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AMD XCKU115-2FLVA2104I
- Part No.:
- XCKU115-2FLVA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,764
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Product details
Overview
XCKU115-2FLVA2104I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and includes hardened 10/25/100G Ethernet MACs. It is deployed in high-bandwidth data center acceleration and 5G radio unit processing.
For engineers reviewing the XCKU115-2FLVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), transceiver line rates (up to 32.75 Gb/s), thermal design power (170 W typical), and package-specific I/O count (832 user I/Os in FLVA2104).
Technical Context
The XCKU115-2FLVA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including GTY transceivers and memory controllers, and scalable clock management via mixed-mode clock managers (MMCMs) and clocking wizards. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic system updates.
It targets deterministic low-latency signal processing pipelines requiring sub-10 ns timing closure on critical paths, with static timing analysis validated across -2 speed grade at junction temperatures from –40°C to 100°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - total configurable LUT/FF pairs for complex digital logic implementation |
| DSP Slices | 6,930 - dedicated arithmetic units supporting 27×18 multiply-accumulate at 500+ MHz |
| Block RAM | 48.5 Mb - distributed and block RAM resources for on-chip buffering and data storage |
| Transceiver Max Rate | 32.75 Gb/s - supports 100G Ethernet, CPRI, and high-speed serial backplane links |
| User I/O Count | 832 - LVDS- and SSTL-capable pins in FLVA2104 flip-chip BGA package |
| Memory Interface | DDR4-2400 - native controller supporting up to 8 banks with 64-bit data width |
| Speed Grade | -2 - guaranteed timing performance at worst-case voltage and temperature corners |
Pinout & Package
Package: Flip-chip BGA, 2104-pin, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | 1.0V ±3% supply for FPGA logic fabric and CLB resources |
| VCCAUX | Auxiliary Supply | 1.8V supply for configuration logic, SelectIO, and clock management |
| VCCO | I/O Bank Supply | Configurable per-bank (1.2 V to 1.8 V) for interface voltage level matching |
| MGTAVCC | Transceiver Analog Supply | 1.0V analog supply for GTY transceiver PLLs and serializers |
| CLK_IN | Dedicated Clock Input | Single-ended or differential input feeding MMCM/PLL clock networks |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated MAC + PCS layers reduce latency and resource usage vs. soft IP implementations |
| PCIe Gen3 x16 Root Port | Full-duplex 16-lane endpoint with DMA engine and AXI4 interface for host CPU offload |
| Partial Reconfiguration Support | Enables dynamic function swapping without full device reset or system interruption |
| GTY Transceivers | 32 lanes operating up to 32.75 Gb/s with built-in PRBS generation and error detection |
| AXI4-Stream Interconnect | Native streaming interface enabling pipelined data flow between IP blocks without handshake overhead |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in FR2 mmWave base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, CORDIC, and matrix inversion kernels with deterministic sub-10 ns timing closure. Use Value: Enables 64–256 antenna element processing within 100 μs frame budget using hardened DSP slices and block RAM. | Use Scenario: Offloading TLS encryption, packet classification, and RDMA verbs in cloud server NICs. IC Role / Device Role / Timing Role: Configurable accelerator interfacing directly to host CPU via PCIe Gen3 x16 with AXI4-Stream DMA engine. Use Value: Delivers 100 Gbps line-rate crypto throughput with <500 ns added latency versus software-only stacks. |
| High-Frequency Trading Engine | Test & Measurement Signal Generator |
Use Scenario: Ultra-low-latency order routing with nanosecond-level timestamping and protocol parsing. IC Role / Device Role / Timing Role: Time-critical state machine and SerDes interface handling FIX/OUCH parsing and market data feed ingestion. Use Value: Achieves end-to-end latency under 750 ns using deterministic routing, hard IP transceivers, and on-die clock synchronization. | Use Scenario: Multi-channel arbitrary waveform generation with synchronized 14-bit DAC outputs at 1 GS/s. IC Role / Device Role / Timing Role: Real-time pattern generator controlling DAC timing, interpolation filters, and jitter-clean clock distribution. Use Value: Supports <1 ps RMS jitter on 100 MHz reference clocks via MMCM-based clean-up and low-noise supply domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD2104I | Different thermal lid material (copper vs. nickel-plated copper); identical logic, I/O, and transceiver specs | Same use cases but qualified for extended industrial temperature range (–40°C to +110°C) | Select when operating ambient exceeds 100°C junction limit or requires higher thermal conductivity |
| XCKU15P-2FLVD2104I | Higher logic density (1,375,000 cells), additional 12 GTY transceivers, same package footprint | Required for designs needing >1,174K LUTs or >32 high-speed serial lanes | Choose when scaling compute capacity beyond XCKU115-2FLVA2104I while retaining PCB layout compatibility |
Compared with XCKU115-2FLVA2104I, the XCKU115-2FLVD2104I offers enhanced thermal performance without logic or I/O change, while the XCKU15P-2FLVD2104I delivers higher density and transceiver count in pin-compatible packaging-enabling upgrade paths without board redesign.
