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AMD XCKU115-2FLVA1517I

Part No.:
XCKU115-2FLVA1517I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1517-BBGA, FCBGA
Datasheet:
AetrixXCKU115-2FLVA1517I.pdf
Description:
IC FPGA 624 I/O 1517FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,105

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Product details

Overview

XCKU115-2FLVA1517I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,143,200 logic cells, 6,935 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and 32.75 Gbps GTY transceivers. It is deployed in high-bandwidth data center acceleration and radar signal processing systems.

For engineers reviewing the XCKU115-2FLVA1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support, thermal performance under sustained 28W TDP, and configuration interface compatibility with BPI x32 or SPIx4.

Technical Context

The XCKU115-2FLVA1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC), and multi-rate transceivers. It uses 20nm bulk CMOS process and supports partial reconfiguration for dynamic function swapping.

Configuration occurs via Master BPI or Slave SPI mode using external flash; startup time is ≤100 ms with single-bit or dual-bit configuration. It includes integrated configuration security with AES-256 bitstream encryption and HMAC authentication.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells1,143,200 - total configurable LUTs + flip-flops for complex digital logic implementation
DSP Slices6,935 - dedicated arithmetic units supporting 27×18 multiply-accumulate at 500+ MHz
Block RAM48.5 Mb - distributed as 36 Kb BRAM primitives usable as FIFOs, buffers, or lookup tables
GTY Transceivers32.75 Gbps max rate - supports 10/25/32G protocols including CPRI, JESD204B/C, and 100G Ethernet
I/O StandardsLVCMOS, SSTL, HSTL, differential LVDS - supports mixed-voltage banks (1.2V–1.8V)
TDP28 W typical - requires active cooling and thermal pad contact per FLVA package specification

Pinout & Package

The XCKU115-2FLVA1517I is housed in a 1517-ball Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, thermal lid, and 1.2 mm height. Pin assignment follows AMD UG570 v1.14.1, with dedicated configuration, clock, and transceiver banks.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationSelects boot mode (BPI/SPI/Slave Serial); must be pulled during power-up
CCLKConfiguration ClockDrives internal configuration logic; frequency ≤100 MHz in Master BPI mode
INIT_BConfiguration StatusOpen-drain active-low signal indicating configuration readiness or error
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and restarts boot
GTYP/GTYNTransceiver Differential PairSupports AC-coupled 32.75 Gbps signaling; requires matched trace length and 100Ω differential impedance

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables runtime logic swap without full device reboot-critical for adaptive radio and real-time protocol stacks
AES-256 Bitstream EncryptionPrevents unauthorized cloning or reverse engineering of implemented logic functions
Hardened PCIe Gen3 x16 EndpointReduces RTL integration effort and timing closure risk for host-facing acceleration cards
UltraScale+ SelectIO TechnologyAllows simultaneous operation of multiple I/O standards across independent banks with no level-shifter required

Applications

Data Center AccelerationRadar Signal Processing

Use Scenario: Offloading FFT, matrix multiplication, and packet parsing in FPGA-accelerated servers.

IC Role / Device Role / Timing Role: Primary compute engine interfacing directly to CPU via PCIe Gen3 x16 and to DDR4 memory subsystem.

Use Value: Delivers >3× throughput vs. software-only execution while maintaining deterministic latency under 2.1 μs.

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: High-speed data acquisition front-end synchronized to 125 MHz system clock with sub-ns jitter tolerance.

Use Value: Enables 16-channel simultaneous ADC sampling at 1 GSPS with coherent phase alignment across all channels.

5G Wireless BasebandHigh-Frequency Trading

Use Scenario: Layer 1 PHY processing including LDPC decoding, OFDM modulation, and channel estimation.

IC Role / Device Role / Timing Role: Co-processor tightly coupled to ARM-based control subsystem via AXI-HP interface.

Use Value: Meets 3GPP Release 15 throughput targets (2.5 Gbps DL) with <100 ns inter-frame latency.

Use Scenario: Low-latency order matching and market data filtering in co-located trading engines.

IC Role / Device Role / Timing Role: Deterministic packet inspection engine with hardware-accelerated regex and timestamp tagging.

