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AMD XCKU115-2FLVD1517E
- Part No.:
- XCKU115-2FLVD1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU115-2FLVD1517E.pdf
- Description:
- IC FPGA 338 I/O 1517FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,687
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Product details
Overview
XCKU115-2FLVD1517E from AMD is a high-performance Kintex UltraScale FPGA with 1,124,000 logic cells, 6,935 DSP slices, and 84.2 Gb/s transceiver bandwidth (24× 32.75 Gb/s GTY). It features 72.5 Mb of block RAM, supports PCIe Gen3 x16, and is used in high-speed data acquisition and reconfigurable computing systems.
For engineers reviewing the XCKU115-2FLVD1517E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), GTY transceiver configuration, thermal design power (27.5 W typical), and package-compatible migration paths within the Kintex UltraScale family.
Technical Context
The XCKU115-2FLVD1517E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DDR4 controller), and multi-rate GTY transceivers supporting PAM4 and NRZ modulation. It targets deterministic low-latency signal processing pipelines.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device operates across industrial temperature range (–40°C to +100°C junction) and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 - total configurable LUTs+FFs for complex digital logic implementation |
| DSP Slices | 6,935 - fixed-point and floating-point arithmetic units with 27×18 multiplier capability |
| Block RAM | 72.5 Mb - distributed memory resources usable as FIFOs, buffers, or lookup tables |
| GTY Transceivers | 24 × 32.75 Gb/s - supports 10/25/100G Ethernet, CPRI, and JESD204B/C protocols |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing with DDR4, sensors, and high-speed ADCs/DACs |
| TDP | 27.5 W typical - defines thermal solution requirements for sustained operation at -2 speed grade |
Pinout & Package
The XCKU115-2FLVD1517E is housed in a 1517-ball Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in air-cooled or heatsink-mounted applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as GPIO, SDIO, UART, SPI, or I²C interfaces for peripheral control |
| GTYP/GTYN | GTY Transceiver Differential Pair | High-speed serial lanes supporting 32.75 Gb/s NRZ or 58 Gb/s PAM4 per lane |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for differential I/O standards (e.g., LVDS, TMDS) |
| VCCINT | Core Supply | 1.0 V regulated supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary Supply | 1.8 V supply powering configuration logic, transceiver PLLs, and SelectIO banks |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Zero-software-overhead host interface with integrated DMA engine and AXI4 streaming interface |
| DDR4 Memory Controller | Supports up to 256-bit wide, 2400 MT/s DDR4 with ECC and address/command parity checking |
| Partial Reconfiguration | Enables runtime logic module swapping without interrupting active data paths or external interfaces |
| Bitstream Encryption | AES-256 + HMAC-SHA256 ensures secure configuration loading and prevents IP theft |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based spectral analysis; GTY transceivers interface with high-speed ADC/DACs and RF SoCs. Use Value: 6,935 DSP slices enable concurrent multi-channel FFTs; 32.75 Gb/s GTY links handle raw IQ data from 16+ antenna elements. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel coding in 5G NR base stations. IC Role / Device Role / Timing Role: Configurable logic implements LTE/5G PHY layer functions; hardened PCIe Gen3 x16 connects to host CPU for control plane offload. Use Value: Partial reconfiguration allows DPD coefficient updates without service interruption; DDR4 controller manages 8 GB of baseband buffer memory. |
| High-Energy Physics DAQ | Financial Market Data Acceleration |
Use Scenario: Trigger-level filtering and zero-suppression in particle detector readout systems. IC Role / Device Role / Timing Role: Low-latency logic processes hit patterns from silicon trackers; GTY transceivers aggregate data from 24 front-end ASICs over backplane links. Use Value: Sub-10 ns deterministic timing enables precise time-of-flight correlation; 72.5 Mb block RAM buffers event windows before compression. | Use Scenario: Latency-critical order matching and risk calculation in ultra-low-latency trading engines. IC Role / Device Role / Timing Role: Hardware-accelerated parsing of FIX/FAST protocols and real-time Monte Carlo simulation kernels. Use Value: 1.1M logic cells implement parallelized matching logic with <500 ns end-to-end latency; PCIe Gen3 x16 enables sub-microsecond host-FPGA communication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVA2104E | Same logic capacity and GTY count, but 2104-ball FCBGA package with different I/O bank arrangement and reduced GTY lane count (16 vs. 24) | Suitable for space-constrained designs where full GTY bandwidth is not required | Select when board layout prioritizes smaller footprint over maximum serial I/O density |
| XCKU085-2FLVA2104E | Lower logic density (820K cells), fewer DSP slices (5,400), and no GTY transceivers (GTH only, max 16.3 Gb/s) | Targeted at mid-range compute acceleration with lower bandwidth interconnect needs | Choose for cost-sensitive applications requiring PCIe Gen3 and DDR4 but not 25G+ serial links |
Compared with XCKU115-2FLVD1517E, the XCKU115-2FLVA2104E offers identical core performance in a denser package but sacrifices GTY lane count and I/O flexibility, while the XCKU085-2FLVA2104E reduces both logic scale and serial bandwidth-making it suitable only where full UltraScale+ GTY capability is unnecessary.
