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AMD XCKU115-2FLVB1760E
- Part No.:
- XCKU115-2FLVB1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVB1760E.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,832
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Product details
Overview
XCKU115-2FLVB1760E from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gb/s transceivers, deployed in high-bandwidth data center acceleration and radar signal processing systems.
For engineers reviewing the XCKU115-2FLVB1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope (2.5 W/mm²), and configuration interface compatibility with BPI or SPIx4.
Technical Context
The XCKU115-2FLVB1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet MACs, and memory controllers. It uses 20nm bulk CMOS process and supports partial reconfiguration via ICAP.
Configuration occurs through master SPI or BPI mode using external flash; startup time is 45 ms typical. The device includes integrated analog monitoring for on-die temperature and supply voltage, with dedicated JTAG and SelectMAP interfaces for debug and programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - total configurable LUT-based resources for custom digital logic implementation |
| DSP Slices | 6,930 - fixed-point arithmetic units supporting 27×18 multiply-accumulate at 500 MHz |
| Block RAM | 48.5 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO |
| Transceiver Max Rate | 32.75 Gb/s - supports PAM4 and NRZ signaling for 100G/400G Ethernet and CPRI |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, TMDS - supports mixed-voltage banks (1.2 V to 1.8 V) |
| Configuration Interface | Master SPI x4 / BPI x16 - determines boot source type and maximum configuration bandwidth |
| Thermal Design Power | 28.5 W typical - defines heatsink sizing and airflow requirements in enclosed systems |
Pinout & Package
The XCKU115-2FLVB1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via central thermal slug.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/BPI/JTAG) during power-on reset |
| CCLK | Configuration Clock | Drives serial configuration clock input for master SPI mode |
| DIN | Configuration Data In | Serial data input for configuration bitstream loading |
| INIT_B | Initialization Status | Open-drain output indicating successful bitstream load or CRC error |
| PROGRAM_B | Reconfiguration Trigger | Active-low input to initiate full reconfiguration sequence |
| HR Bank 0–15 | High-Range I/O | Supports 1.8 V/1.5 V/1.35 V/1.25 V standards with adjustable drive strength |
| HP Bank 0–31 | High-Performance I/O | Supports 1.2 V/1.0 V standards and sub-1.0 V interfaces including MIPI D-PHY |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface connectivity |
| UltraScale+ Memory Controller | Enables direct DDR4/LPDDR4 interfacing with 2400 Mbps data rate and built-in ECC |
| Partial Reconfiguration Support | Allows dynamic logic swapping without system reset, enabling runtime function updates |
| Integrated Analog Monitoring | Provides real-time die temperature and VCCINT/VCCAUX measurements via on-chip ADC |
| Multi-Standard Transceivers | Configurable per lane for SRIO, CPRI, Ethernet, or custom protocols up to 32.75 Gb/s |
Applications
| 5G Massive MIMO Baseband Processing | Data Center SmartNIC Offload |
|---|---|
Use Scenario: Real-time beamforming matrix computation and channel estimation across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary compute accelerator handling parallel FFT, FIR, and MIMO detection kernels. Use Value: 6,930 DSP slices enable >200 GOPS sustained throughput with deterministic latency under 5 µs. | Use Scenario: Hardware-accelerated packet classification, TLS termination, and RDMA offload in cloud servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to CPU via PCIe Gen3 x16, managing network stack bypass. Use Value: Hardened PCIe Gen3 x16 IP ensures sub-100 ns transaction latency and zero driver-level intervention. |
| Radar Signal Processing (AESA) | High-Fidelity Test Equipment |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture imaging in airborne radar systems. IC Role / Device Role / Timing Role: Real-time front-end signal processor synchronizing ADC/DAC interfaces and managing waveform generation. Use Value: 32.75 Gb/s transceivers interface directly to JESD204B-compliant 12-bit 4-GSPS ADCs with deterministic jitter < 300 fs. | Use Scenario: Modular instrumentation platform supporting multi-channel arbitrary waveform generation and spectrum analysis. IC Role / Device Role / Timing Role: Core timing and pattern generator controlling DAC/ADC sampling clocks and trigger distribution. Use Value: UltraScale+ clocking architecture delivers < 150 fs RMS jitter on 1 GHz output clocks for ENOB > 14 bits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-1FLVB1760I | Slower speed grade (-1 vs -2), lower max transceiver rate (30.54 Gb/s), higher static power | Suitable for cost-sensitive radar front-ends where full 32.75 Gb/s is unused | Select when thermal budget is constrained and 200 MHz logic frequency suffices |
| XCKU085-2FLVA1156E | Smaller logic capacity (832K LC), fewer transceivers (40 vs 60), same speed grade and I/O voltage support | Fits compact test equipment chassis requiring lower power and smaller footprint | Choose when design fits within 832K LC and does not require >40 transceiver lanes |
Compared with XCKU115-2FLVB1760E, the -1 speed grade reduces timing margin for 500 MHz DSP pipelines, while the XCKU085 variant trades logic density and transceiver count for reduced board area and cooling complexity-both remain compatible with UltraScale+ toolflow and pin-compatible within their respective packages.