Availability
XCKU115-2FLVA2104I is available at Aetrix Electronics and suitable for 5G infrastructure, data center acceleration, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU115-2FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through its FPGA, adaptive SoC, and GPU product lines.
The Kintex UltraScale family, including XCKU115-2FLVA2104I, was designed for high-throughput, low-latency acceleration in communications infrastructure and compute-intensive edge systems.
FAQ
What is the maximum supported DDR4 data rate for XCKU115-2FLVA2104I?
The XCKU115-2FLVA2104I supports DDR4 memory interfaces up to 2400 Mbps per pin, implemented via its hardened memory controller with 64-bit data width and eight independent banks. This capability enables high-bandwidth buffering for real-time signal processing and packet buffering in 5G and networking applications. The controller complies with JEDEC DDR4-2400 specifications and supports write leveling, read leveling, and training sequences.
Does XCKU115-2FLVA2104I support PCIe Gen4?
No, XCKU115-2FLVA2104I supports PCIe Gen3 x16 as a root port or endpoint, with full-duplex operation and AXI4 interface. It does not include Gen4-capable transceivers; its GTY transceivers are rated up to 32.75 Gb/s but are configured for Gen3 compliance (8 GT/s). For PCIe Gen4, users must select Versal ACAP or newer Kria KV260 derivatives-not the Kintex UltraScale family.
What is the thermal design power (TDP) of XCKU115-2FLVA2104I?
The XCKU115-2FLVA2104I has a typical thermal design power of 170 W under full utilization at junction temperature of 100°C and VCCINT = 1.0 V. Power consumption varies with logic utilization, I/O activity, and transceiver count in use. AMD's XPE (Xilinx Power Estimator) tool is required to generate accurate estimates based on specific design netlists and constraints.
Is XCKU115-2FLVA2104I pin-compatible with other Kintex UltraScale devices?
XCKU115-2FLVA2104I shares the FLVA2104 package footprint with XCKU115-2FLVD2104I and XCKU15P-2FLVD2104I, enabling mechanical compatibility. However, electrical pin mapping differs across speed grades and variants-especially for VCCO bank assignments and transceiver lane routing-so direct substitution requires verification of I/O standards, power sequencing, and configuration pin behavior per UG570.
What configuration modes does XCKU115-2FLVA2104I support?
XCKU115-2FLVA2104I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Bitstream loading can be initiated from external flash (e.g., Micron MT25QL), microcontroller, or host processor via dedicated configuration pins (CCLK, DIN, INIT_B, PROGRAM_B). Configuration security features include AES-256 bitstream encryption and HMAC authentication, enabled via eFUSE programming.
XCKU115-2FLVA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU115-2FLVA2104I FAQ
1.How can I place an order for XCKU115-2FLVA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVA2104I reliable?
The price and inventory of XCKU115-2FLVA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVA2104I is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVA2104I?
XCKU115-2FLVA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVA2104I?
For technical support, including XCKU115-2FLVA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVA2104I requirements.
6.How does Aetrix verify that XCKU115-2FLVA2104I is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVA2104I meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVA2104I?
All XCKU115-2FLVA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVA2104I part is unused and in its original packaging.
Return procedure for XCKU115-2FLVA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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