Availability
XCKU115-2FLVD1517E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-energy physics data acquisition requiring stable component supply and long-term program support.
Supply support for XCKU115-2FLVD1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale family delivers optimized performance-per-watt for high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and scientific instrumentation.
FAQ
What is the operating temperature range for the XCKU115-2FLVD1517E?
The XCKU115-2FLVD1517E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is validated under worst-case power and airflow conditions defined in AMD's XCKU115 thermal documentation. Thermal design must account for 27.5 W typical TDP using appropriate heatsinking and PCB copper pour. The XCKU115-2FLVD1517E does not support extended or military temperature grades.
Does the XCKU115-2FLVD1517E support PCIe Gen4?
No, the XCKU115-2FLVD1517E integrates hardened PCIe Gen3 x16 endpoints only. Its GTY transceivers operate up to 32.75 Gb/s but do not meet PCIe Gen4 electrical compliance requirements (16 GT/s with specific jitter and equalization specs). For PCIe Gen4 support, AMD recommends Virtex UltraScale+ or Versal ACAP devices. The XCKU115-2FLVD1517E remains fully compatible with PCIe Gen3 root complexes and switches.
How many DDR4 memory interfaces can the XCKU115-2FLVD1517E support simultaneously?
The XCKU115-2FLVD1517E supports one hardened DDR4 memory controller capable of driving a single 256-bit wide interface at up to 2400 MT/s. It does not support multiple independent DDR4 controllers. The controller includes ECC, address/command parity, and on-die termination calibration. Dual-rank or quad-rank DIMMs are supported via fly-by topology, but all ranks share the same controller instance. The XCKU115-2FLVD1517E cannot manage two separate DDR4 channels.
Is partial reconfiguration supported on the XCKU115-2FLVD1517E?
Yes, partial reconfiguration is fully supported on the XCKU115-2FLVD1517E using AMD Vivado Design Suite. It enables dynamic swapping of logical modules (e.g., filter banks or protocol engines) without resetting the entire device or halting active I/O. Configuration is secured via AES-256 encrypted bitstreams loaded through ICAP or PCIe. The XCKU115-2FLVD1517E implements frame-based reconfiguration with hardware-assisted CRC checking and rollback protection.
What configuration modes are available for the XCKU115-2FLVD1517E?
The XCKU115-2FLVD1517E supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI is the default boot mode with fast read and continuous transfer capabilities. JTAG is used for debugging and boundary-scan testing. Configuration bitstreams may be stored in external flash (x4 or x1 mode) or loaded dynamically via PCIe or ICAP. The XCKU115-2FLVD1517E does not support NAND flash or microSD card boot modes.
XCKU115-2FLVD1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 82920
- Number of Logic Elements/Cells:
- 1451100
- Total RAM Bits:
- 77721600
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU115-2FLVD1517E FAQ
1.How can I place an order for XCKU115-2FLVD1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU115-2FLVD1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU115-2FLVD1517E reliable?
The price and inventory of XCKU115-2FLVD1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU115-2FLVD1517E is usually 5 days.
3.What payment methods are accepted for XCKU115-2FLVD1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU115-2FLVD1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU115-2FLVD1517E?
XCKU115-2FLVD1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU115-2FLVD1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU115-2FLVD1517E?
For technical support, including XCKU115-2FLVD1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU115-2FLVD1517E requirements.
6.How does Aetrix verify that XCKU115-2FLVD1517E is sourced from the original manufacturer or authorized distributors?
All XCKU115-2FLVD1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU115-2FLVD1517E meets industry standards.
7.What is the process for return or replacement of XCKU115-2FLVD1517E?
All XCKU115-2FLVD1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU115-2FLVD1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU115-2FLVD1517E part is unused and in its original packaging.
Return procedure for XCKU115-2FLVD1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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