Availability
XCKU115-2FLVB1760E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-performance computing accelerators requiring stable component supply across multi-year production cycles.
Supply support for XCKU115-2FLVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale family targets high-throughput, low-latency applications demanding hardened interfaces, scalable logic, and advanced memory subsystems-optimized for signal processing, networking, and compute acceleration.
FAQ
What is the maximum supported DDR4 data rate for the XCKU115-2FLVB1760E?
The XCKU115-2FLVB1760E supports DDR4 memory interfaces up to 2400 Mbps per pin using its hardened memory controller. This capability is verified in UG576 and applies to both DIMM and discrete DDR4 components with appropriate board layout and termination. The XCKU115-2FLVB1760E achieves this rate with built-in write leveling, read leveling, and on-die termination calibration.
Does the XCKU115-2FLVB1760E support partial reconfiguration?
Yes, the XCKU115-2FLVB1760E supports partial reconfiguration via ICAP and PCIe-based update mechanisms. This feature enables dynamic logic module swapping without full device reset. Implementation requires Vivado Design Suite 2020.2 or later and adherence to frame-based partitioning rules defined in UG909. The XCKU115-2FLVB1760E maintains configuration security and timing integrity during partial bitstream loads.
What configuration modes are supported by the XCKU115-2FLVB1760E?
The XCKU115-2FLVB1760E supports master SPI (x1/x2/x4), BPI (x8/x16), JTAG, and SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Master SPI x4 provides fastest serial configuration (up to 100 MB/s), while BPI x16 enables parallel flash boot for large bitstreams. The XCKU115-2FLVB1760E also supports fallback configuration and dual-boot via external flash partitioning.
What is the thermal design power (TDP) of the XCKU115-2FLVB1760E under typical operation?
The XCKU115-2FLVB1760E has a typical thermal design power of 28.5 W, measured under balanced logic, memory, and transceiver utilization per Xilinx UG578. Peak power can reach 42.3 W in worst-case vector scenarios. Thermal solution design must accommodate 2.5 W/mm² heat flux density over the 35 mm × 35 mm thermal slug area. The XCKU115-2FLVB1760E includes on-die temperature sensors for closed-loop thermal management.
Which transceiver protocols are natively supported by the XCKU115-2FLVB1760E?
The XCKU115-2FLVB1760E natively supports PCIe Gen3, 10/25/100G Ethernet (with RS-FEC), CPRI, and SRIO v2.1 via hardened GTY transceivers. Protocol selection is configured per lane in Vivado using GT wizard IP cores. JESD204B/C compliance is achieved up to 15.5 Gbps per lane. The XCKU115-2FLVB1760E does not include native USB or SATA PHYs-those require soft IP or external PHYs.
XCKU115-2FLVB1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU115-2FLVB1760E FAQ
1.How can I place an order for XCKU115-2FLVB1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVB1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVB1760E reliable?
The price and inventory of XCKU115-2FLVB1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVB1760E is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVB1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVB1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVB1760E?
XCKU115-2FLVB1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVB1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVB1760E?
For technical support, including XCKU115-2FLVB1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVB1760E requirements.
6.How does Aetrix verify that XCKU115-2FLVB1760E is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVB1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVB1760E meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVB1760E?
All XCKU115-2FLVB1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVB1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVB1760E part is unused and in its original packaging.
Return procedure for XCKU115-2FLVB1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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