AMD XCKU115-2FLVB1760I

Overview

XCKU115-2FLVB1760I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,124K logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 32.75 Gb/s transceivers, deployed in high-throughput data center acceleration and radar signal processing systems.

For engineers reviewing the XCKU115-2FLVB1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O voltage support (1.2V/1.35V/1.8V), thermal design power (29W typical), and configuration interface (SPIx4/JTAG).

Technical Context

The XCKU115-2FLVB1760I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC), and memory controllers. It uses 20nm bulk CMOS process and supports partial reconfiguration for dynamic function swapping.

Configuration occurs via master SPI or JTAG, with bitstream authentication and AES-256 encryption enabled. The device includes dedicated clock management tiles (CMT) with PLLs and MMCMs supporting jitter < 150 fs RMS over 12 kHz–20 MHz.

Key Specifications

Pinout & Package

Package: 1760-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-1FLVB1760I and XCKU15P-2FLVD1924E, the XCKU115-2FLVB1760I delivers the highest transceiver performance per mm² in the Kintex UltraScale family, making it optimal for JESD204B/C-heavy systems where serial bandwidth dominates resource allocation.

Availability

XCKU115-2FLVB1760I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and medical imaging hardware acceleration requiring stable component supply across multi-year production cycles.

Supply support for XCKU115-2FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through its acquired Xilinx business.

The Kintex UltraScale family targets high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources-especially in communications infrastructure and real-time signal processing.

FAQ

What is the maximum supported DDR4 data rate for the XCKU115-2FLVB1760I?

The XCKU115-2FLVB1760I supports DDR4-2400 (1200 MHz clock, 2400 Mbps data rate) with its integrated memory controller. This is validated across all HP I/O banks and includes on-die termination calibration and write-leveling support. The XCKU115-2FLVB1760I achieves this rate using 16-bit or 32-bit interfaces with configurable burst lengths and refresh management.

Does the XCKU115-2FLVB1760I include hardened PCIe Gen3 IP?

Yes, the XCKU115-2FLVB1760I integrates a hardened PCIe Gen3 x16 endpoint block compliant with PCI Express Base Specification 3.1. It supports both root port and endpoint configurations, includes AXI4-Stream and AXI4-Lite interfaces, and delivers sub-500 ns transaction latency. The XCKU115-2FLVB1760I does not require soft-core PCIe implementation, reducing design risk and timing closure effort.

What configuration modes are supported by the XCKU115-2FLVB1760I?

The XCKU115-2FLVB1760I supports master SPI (x1/x2/x4), JTAG, and BPI parallel NOR flash configuration. Mode selection is controlled by CONFIG_IO pins at power-up. The XCKU115-2FLVB1760I also supports fallback configuration and dual-boot from two SPI flash devices, enabling field-upgradable bitstreams without hardware modification.

Is partial reconfiguration supported on the XCKU115-2FLVB1760I?

Yes, the XCKU115-2FLVB1760I fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic replacement of logical modules while the rest of the design remains operational. The XCKU115-2FLVB1760I implements frame-based reconfiguration with CRC-protected bitstream loading and secure key management for encrypted partial bitstreams.

What thermal management guidance applies to the XCKU115-2FLVB1760I?

The XCKU115-2FLVB1760I has a typical thermal design power (TDP) of 29 W and a maximum junction temperature of 100°C. AMD recommends a 4-layer PCB with ≥2 oz copper planes, thermal vias under the package, and a heatsink rated for ≥1.2°C/W. The XCKU115-2FLVB1760I includes an integrated thermal sensor accessible via the System Monitor IP for closed-loop fan control.