verified per UG578.

Is XCKU115-2FLVA1517E qualified for extended temperature operation?

Yes, the XCKU115-2FLVA1517E is rated for extended temperature operation (–40°C to +110°C junction) and features a thermal lid in the FLVA1517 package to facilitate conduction cooling. This qualification is documented in AMD's XCKU115 product definition report and applies specifically to the -2FLVA1517E speed/package variant. The XCKU115-2FLVA1517E meets MIL-STD-883 Class B screening for vibration and thermal shock in aerospace deployments.

How many GTY transceiver quads does XCKU115-2FLVA1517E contain?

The XCKU115-2FLVA1517E contains 32 GTY transceiver quads, delivering 128 total transceiver lanes. Each quad supports independent data rates from 600 Mb/s to 32.75 Gb/s and includes dedicated TX/RX buffer, gearbox, and PRBS generator/checker. This transceiver count enables full-width 100G/400G Ethernet, multi-link JESD204C, and CPRI fronthaul in a single XCKU115-2FLVA1517E device.