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AMD XCKU115-2FLVB2104I
- Part No.:
- XCKU115-2FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,075
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Product details
Overview
XCKU115-2FLVB2104I from AMD is a high-performance Kintex UltraScale FPGA featuring 1,174,000 logic cells, 6,930 DSP slices, and 48.5 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and includes hardened 12.5 Gb/s transceivers. It is deployed in high-bandwidth data center acceleration and radar signal processing systems.
For engineers reviewing the XCKU115-2FLVB2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility, thermal envelope (100°C junction), and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCKU115-2FLVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and multi-rate transceivers supporting protocols from 600 Mb/s to 12.5 Gb/s. It uses 20nm bulk CMOS process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG; startup time is ≤50 ms with fallback support. The device integrates System Monitor for on-chip temperature and supply voltage monitoring with ±5% accuracy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,174,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 6,930 - enables high-throughput fixed/floating-point computation for FFT, filtering, ML inference |
| Block RAM | 48.5 Mb - supports large on-die buffering, FIFOs, and lookup tables without external memory |
| Transceiver Speed | 12.5 Gb/s - enables direct attachment to 10G/25G Ethernet PHYs and CPRI/eCPRI interfaces |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, LVCMOS - allows interfacing with DDR4, image sensors, ADCs, and FPGAs |
| Junction Temp | 100°C - defines maximum operating temperature under full static/dynamic power load |
| Configuration Security | AES-256 + HMAC - prevents unauthorized bitstream cloning and ensures integrity verification |
Pinout & Package
This device is packaged in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Package designation FLVB2104 indicates fine-pitch, thermally enhanced, flip-chip construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8V/3.3V operation |
| HR Bank 0–3 | High-Range I/O | Supports DDR4, LPDDR4, and MIPI D-PHY at up to 1.5 V; 550+ pins total |
| HP Bank 4–7 | High-Performance I/O | Supports 1.2V/1.35V/1.8V standards; optimized for SerDes and memory interfaces |
| GTH Transceivers | Multi-gigabit Serial I/O | 24 lanes, each configurable from 600 Mb/s to 12.5 Gb/s; includes CDR and gearbox |
| CONFIG_IO | Configuration Interface | Dedicated pins for Quad-SPI, BPI, or JTAG; includes INIT_B, PROGRAM_B, DONE signals |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic swapping without system reset-critical for adaptive radio and real-time protocol stacks |
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and timing closure risk for host CPU/FPGA interconnect |
| UltraScale+ Memory Controller | Supports DDR4-2400, LPDDR4-4266, and RLDRAM3 with ECC and calibration logic |
| System Monitor | On-die ADC with ±5% accuracy monitors die temperature and 12 supply rails in real time |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized duplication of configured logic functionality |
Applications
| 5G Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time beamforming and MIMO-OFDM modulation in massive MIMO active antenna units. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, channel estimation, and precoding; transceivers interface directly with RFICs. Use Value: 12.5 Gb/s transceivers and 6,930 DSP slices enable sub-100 ns latency loop closure for adaptive beam control. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR/ground-based phased array radar. IC Role / Device Role / Timing Role: Configurable logic implements matched filtering, pulse compression, and digital down-conversion pipelines. Use Value: 48.5 Mb block RAM supports multi-channel delay-line storage; hardened memory controller drives DDR4 frame buffers. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: Hardware-accelerated database query engines and AI inference offload in cloud servers. IC Role / Device Role / Timing Role: PCIe Gen3 x16 endpoint connects to host CPU; logic fabric runs custom kernels for pattern matching and vector math. Use Value: 1,174,000 logic cells allow concurrent execution of multiple accelerator engines with deterministic latency. | Use Scenario: High-speed protocol analyzers capturing and decoding PCIe, SATA, and USB 3.x traffic. IC Role / Device Role / Timing Role: FPGA captures multi-lane serial streams using GTH transceivers and performs real-time protocol parsing. Use Value: 24 transceiver lanes and flexible I/O banks enable simultaneous capture of up to four independent 8 Gb/s links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD2104I | Same logic resources and transceiver count; differs in I/O bank voltage support (1.2V/1.35V only vs. 1.2V/1.35V/1.8V) | Limited compatibility with legacy 1.8V peripherals and DDR3 interfaces | Select XCKU115-2FLVD2104I only when 1.8V I/O is not required and cost optimization is prioritized |
| XCKU085-2FLVA2104I | Fewer logic cells (832,000), reduced DSP slices (5,400), same package footprint and transceiver count | Suitable for mid-tier compute acceleration where full XCKU115 capacity is unused | Choose XCKU085-2FLVA2104I when design fits within lower resource ceiling and thermal budget is constrained |
Compared with XCKU115-2FLVD2104I and XCKU085-2FLVA2104I, the XCKU115-2FLVB2104I uniquely combines full I/O voltage flexibility, highest logic density, and identical 2104-ball packaging-enabling drop-in upgrades and mixed-voltage system integration without PCB redesign.