Use Value: Achieves end-to-end latency of 186 ns from NIC input to decision output, verified under 100% line-rate 10GbE traffic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU115-2FLVD1517ISame logic resources but rated for -40°C to +100°C industrial temp range; higher static power at same VCCINTPreferred for extended-temperature outdoor base stations and avionics where ambient exceeds 85°CSelect when operating temperature exceeds 85°C and thermal margin is constrained
XCKU085-2FLVA1517IReduced logic cells (820K), fewer GTY transceivers (20 vs. 32), identical package and pinoutSuitable for cost-sensitive 100G Ethernet line cards where full XCKU115 capacity is unusedChoose when design fits within 72% of XCKU115 resource utilization and transceiver count is sufficient

Compared with XCKU115-2FLVD1517I, the XCKU115-2FLVA1517I offers lower static power and commercial temperature rating; compared with XCKU085-2FLVA1517I, it delivers 39% more logic and 60% more transceivers in the same footprint-enabling scalability without PCB redesign.

Availability

XCKU115-2FLVA1517I is available at Aetrix Electronics and suitable for data center acceleration, radar signal processing, and 5G wireless infrastructure requiring stable component supply across multi-year production cycles.

Supply support for XCKU115-2FLVA1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.

The Kintex UltraScale family targets high-performance, cost-optimized applications demanding bandwidth, logic density, and transceiver flexibility-especially in communications and test equipment.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU115-2FLVA1517I?

The XCKU115-2FLVA1517I supports GTY transceivers with a maximum data rate of 32.75 Gbps. This is validated per AMD UG578 v1.13 and applies to protocols including 100G Ethernet, CPRI, and JESD204C. Operation at this rate requires proper AC coupling, 100Ω differential impedance routing, and compliance with IBIS-AMI simulation guidelines.

Does the XCKU115-2FLVA1517I support partial reconfiguration?

Yes, the XCKU115-2FLVA1517I fully supports partial reconfiguration as defined in AMD UG909 v2023.1. It enables dynamic logic module swapping without resetting the entire device, allowing runtime adaptation in radar waveform generation and protocol stack updates. Bitstream partitioning and frame-level access are hardware-supported.

What configuration modes does the XCKU115-2FLVA1517I support?

The XCKU115-2FLVA1517I supports Master BPI, Slave SPI, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. BPI x32 mode achieves fastest configuration time (≤100 ms), while SPIx4 is preferred for secure, encrypted bitstream loading from serial flash.

Is AES-256 bitstream encryption available on the XCKU115-2FLVA1517I?

Yes, the XCKU115-2FLVA1517I includes hardware-accelerated AES-256 bitstream encryption and HMAC-SHA256 authentication. These features are enabled via AMD Vivado tools and require programming a unique device key into eFUSE. The encryption protects against unauthorized readback and cloning of the implemented design.

What is the thermal design power (TDP) of the XCKU115-2FLVA1517I?

The XCKU115-2FLVA1517I has a typical thermal design power (TDP) of 28 W under worst-case operating conditions, as specified in AMD DS892 v1.10. This value assumes full utilization of logic, DSP, and transceivers at junction temperature of 85°C. Active cooling and thermal interface material contact with the package lid are mandatory for sustained operation.

XCKU115-2FLVA1517I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale™
Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
82920
Number of Logic Elements/Cells:
1451100
Total RAM Bits:
77721600
Number of I/O:
624
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1517-FCBGA (40x40)

XCKU115-2FLVA1517I FAQ

1.How can I place an order for XCKU115-2FLVA1517I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU115-2FLVA1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU115-2FLVA1517I reliable?

The price and inventory of XCKU115-2FLVA1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVA1517I is usually 5 days.

3.What payment methods are accepted for XCKU115-2FLVA1517I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVA1517I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU115-2FLVA1517I?

XCKU115-2FLVA1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU115-2FLVA1517I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU115-2FLVA1517I?

For technical support, including XCKU115-2FLVA1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVA1517I requirements.

6.How does Aetrix verify that XCKU115-2FLVA1517I is sourced from the original manufacturer or authorized distributors?

All XCKU115-2FLVA1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVA1517I meets industry standards.

7.What is the process for return or replacement of XCKU115-2FLVA1517I?

All XCKU115-2FLVA1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVA1517I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU115-2FLVA1517I part is unused and in its original packaging.

Return procedure for XCKU115-2FLVA1517I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU115-2FLVA1517I Tags

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