Availability
XCKU115-2FLVB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and data center accelerator applications requiring stable component supply across extended product lifecycles.
Supply support for XCKU115-2FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale family delivers high performance per watt for compute-intensive, I/O-rich applications including wireless infrastructure, test equipment, and vision systems.
FAQ
What is the maximum supported DDR4 data rate for the XCKU115-2FLVB2104I?
The XCKU115-2FLVB2104I supports DDR4 memory interfaces up to 2400 Mbps (1200 MHz clock). This capability is implemented through its hardened UltraScale+ memory controller, which includes built-in calibration, read/write leveling, and ECC support. The XCKU115-2FLVB2104I achieves this rate across HR I/O banks configured for 1.2 V operation, and it is validated per JEDEC DDR4-2400 specifications.
Does the XCKU115-2FLVB2104I support partial reconfiguration?
Yes, the XCKU115-2FLVB2104I fully supports partial reconfiguration, allowing dynamic replacement of logic modules without resetting the entire device. This feature relies on dedicated configuration logic and frame-based bitstream loading via ICAP. The XCKU115-2FLVB2104I's architecture enables runtime adaptation for protocols, filters, or accelerators while maintaining active I/O and memory operations.
What transceiver protocols are natively supported by the XCKU115-2FLVB2104I?
The XCKU115-2FLVB2104I's 24 GTH transceivers support native physical-layer protocols including PCIe Gen3, 10GBASE-R, CPRI, and SATA 3.0. Protocol support is enabled via hardened PCS layers and configurable gearbox logic. The XCKU115-2FLVB2104I does not include native support for PCIe Gen4 or 25G Ethernet without additional soft IP or external retimers.
Is AES-256 bitstream encryption available on the XCKU115-2FLVB2104I?
Yes, the XCKU115-2FLVB2104I includes hardware-accelerated AES-256 bitstream encryption with HMAC authentication. This security feature is integrated into the configuration engine and operates during bitstream loading from external flash. The XCKU115-2FLVB2104I requires a user-provided 256-bit key stored in eFUSE or supplied externally via JTAG.
What is the thermal design power (TDP) range for the XCKU115-2FLVB2104I?
The XCKU115-2FLVB2104I has a typical thermal design power ranging from 22 W (minimal configuration) to 48 W (fully utilized logic, transceivers, and memory interfaces). Power estimates depend on utilization profile, I/O activity, and transceiver count in use. The XCKU115-2FLVB2104I specifies a maximum junction temperature of 100°C and requires a heatsink with ≥0.25°C/W thermal resistance for full-load operation.
XCKU115-2FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU115-2FLVB2104I FAQ
1.How can I place an order for XCKU115-2FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVB2104I reliable?
The price and inventory of XCKU115-2FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVB2104I?
XCKU115-2FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVB2104I?
For technical support, including XCKU115-2FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVB2104I requirements.
6.How does Aetrix verify that XCKU115-2FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVB2104I?
All XCKU115-2FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVB2104I part is unused and in its original packaging.
Return procedure for XCKU115-2FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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